|
54112-110401600LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54122-110401200LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
54112-110401200LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54112-110401900LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
20021811-04010T1LF
|
|
Amphenol Communications Solutions
|
Minitek127®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch. |
PDF
|
|
