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TPD2017FN
|
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Toshiba Electronic Devices & Storage Corporation
|
Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30 |
Datasheet
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67292-017LF
|
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
PDF
|
|
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59112-T40-20-171LF
|
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Amphenol Communications Solutions
|
Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Through Hole - Double row - 40 Positions - 2mm (0.079inch) - Vertical. |
PDF
|
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54242-108201750LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
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75844-201-72LF
|
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Amphenol Communications Solutions
|
BERGSTIK |
PDF
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