VMIVME-1111
Abstract: vmiVME-2131 neg ja8 rp1 33k VMIVME-1110 VMIVME 2510B CHB49 RP22 1K VMIVME-2130 VMIVME-2510
Contextual Info: VMIVME-1111 64-Bit Differential Digital Input Megamodule Product Manual 256 880-0444 w 12090 South Memorial Parkway Huntsville, Alabama 35803-3308, USA (800) 322-3616 w Fax: (256) 882-0859 500-001111-000 Rev. V COPYRIGHT AND TRADEMARKS Copyright 2002. The information in this document has been carefully checked and is believed to be entirely reliable.
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SMD K2F
Abstract: step down transformer 230 v to 15 v DS3171N BSP19 k117 GR msap smd diode K2F transistor k117 DS3171 DS3172
Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper
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ds3171/ds3172/ds3173/ds3174ds3171ds3172ds3173+11ds3174ds317xds3171nds3172nsmd k2fstep down transformer 230 v to 15 vbsp19k117 grmsapsmd diode k2ftransistor k117
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din en iso 10664
Abstract: BC3107 LM 1011 DS3171N 818E3 smd K2F
Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper
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Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper
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smd K2F
Abstract: smd diode K2F din en iso 10664 J58-J5E K117 datasheet RGC W5 transistor k117 812e3 K117 DS3171N
Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper
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ds3171/ds3172/ds3173/ds3174ds3171ds3172ds3173+13ds3174ds317xds3171nds3172nsmd k2fsmd diode k2fdin en iso 10664j58-j5ek117 datasheetrgc w5transistor k117812e3k117
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Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment
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RELAY RZ2 h12
Abstract: RELAY RZ2 G12 transistor k72 t8 transistor bipolar k72 65 k82 TZ62 rz24 relay K117 datasheet rz2 d12 relay k6f y2
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment
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smd k7a
Abstract: 8000 M KE6 transistor SMD k72 K5C capacitor smd k72 transistor k81 k68 SMD KE6 smd smd K2F k5d transistor smd
Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com The DS3181, DS3182, DS3183, and DS3184 DS318x integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as
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ds3181/ds3182/ds3183/ds3184ds3181ds3182ds3183+13ds3184ds318xds3181/ds3182/ds3183smd k7a8000 m ke6transistor smd k72k5c capacitorsmd k72transistor k81k68 smdke6 smdsmd k2fk5d transistor smd
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Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com GENERAL DESCRIPTION DS3/E3/STS-1 PORTS APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment Routers and Switches
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kda w4
Abstract: 113006 k117 GR transistor k42 THP80 BIPOLAR MOTOROLA k70 RELAY RZ2 G12 msap TBC f54 transistor bipolar k72
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment
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ds3161/ds3162/ds3163/ds3164ds3161ds3161nds3162+16ds3162nds3163ds3163nds3164ds3164nds316xkda w4113006k117 grtransistor k42thp80bipolar motorola k70relay rz2 g12msaptbc f54transistor bipolar k72
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RELAY RZ2 G12
Abstract: rz2 d12 relay RMX911 RELAY RZ2 h12 tr/RELAY RZ2 G12 6F8H RM20 50/RELAY RZ2 h12 din en iso 10664 PTF 10107
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment
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ds3161/ds3162/ds3163/ds3164ds3161ds3162ds3163+12ds3164ds316xrelay rz2 g12rz2 d12 relayrmx911relay rz2 h12tr/relay rz2 g126f8hrm2050/relay rz2 h12din en iso 10664ptf 10107
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transistor SMD k72
Abstract: transistor kA2 smd smd k72 smd K2F JCA Technology low noise amplifier smd k77 k5d transistor smd smd k7a RELAY RZ2 G12 KE6 smd
Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com The DS3181, DS3182, DS3183, and DS3184 DS318x integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as
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ds3181/ds3182/ds3183/ds3184ds3181ds3182ds3183+12ds3184ds318xtransistor smd k72transistor ka2 smdsmd k72smd k2fjca technology low noise amplifiersmd k77k5d transistor smdsmd k7arelay rz2 g12ke6 smd
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RELAY RZ2 g24
Abstract: marking code je8 RZ2 G24 rz2 h24 transistor bipolar k72 6bc6 rz2 d12 relay k117 GR transistor k42 RELAY RZ2 D12
Contextual Info: DS3166/DS3168/DS31612 6/8/12 ATM/Packet PHYs for DS3/E3/CC52 www.maxim-ic.com FEATURES 6 DS3166 , 8 (DS3168), or 12 (DS31612) ATM/Packet PHYs for DS3, E3, or Clear-Channel Up to 52Mbps Each Port Independently Configurable Interfaces to LIUs or SONET/SDH Devices
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ds3166/ds3168/ds31612ds3/e3/cc52ds3166ds3168+15ds3161252mbps12-port32-bit104mhzrelay rz2 g24marking code je8rz2 g24rz2 h24transistor bipolar k726bc6rz2 d12 relayk117 grtransistor k42relay rz2 d12
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transistor SMD K72
Abstract: smd k7a transistor smd k5c k5d transistor smd ka6 transistor smd Y5 smd transistor smd k77 104 k7c rz2 d12 relay K5C capacitor
Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com The DS3181, DS3182, DS3183, and DS3184 DS318x integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as
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ds3181/ds3182/ds3183/ds3184ds3181ds3182ds3183+14ds3184ds318xds3181nds3182ntransistor smd k72smd k7atransistor smd k5ck5d transistor smdka6 transistor smdy5 smd transistorsmd k77104 k7crz2 d12 relayk5c capacitor
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B083D
Abstract: u82720 A110D TDA4100 ub8830d V40511D taa981 A109D sy 710 IC 7447
Contextual Info: > i ! U O i j q > i a | a S [ ^ ] 0 [ y y H erstellerbetriebe Bei den einzelnen Erzeugnissen werden die Herstellerbetriebe durch die nachfolgend angegebenen Symbole gekennzeichnet: VEB M ik ro e le k tro n ik „K a rl M a r x “ Erfurt L e itb e tr ie b im VEB K o m b in a t M ik ro e le k tr o n ik
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M30218
Abstract: 052b16 CM06 05A11
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp. The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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M30218
Contextual Info: Mitsubishi microcomputers M30218 Group Description SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description The M30218 group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP. These
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M30218
Abstract: 05A31 DF0001
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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M30218
Contextual Info: n er me nd lop U e v de t Tentative Specifications REV.A1 Description Mitsubishi microcomputers Specifications in this manual are tentative and subject to change. M30218 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description The M30218 group of single-chip microcomputers are built using the high-performance silicon gate CMOS
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M30218
Abstract: 05B61
Contextual Info: n er me nd lop U e v de t Preliminary Specifications REV.A1 Description Mitsubishi microcomputers Specifications in this manual are tentative and subject to change. M30218 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description The M30218 group of single-chip microcomputers are built using the high-performance silicon gate CMOS
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ICAN-6267
Abstract: ICAN-6739 CD4025AE vacuum tube applications data book ICAN-6716 CD4061AD transistor bf 175 CD4040AF ican 6539 CD4059AD
Contextual Info: mItC J I COS/MOS Integrated Circuits This D A TA B O O K contains complete data and related application notes on COS/MOS digital integrated circuits presently available from RCA Solid State Division as standard products. For ease of type selection, functional diagrams are shown
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CSI021
Abstract: cm15 jv capacitor LT 5216 153 SP-J BV EI 301 0546 fl016 052416 dm 0565 TA3M 100P6S-A
Contextual Info: <* ^>0^ Tentative Specifications REV.A ^ _ . . r . e s c r ip tio n . Mitsubishi microcomputers Specifications in this manual are tentative and subject to change. M 3 0 2 1 8 G r O lip SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description The M30218 group of single-chip microcomputers are built using the high-performance silicon gate CMOS
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