MSI NICHROME RESISTOR Search Results

Contextual Info: MSTF-4 SERIES MECHANICAL DATA SIZE SUBSTRATE RESISTOR BONDING PADS .040" x . 0 4 0 " x . 0 1 0 " + .0 03" SILICON, QUARTZ. OR GLASS NICHROME OR TANTALUM NITRIDE 15.000 MINIMUM GOLD 10.000 À MINIMUM ALUMINUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL A BACKSIDE SURFACE

Contextual Info: THIN FILM CHIP RESISTOR MSTF 1 SERIES 0.015" Sq. MECHANICAL DA TA DAT 0.010" SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS 0.015" x 0.015" x 0.010" ±0.003" SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

sn5001

Abstract: Mini-Systems MSI nichrome resistor
Contextual Info: THIN FILM CHIP RESISTORS MSTF-2 SERIES M ECHANICAL DATA .020" X . 020" X . 0 10 " ±.003" ' SILICON, ALUM INA, QUARTZ, OR GLASS NICHROME OR TANTALUM NITRIDE 15,000 A MINIMUM GOLD 10,000 A MINIMUM ALUM INUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL SIZE

Contextual Info: THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE CHIP RESISTORS 0.020" 0.020" x 0.020" ±0.003" x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT

MSTF

Contextual Info: CENTER TAPPED CHIP RESISTORS MSTF 3 SERIES *ID BAR MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.030" 0.030" x 0.030" ±0.003" x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

Contextual Info: THIN FILM CHIP RESISTOR MSMR1 SERIES 0.009" 0.012" MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS 0.012" x 0.009" x 0.006" ±0.001" (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

Contextual Info: THIN FILM CHIP RESISTOR MSTF 1 SERIES 0.015" Sq. MECHANICAL DA TA DAT CHIP RESISTORS 0.010" SIZE SUBSTRA TE SUBSTRATE RESISTOR BONDING P ADS PADS 0.015" x 0.015" x 0.010" ±0.003" (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT ANT ALUM NITRIDE

Contextual Info: THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT 0.020" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.020" x 0.020" ±0.003" x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

Contextual Info: THIN FILM CHIP RESISTORS MSTF 2 SERIES MECHANICAL DA TA DAT 0.020" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.020" x 0.020" ±0.003" x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

MSI nichrome resistor

Contextual Info: CENTER TAPPED CHIP RESISTORS MSTF 3 SERIES *ID BAR MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.030" 0.030" x 0.030" ±0.003" x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD

Contextual Info: CENTER TAPPED CHIP RESISTORS MSTF 3 SERIES *ID BAR CHIP RESISTORS MECHANICAL DA TA DAT 0.030" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS 0.030" x 0.030" ±0.003" x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT ANT ALUM NITRIDE

Contextual Info: CENTER TAPPED CHIP RESISTORS MSTF 3 SERIES *ID BAR CHIP RESISTORS MECHANICAL DA TA DAT 0.030" 0.030" x 0.030" ±0.003" x 0.010" (±0.003") (S)SILICON, (A)ALUMINA, (Q)QUARTZ, OR (G)GLASS NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL

WATF-1-A-N-50-01-T

Contextual Info: THIN FILM SURFACE MOUNT RESISTORS WATF SERIES MECHANICAL DATA SERIES WATF-1 SERIES WATF-2 SERIES WATF-3 SERIES WATF-4 SERIES WATF-5 SERIES WATF-6 SERIES WATF-7 SERIES WATF-8 SERIES WATF-9 SERIES SUBSTRATE RESISTOR BOND PADS AND WRAPAROUND TERMINATIONS W L

MSDR

Contextual Info: THIN FILM DUAL RESISTOR NETWORKS MSDR 3 SERIES *ID BAR The MSDR series dual center -tapped chip resistor offers the high stability .C.R./T .C. center-tapped stability, low noise, and low TT.C.R./T .C.R./T.C. tracking of thin film while providing greater flexibility in hybrid designs.

Contextual Info: DUAL ISOLATED THIN FILM NETWORKS MSIR 3 SERIES *ID BAR The MSIR series dual isolated chip resistor offers greater flexibility for the hybrid designer seeking resistor pairs with excellent TT.C.R./T .C.R./T .C. tracking between resistors. .C.R./T.C. MECHANICAL DA

Contextual Info: THIN FILM SURFACE MOUNT RESISTORS WATF SERIES MECHANICAL DA TA DAT W T L Full Wrap Around W SERIES WATF - 1 WATF - 2 WATF - 3 WATF - 4 WATF - 5 WATF - 6 WATF - 7 WATF - 8 WATF - 9 SUBSTRA TE SUBSTRATE RESISTOR BOND PADS AND WRAPAROUND TERMINA TIONS TERMINATIONS

Mini-Systems

Contextual Info: THIN FILM SURFACE MOUNT RESISTORS WATF SERIES MECHANICAL DA TA DAT W T L Full Wrap Around W L T W 0.040" x 0.020" x 0.010" 0.035" x 0.035" x 0.010" 0.075" x 0.050" x 0.010" 0.050" x 0.050" x 0.010" 0.126" x 0.063" x 0.010" 0.100" x 0.050" x 0.010" 0.020" x 0.020" x 0.010"

X 0040 ta

Contextual Info: THIN FILM SURF ACE MOUNT RESISTORS SURFACE W ATF SERIES MECHANICAL DA TA DAT CHIP RESISTORS W T L Full Wrap Around SERIES WATF WATF WATF WATF WATF WATF WATF WATF WATF WATF L 0.040" 0.035" 0.075" 0.050" 0.126" 0.100" 0.020" 0.055" 0.153" 0.020" - 1 - 2 - 3

Contextual Info: DUAL ISOLATED THIN FILM NETWORKS MSIR 3 SERIES *ID BAR The MSIR series dual isolated chip resistor offers greater flexibility for the hybrid designer seeking resistor pairs with excellent TT.C.R./T .C.R./T .C. tracking between resistors. .C.R./T.C. MECHANICAL DA

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT 0.035" SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

MSDR

Contextual Info: THIN FILM DUAL RESISTOR NETWORKS MSDR 3 SERIES *ID BAR The MSDR series dual center -tapped chip resistor offers the high stability .C.R./T .C. center-tapped stability, low noise, and low TT.C.R./T .C.R./T.C. tracking of thin film while providing greater flexibility in hybrid designs.

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

Contextual Info: THIN FILM RESISTORS MSTF 35 WIRE BONDABLE MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BOND PAD SIZE BACKSIDE SURFACE 0.035" x 0.035" x 0.010" ±0.003" 99.6% ALUMINA, QUARTZ, GLASS (BeO OR AlN AVAILABLE) NICHROME, TTANT ANT ALUM NITRIDE, SICHROME

Contextual Info: THIN FILM SURF ACE MOUNT RESISTORS SURFACE W ATF SERIES MECHANICAL DA TA DAT CHIP RESISTORS W T L Full Wrap Around SERIES WATF WATF WATF WATF WATF WATF WATF WATF WATF WATF L 0.040" 0.035" 0.075" 0.050" 0.126" 0.100" 0.020" 0.055" 0.153" 0.020" - 1 - 2 - 3