NI/AU TERMINATION Search Results

Contextual Info: 2,8 1,85 37,9 -0,1 19,71 0,22 124967 Galvanisierung: 2-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,65 µm PdNi 0,1 µm Au im Steckbereich 234054 Galvanisierung: 2-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,8 µm Au im Steckbereich Plating: 2-3 µm Ni, 1-2 µm Sn in termination area / 0,65 µm PdNi 0,1 µm Au in mating area

103847

Contextual Info: 2,8 1,85 49,9 -0,1 22 0,22 103847 Galvanisierung: 2-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,65 µm PdNi 0,1 µm Au im Steckbereich 234046 Galvanisierung: 2-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,8 µm Au im Steckbereich Plating: 2-3 µm Ni, 1-2 µm Sn in termination area / 0,65 µm PdNi 0,1 µm Au in mating area

234039

Contextual Info: 2,8 1,85 43,9 -0,1 19,71 0,22 114231 234039 Galvanisierung: 2-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,65 µm PdNi 0,1 µm Au im Steckbereich Plating: 2-3 µm Ni, 1-2 µm Sn in termination area / 0,65 µm PdNi 0,1 µm Au in mating area Galvanisierung: 2-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,8 µm Au im Steckbereich

Contextual Info: FORM REV. 4 WAS T NOTES LMATERIAL HOUSING : LCP Natural UL94-V0 ©CONTACT : Phosphor Bronze Au 0. 1m mMIN. Ouer Ni 1. 27m mMIN. ©GROUND CONTACT : Phosphor Bronze Au 0. 05m mMIN. Ouer Ni 1. 27m mMIN. 2.PACKING : REEL 3.APPLICABLE CABLE 3-1. DESCRIPTION

Contextual Info: 2.50 x 2.00mm 4 PAD Surface Mount Package FCP-10A / E 0.76 NOM. 0.84 MAX. 2.50 1.54 2.00 0.3x45° CHAMFER 1.30 0.58 0.84 Dimensions shown are nominal in millimeters All tolerances are ±0.10mm Body: Al2O3 ceramic Lid: Alloy 42, Au over Ni plated Terminations: Au plating 0.5 – 1.0µm, over a 2 – 6 µm Ni plating

044446

Abstract: UM 66T-05LTO92XPB
Contextual Info: 2,8 1,85 49,9 -0,1 19,71 0,22 394506 Galvanisierung: 1,5-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,65 PdNi 0,1 µm Au im Steckbereich im Tray verpackt 394505 Galvanisierung: 1,5-3 µm Ni, 1-2 µm Sn im Anschlußbereich / 0,8 µm Au im Steckbereich im Tray verpackt

Contextual Info: 2.50 x 2.00mm 6 PAD Surface Mount Package FCP-10D / F 0.76 NOM. 0.84 MAX. 2.50 1.88 0.94 0.50 2.00 1.38 0.25x45° CHAMFER 0.50 Dimensions shown are nominal in millimeters All tolerances are ±0.10mm Body: Al2O3 ceramic Lid: Alloy 42, Au over Ni plated Terminations: Au plating 0.5 – 1.0µm, over a 2 – 6 µm Ni plating

RJ11 6P6C

Abstract: RJ11 jack dimension
Contextual Info: M0DS-D-6PXC-X-N - s 18.10 r TYPE -D 2 .8 0 PDS ITIDNS/CDNTACTS -1 -6P4C: 6 Pos/4 Con -6P6C: 6 Pos/6 Con C^ PLATING -L , 000015' Au -S , 000030' Au -u , 000050' Au (SEE NOTE 2) □PTIDN-Ni No Flange RA TERMINATION -SM: Surface Mount 7 . 87 I

Contextual Info: DAJT3W3 New Filter Connector with Pressfit Contact Termination Materials Shell Steel, tinned Insulator Thermoplastic, flame retardant, black, UL94V-0 Contacts Cu/Zn Contact finish Au/Ni or Au/PdNi Temperature range to DIN IEC 68 part 1 –55/125°C Mechanical Data

Contextual Info: MicroTC A A dvancedMC Backplane C o n n e c t o r s Technical Data Materials Housing material Liquid Crystal Polymer LCP , UL 94-V0 Contact material Copper alloy Mating area Au over Ni Termination Sn over Ni Mechanical and electrical characteristics Current rating (IEC 60512)

capacitor 4700 uf 25v

Abstract: 470 uF 16V Capacitor 4700 50v 16V50V 470 uF 16V Capacitor ceramic
Contextual Info: BROADBAND SINGLE LAYER CAPACITORS KEY FEATURES • • • • • GBBL Dielectric Yields High Volumetric Efficiency Stable Temperature Coefficient: ±15% Max -55°C to 125°C Reduced Microphonics Offered With or Without Borders Thin Film TiW/Au or TiW/Ni/Au Electrodes

NFC93425

Abstract: HE507 L17D479SP L17D*M 21W4 L17D429SP L17DM 17W2 17W5 21W1
Contextual Info: TW Materials and platings Shells Steel-Tin plating Insulators High temperature black thermoplastic Signal contacts Female: machined bronze Material Male: machined brass Plating finish 16µ “Au over 79µ” Ni min. Or 30µ” Au over 79µ” Ni min. Shielded contacts

Contextual Info: TW Materials and platings Shells Steel-Tin plating Insulators High temperature black thermoplastic Signal contacts Female: machined bronze Material Male: machined brass Plating finish 16µ “Au over 79µ” Ni min. Or 30µ” Au over 79µ” Ni min. Shielded contacts

Contextual Info: GBBL Broadband Single Layer Capacitors Key Features • • • • • • GBBL Dielectric Yields High Volumetric Efficiency Stable Temperature Coefficient: ±15% Max -55°C to 125°C Reduced Microphonics Offered With or Without Borders Thin Film TiW/Au or TiW/Ni/Au Electrodes

4700 50v

Abstract: 470 uF 16V Capacitor 2200 uf 16v MARK B05
Contextual Info: GBBL Broadband Single Layer Capacitors Key Features • • • • • • GBBL Dielectric Yields High Volumetric Efficiency Stable Temperature Coefficient: ±15% Max -55°C to 125°C Reduced Microphonics Offered With or Without Borders Thin Film TiW/Au or TiW/Ni/Au Electrodes

Contextual Info: GBBL BROADBAND SINGLE LAYER CAPACITORS Key FeaTuReS • • • • • • GBBL Dielectric Yields High Volumetric Efficiency Stable Temperature Coefficient: ±15% Max -55°C to 125°C Reduced Microphonics Offered With or Without Borders Thin Film TiW/Au or TiW/Ni/Au Electrodes

RJ12 pcb

Contextual Info: REVISION B D nJ DD NOT SCALE FROM THIS PRINT CO PCB L a y o u t Top V¡ 9w M0DS-D-8P8C-X-N -T 18,10 r TYPE -D PDS ITIDNS/CDNTACTS -1 -8P8C: 8 Pos/8 Con (cò PLATING - -L , 000015' Au -S , 000030' Au , 000050' Au (SEE NOTE 2) □PTIDN-Ni No Flange

Contextual Info: ACP-12 SERIES IP68 SEALED 12mm CABLE ASSEMBLY SPECIFICATIONS Mates with: ACR-12 For complete specifications see www.samtec.com?ACP-12 Insulator Material: Thermoplastic Terminal Material: Brass Contact Material: Brass/BeCu Plating: Au over 50p" 1,27pm Ni

Contextual Info: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC

Contextual Info: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC

Contextual Info: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC

Contextual Info: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC

20x9

Contextual Info: tray packaging packaging unit 90 pcs. Verpackt in Tray VPE: 90 Stck. max.138 20 X 9,95 15,5 12,15 max.325 3,7 ±0,3 DETAIL X MAßSTAB 2 : 1 position A 0,5 position E 0,75 position B 3 position C position D 1,2 C D 2-3 µm Ni 1,2 µm Au 2-3 µm Ni 1 µm Sn matt

Contextual Info: ACP-12 SERIES IP68 SEALED 12mm CABLE ASSEMBLY SPECIFICATIONS Mates w ith: ACR-12 For complete specifications see www.samtec.com?ACP-12 Insulator Material: Thermoplastic Terminal Material: Brass Contact Material: Brass/BeCu Plating: Au over 50p" 1,27pm Ni