BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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Original
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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PDF
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QFN PCB Layout guide
Abstract: MLF24 DG-QFN24C-01
Contextual Info: Top View GHz QFN Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable connection Minimum real estate required Compression plate distributes forces evenly 12.225mm IC guide prevents over compression of elastomer
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Original
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225mm
DG-QFN24C-01
MLF24C
QFN PCB Layout guide
MLF24
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PDF
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MLF24
Abstract: SG-MLF-7003
Contextual Info: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 12.225mm IC guide prevents over compression of elastomer
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Original
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225mm
esLF24C
MLF16B
MLF12C
MLF28E
MLF28D
MLF20A
SG-MLF-7003
MLF24
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PDF
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