MOUNTING OF SURFACE MOUNT COMPONENTS Search Results

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Contextual Info: SURFACE MOUNT COMPONENTS Introduction Fabrication considerations Surface-mounting of components saves critical space on the circuit board, can result in more reliable circuits and systems, and can reduce the cost of production through automated circuit fabrication. Since circuit

Contextual Info: SURFACE MOUNT COMPONENTS Surface-mounting of components saves critical space on the circuit board, can result in more reliable circuits and systems, and can reduce the cost of production through automated circuit fabrication. And since circuit densities are increasing as more

Fuses 202

Contextual Info: Surface Mount Fuses Subminiature Surface Mount & Dip Types FLAT-PAK Fast Acting Fuse 202 Series ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak® Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting.

003G

Contextual Info: SURFACE MOUNT FUSES SUBMINIATURE SURFACE MOUNT & DIP TYPES FLAT-PAK Slo-Blo® Fuse ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting. These fuse

GL521

Abstract: GP1U101X GP1U102X GP1U107X GP1U10X GP1U90X PD49PI home appliances with remote control T430
Contextual Info: GP1U10X Series GP1U10X Series Compact, Surface Mount and Reflow Soldering Type IR Detecting Unit for Remote Control • Features ■ Outline Dimensions 1. Compact and surface mount type Mounting area : 4/5 compared with GP1U90X (0.9 ) Detector center as a result of adoption of built-in constant voltage circuit

S2082

Abstract: Soldering guidelines pin in paste CR-14 gold embrittlement
Contextual Info: S2082 Surface Mounting Instructions CR-9, 11, 12, 13, 14 Ceramic 16 and 24 PIN Packages Board and Solder Footprint Guidelines Application Note Recommended Mounting Solder footprints Cont’d For optimal performance of surface mount switches and attenuators in ceramic packages, grounding is critical. The

1206 pads layout

Abstract: 1812 pads layout IPC-SM-782
Contextual Info: TECHNICAL INFORMATION SOLDER PAD GEOMETRY STUDIES FOR SURFACE MOUNT OF CHIP CAPACITORS* Kent Wicker & John Maxwell AVX Corporation Corporate Research Laboratory P.O. Box 867 Myrtle Beach, SC 29577 Abstract: Solder pad geometry for surface mounting chip capacitors were

Contextual Info: Surface Mounting Instructions M538 V4 Footprint Guidelines Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the

ECF564A

Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Contextual Info: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output

HSMD-C660

Abstract: HSMG-C660 HSMH-C660 HSMS-C660 HSMY-C660
Contextual Info: Agilent HSMx-C660 Right Angle Surface Mount Chip LEDs Data Sheet Features • Right Angle Mounting • Compatible with IR Reflow Soldering Process • Available in a Wide Variety of Colors • Available in 8 mm Tape on 178 mm 7" Diameter Reels Description

2225 capacitor footprint dimension

Abstract: ipc-SM-782 IPC-SM-782 0805 2211 size footprint 0603 footprint IPC 1206 footprint IPC ceramic capacitor footprint 0402 dimension 1825 footprint dimension 3530 novacap 0402 capacitor ipc-SM-782
Contextual Info: Ceramic Surface Mount Mounting Pad Dimensions and Considerations The objective of this document is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be extended to all NOVACAP standard and non-standard part sizes including assumptions for pick & place

Contextual Info: 194D www.vishay.com Vishay Sprague Solid Tantalum Chip Capacitors, TANTAMOUNT , Conformal Coated FEATURES • 8 mm, 12 mm, 16 mm tape and reel packaging available per EIA-481 and reeling per IEC 60286-3, 7" [178 mm] standard • Mounting: Surface mount • Material categorization: For definitions of

Panasonic Selection Guide 2012

Contextual Info: ＳＵＲＦＡＣＥ ＭＯＵＮＴ ＲＥＳＩＳＴＯＲＳ ＴＥＣＨＮＩＣＡＬ ＧＵＩＤＥ Ver.3 Circuit Components Business Division Automotive & Industrial Systems Company Panasonic Corporation TECHNICAL GUIDE Ver.3 Contents 1. First:

32.768 khz crystal 5ppm

Abstract: ISO-14001 RC-1009B VT-200 Quartz Crystals 1MHz overtone SPT1A Specification Quartz Crystals 1Mhz sii Product Catalog
Contextual Info: Quartz Crystals Product Catalog Components Headquaters Product Catalog CMOS IC Quartz Crystals Micro Batteries Fiber Optics MATERIALS Liquid Crystal Display Custom LCD Module Contents [Quartz Crystal Units] Quartz Crystal Unit Handling Precautions . 3

4116r resistor pack

Abstract: bourns fuel card chip resistors bourns bourns torque angle sensor 0201-size Battery chargers for portable dvd china rs485 fuel level sensor "steering Angle Sensor" chassis PT90 bourns 3549
Contextual Info: Bourns Product Profile Automotive Sensors Circuit Protection Solutions Magnetics Products Microelectronic Modules Precision Potentiometers Panel Controls & Encoders Resistive Products Bourns® Product Profile Table of Contents Components Trimpot® Trimming

light switch

Abstract: SKPGAAE010 carbon DETECTOR CIRCUIT DIAGRAM Surface Mount Type Slide Switch EC-19S-8 tamura EC-19S-8 SURFACE MOUNT TYPE
Contextual Info: TACT SwitchTM High Operation Force with 5mm Height Surface Mount Type SKPG Series Low-profile surface mount type with high operation force most suitable for in-car components. Detector Push Slide Rotary Encoders Power Product Line Dual-in-line Package Type

CMMR1U-02

Abstract: CMMR1U-04 CMMR1U-06
Contextual Info: CMMR1U SERIES SURFACE MOUNT ULTRA FAST RECOVERY SILICON RECTIFIER 1 AMP, 200 THRU 600 VOLTS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMMR1U Series are high quality 1.0 Amp Surface Mount Silicon Rectifiers, well constructed, highly reliable components

Duplexers

Contextual Info: I §• SPECTRUM CONTROL INC- ■II . Spectrum Control duplexers are designed using the same tools and components as the BP Series bandpass filters. Duplexers are available in the same thru-hole and surface mount package designs. Spectrum duplexers allow for a

Melf composition

Contextual Info: Recommended Soldering Techniques Recommended Soldering Techniques by David B. Hutchins, Senior Applications Engineer Introduction The soldering process is the means by which electronic components are mechanically and electrically connected into the circuit assembly. Adhering to good soldering practices will preserve the inherent reliability of the original

Contextual Info: SSESD11B Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD11B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that

metal film fused resistor 47 ohm

Abstract: microcircuit catalog 48 VOLT 120 AMP smps Micro-D connectors 56FU04-017 Pi tubular capacitor RF Power Feed-Through Capacitors with Band Conductor, Class 1 Ceramic marking E01 sci-r2130 Pi capacitor tubular
Contextual Info: Spectrum Control Short Form Catalog Spectrum Control Innovative Solutions from Components to Complex Assemblies Spectrum Control was founded in 1968 as a designer and manufacturer of custom application-specific solutions to suppress or eliminate Electromagnetic Interference EMI .

TVS 0201 Diode

Abstract: PNC0106A 024 marking bidirectional diode
Contextual Info: ESD11N5.0ST5G Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD11N is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage,

024 marking bidirectional diode

Abstract: laptop pcb circuits smd diode marking coding smd diode marking code 0s
Contextual Info: ESD11B5.0ST5G Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection The ESD11B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that