| 68021-230HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 78511-230HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row,  30 Positions, 2.54 mm Pitch. | PDF |  | 
| 68001-230HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 30  Positions, 2.54 mm (0.100in) Pitch. | PDF |  | 
| 68031-230HLF |  | Amphenol Communications Solutions | BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail. | PDF |  | 
| TM4C1230H6PMI |  | Texas Instruments | 32-bit Arm Cortex-M4F based MCU with 80-MHz, 256-kb Flash, 32-kb RAM, CAN, 64-pin LQFP 64-LQFP -40 to 85 |   |  |