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54112-110402100LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10131319-2222100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10131318-1012100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 10 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10131319-0812100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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10131319-1812100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing. |
PDF
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