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    MPA-MIC/06/1574 Search Results

    MPA-MIC/06/1574 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    69157-416HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. PDF
    69157-438HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch. PDF
    69157-458HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in) Pitch. PDF
    69157-404HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch. PDF
    69157-426HLF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch. PDF