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    MRF*5160 Search Results

    MRF*5160 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-105160850LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch. PDF
    75160-332-06LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,6 position, 2.54mm pitch PDF
    75160-318-36LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch PDF
    75160-150-03LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,3 position, 2.54mm pitch PDF
    75160-101-09LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,9 position, 2.54mm pitch PDF

    MRF*5160 Datasheets (1)

    Others
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    MRF5160
    Unknown Shortform IC and Component Datasheets (Plus Cross Reference Data) Short Form PDF 82.91KB 1