MMC VERSION 4 Search Results

SDHC specification

Abstract: SD host controller vhdl tsmc 0.18um GPS clock code using VHDL GPS clock code using verilog vhdl code for memory card digital clock using logic gates sdio sdio memory silicon fingerprint technology
Contextual Info:  Compatibility  SD Memory Card version 2.00 including SDHC SDIO-HOST  SDIO Card version 2.00 SD/SDIO/MMC Card Host Controller Core  SDIO Host Specification ver-  MMC Card version 3.31 sion 1.00  General SD interface features  SD1/SD4 modes of operation

capacitor 103 250v

Abstract: Lbn45.75 PM1-M1.75 BT-N51KRI-LC4.75 capacitor+63v+1000+micro+f
Contextual Info: MMC Dimensions MMC Character NISSEI METALLIZED POLYESTER FILM CAPACITOR Type MMC Features Smaller version of MMH type. Very small size, achieved by our unique manufacturing method. Highly reliable because of its self-healing performance. Uniform flame retardant epoxy resin coating through the latest resin technology.

MMC specification

Abstract: CMD19 CMD55 CMD14 MMC card USB reader CMD13 cmd6 MMC version 4 CMD8
Contextual Info: SEC-FAE-APP-001 High Speed Mode Setting Sequence for the MMC spec 4.X card Application Note July-2006, Version 1.0 1. High Speed Mode Setting Issue Normal MMC operates under 20 MHz and can operate 1 bit data, but High Speed MMC can operate from 0 to 52 MHz. Also it can operate 1 bit to 8 bit data

HBM 00-01H

Abstract: HE11020F mmc sd 2001 MMC version 2.11 LQFP80 MMC specification version 1.4
Contextual Info: HE11020F Confidential 2001 / 7 / 17 version 0.96 USB to ATA/ATAPI/SD/MMC Interface Controller 1 General Description This chip provides a high-performance interface to bridge USB and ATA/ATAPI/SD/MMC compliance device, therefore, it could be used to connect IDE hard disk, CD-ROM, CD-RW, Compact Flash card, MMC or SD

mmc_write

Abstract: onenand xsr SAMSUNG NAND FTL KFAT XSR Porting Guide SAMSUNG NAND FLASH TRANSLATION LAYER samsung xsr abstract fore system m.a hindi K9K2G16U0M
Contextual Info: TFS4 Porting Guide 2007.08.16 , Version 1.4.2 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC(or HSMMC) host device driver.

samsung tfs4

Abstract: samsung xsr Flash Translation Layer XSR Extended Sector Remapper XSR Porting Guide onenand xsr FAT32 NAND XSR SAMSUNG NAND FLASH TRANSLATION LAYER S3C2410
Contextual Info: TFS4 v1.5.0 Porting Guide 2006.05.02 , Version 1.5.0 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.

samsung xsr

Abstract: FAT32 SAMSUNG NAND FTL XSR Porting Guide onenand xsr samsung tfs4 Nucleus RTOS 0x00000025 samsung sector remapper SAMSUNG NAND FLASH TRANSLATION LAYER
Contextual Info: TFS4 v1.6 Porting Guide 2006.05.29, Version 1.6 Note TFS4 is independent of XSR. Here we assume that XSR or MMC or HSMMC host device driver is already ported to your target system. This TFS4 porting guide covers only TFS4 porting procedure, neither XSR nor MMC (or HSMMC) host device driver.

Contextual Info: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 2 1 08/2001 0.50 First published. 4/26/2005 0.6 Added lead free package W86L388-DG in ordering information 3 4

emmc 4.4 standard jedec

Abstract: GLS85VM1008A-M-I-LFWE-ND200 Specification eMMC 4.0 emmc bga eMMC data retention BGA EMMC
Contextual Info: GLS85VM1008A / 1016A / 1032A Industrial Temp eMMC NANDrive Fact Sheet 01.000 March 2013 Features • Industry Standard Embedded MultiMediaCard eMMC Host Interface - JEDEC/MMC Standard Version 4.4 JESD84-A44 compliant - Backward compatible with eMMC 4.3

K9F1G08U0A

Abstract: SAMSUNG 413 K9F1G08U0M SAMSUNG 413 K9K1G08U0A 48-LQFN 2936A K9F5608U0C Flash Memory mmc "Flash Memory select" CSDN cdi schematics
Contextual Info: W86L157 WINBOND MMC CARD CONTROLLER -I- Publication Release Date: December 2, 2004 Revision 0.7 W86L157 Preliminary Revision History VERSION ON WEB PAGES DATES VERSION 1 - 2/2004 0.5 First published. 2 16 4/6/2004 0.6 Add 48-pin LQFN package 3 18, 19 12/2/2004

48-PIN

Abstract: FR30 GIO10 W86L488 W86L488AY W86L488Y ase qfn 48
Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 08/2002 0.50 First published. 2 12/2002 0.60 Add QFN package. Main Contents 1.Modify pin function of CLK, ACLK,

DIM200PHM33-A000

Contextual Info: DIM200PHM33-A000 DIM200PHM33-A000 Half Bridge IGBT Module Replaces October 2001, version DS5464-4.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates APPLICATIONS

"MMC CARD COMMANDS"

Abstract: 48-PIN FR30 GIO10 W86L488 W86L488AY W86L488Y MMC Electronics America CSD1146
Contextual Info: Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 Aug. 2002 0.50 First published. 2 Dec. 2002 0.60 Add QFN package. 3 P6, P8, P10, P11, P24, P25, P26, P41, P42,

W86L388

Abstract: 23GIO 48-PIN NDS352P W86L388D do-15 footprint sd5d14 MMC Electronics America
Contextual Info: W86L388D Winbond Host Interface SD/MMC Memory Card Bridge W86L388D Data Sheet Revision History Pages Dates Version Version Main Contents on Web 1 08/2001 0.50 First published. 2 3 4 5 6 7 8 9 10 Please note that all data and specifications are subject to change without notice. All the trademarks of

DIM800NSM33-A000

Contextual Info: DIM800NSM33-A000 DIM800NSM33-A000 Single Switch IGBT Module Replaces May 2002, version DS5486-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5486-4.1 June 2002

DIM800DDM17-A000

Contextual Info: DIM800DDM17-A000 DIM800DDM17-A000 Dual Switch IGBT Module Replaces March 2002, version DS5433-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5433-4.1 July 2002

Contextual Info: DIM400GDM33-A000 DIM400GDM33-A000 Dual Switch IGBT Module Replaces December 2001, version DS5495-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5495-4.0 May 2002

DIM2400ESM17-A000

Contextual Info: DIM2400ESM17-A000 DIM2400ESM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5447-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5447-4.1 July 2002

DIM400GDM33-A000

Contextual Info: DIM400GDM33-A000 DIM400GDM33-A000 Dual Switch IGBT Module Replaces June 2002, version DS5495-4.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5495-5.1 June 2002

ic 7494

Abstract: DIM400GDM33-A000
Contextual Info: DIM400GDM33-A000 DIM400GDM33-A000 Dual Switch IGBT Module Replaces May 2002, version DS5495-4.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5495-4.1 June 2002

DIM2400ESM17-A000

Contextual Info: DIM2400ESM17-A000 DIM2400ESM17-A000 Single Switch IGBT Module Replaces March 2002, version DS5447-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5447-4.1 July 2002

dc to dc chopper using igbt

Abstract: DIM800DCM17-A000
Contextual Info: DIM800DCM17-A000 DIM800DCM17-A000 IGBT Chopper Module Replaces issue March 2002, version DS5444-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5444-4.1 July 2002

DIM400DDM17-A000

Contextual Info: DIM400DDM17-A000 DIM400DDM17-A000 Dual Switch IGBT Module Replaces March 2002, version DS5449-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5449-4.1 July 2002

DIM1200ESM33-A000

Contextual Info: DIM1200ESM33-A000 DIM1200ESM33-A000 Single Switch IGBT Module Replaces May 2002, version DS5492-3.0 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5492-4.0 June 2002