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L17HTNAS3F1C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp Std Density, FP=8.08mm (.318in), 15 Socket, Bright Tin Shell, Flash Gold, M3 Removable Front Screwlock, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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L17HTNAS3F4C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp Std Density, FP=8.08mm (.318in), 15 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, M3 Removable Front Screwlock, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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L17HTNAS3F2C
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Right Angle PCB Thru Hole, High Temp Std Density, FP=8.08mm (.318in), 15 Socket, Bright Tin Shell, 0.38um (15u\\) Gold, M3 Removable Front Screwlock, Ground Tab& Boardlock, Plastic Tray, Closed Back |
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10127820-1021GLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing. |
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10127820-1022GPLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing, With Pegs. |
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