MJG 2 Search Results

Diode HA7

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 1996 2 21-FEB-1996 RELEASED FOR PUBLICATION LOC E ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. 1 REVISIONS DIST B P D LTR DESCRIPTION DATE DWN APVD G ECR-07-015707 13/06/07 MJG JA H ECR-10-010252 24/05/10

Contextual Info: Denex #3 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN A DENEX #3 INSTALLATION: • CSM-1 Degreaser or GC-6 Isopropyl Alcohol  Silicon Carbide Paper  M-Prep Conditioner A  M-Prep Neutralizer 5A  MJG-2 Mylar Tape  TFE-1 Teflon® Film

Diode HA7

Contextual Info: 4 3 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 19 96 BY AMP INCORPORATED. ,19 . 21-FEB 2 96 LOC E ALL RIGHTS RESERVED. 1 REVISIONS DIST - P LTR D DESCRIPTION DATE ECR-10-010252 DWN APVD MJG JA 24/05/10 D D INSULATED SHORTING LINK POLARIZING SLOT

108-10042

Abstract: 1-163082-0 A200779
Contextual Info: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C 2 1 2011 LOC REVISIONS DIST B ALL RIGHTS RESERVED. - COPYRIGHT 2011 3 - P LTR DESCRIPTION AD DATE ECR-12-010700 DWN MJG 11/06/12 APVD DP 31.5 B D D A PIN BODY SEE TABLE PLATING ZONES SPRING ZONE 3 9

108-10042

Abstract: ECR12
Contextual Info: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C 3 1 2011 LOC REVISIONS DIST AI ALL RIGHTS RESERVED. - COPYRIGHT 2011 2 - P LTR DESCRIPTION H DATE ECR-12-010700 DWN MJG 11/06/12 APVD DP 33 D D SPRING PIN BODY SEE TABLE PLATING ZONES B ZONE 3 A ZONE 1

1-163082-0

Abstract: 1-163081-1 108-10042
Contextual Info: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C 3 1 2011 LOC REVISIONS DIST B ALL RIGHTS RESERVED. - COPYRIGHT 2011 2 - P LTR DESCRIPTION AY DATE ECR-12-010700 DWN MJG 11/06/12 APVD JB 31.5 SPRING PIN BODY SEE TABLE D B 9 D A PLATING ZONES ZONE 3

164164-1

Abstract: 164164-2
Contextual Info: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C 3 1 20 LOC B ALL RIGHTS RESERVED. BY - COPYRIGHT 20 2 REVISIONS DIST E P LTR DESCRIPTION M DATE ECR-12-010700 DWN MJG 11/06/12 APVD DP 33 D D 1.6 PLATING ZONES ZONE 3 ZONE 2 ZONE 1 11.7MIN 1.5 A B 5.8

u6 ek

Abstract: b555c MMI3
Contextual Info: =;E01 EB?>9 EF7F: D:?7J ;OLZ[XOY _ x@<C<:KI@: JKI<E>K? miii3 _ -?FKF @JFC8K@FE z@C< +Fs yjlmnjp _ 7<IF :IFJJ FI I8E;FD KLIEfFE _ /<DFM89C< =@E><I GIFF= :FM<I 8M8@C89C< z@C< +Fgs /nijoolkq _ xFL9C< 0w/ uw FLKGLK _ -8E<C DFLEK _ xw FI uw :FEKIFC _ yEM@IFED<EK8C =I@<E;CP GIF;L:K

Contextual Info: 25/07 '97 Ü0 NOT SCALE DIMENSIONS IN MMt S. C1 50545. COK FJW SH MATERIAL PAftT NUMBER C.A.D. FILE @002 AMP OF GB 01081 954 7403 08:01 PAPER INTERLEAVED NO •150545-1 150545-2 150545-3 75 0 5 -40 4 BRASS BRASS NONE BRASS P R E TIN. O B SO LE T E B R A 5 O

J 3305

Abstract: EX39 C1348-1
Contextual Info: THIS INFORMATION IS CONFIDENTIAL AND PROPRIETARY TO TYCO ELECTRONICS CORPORATION AND ITS WORLDWIDE SUBSIDIARIES AND AFFILIATES. IT MAY NOT BE DISCLOSED TO ANYONE, DWG NO OTHER THAN TYCO ELECTRONICS PERSONNEL, WITHOUT WRITTEN AUTHORIZATION FROM TYCO ELECTRONICS CORPORATION,

ul 94 v2

Contextual Info: TH I S DRAW I NG IS UNPUBLI S HE D. C O P Y RI G HT 20 RELEASED BY TYCO ELECTRONICS CORPORATION. F OR ALL PUBLICATION R 1G H T S 20 LOC RE V I S I ONS D I ST RESERVED. LTR DESCR I PTION E C R - 0 9 - 0 I I 60 I AU 3.25 . 1 OF A 24.26 c /2\ 0.76 •^3- /3\

Contextual Info: MO. I R E V IS IO N S MOOOC *~xa ATT o • » ’ ■. • . ✓> Arf" A ^ V -V ^ A v j? * 1 » « V . /» < T 4 * , A *J s Z 3 A U 0 79 t ^ * ■ '■•'•+* .*> JJ . - . " kU' • V '-X w ■ a S * c ii5 ? I 33 sd* H . - • \ sttq/^ p '/r/v o s w c

MJHS-V-88-30

Abstract: MJLS-S-88-STP-30 T1 8P10C diode Catalog 164602 RJ45 1x4 jack low profile connector MJLS-88-30 "Power over LAN" rj45 JACK ultra low profile MJDS-LG5-88-2-30
Contextual Info: Modular Jacks Catalog MCMJ74a 05/03 Edition 2 www.erni.com Contents The Acquisition of Maxconn Incorporated 2 Modular Jack Technology 3 Product Overview 4 Applications 5 Modular Jack Shield Ground Tab Options 6 Modular Jack Panel Flange Options 6 MJE Series: Right Angle Modular Jacks with LED Introduction

Contextual Info: 10 C fo^lu •Y ■Z SEC TIO N Z-Z SEC TIO N Y-Y FPC (2 .2 8 ) (1.8) \ 6 / I 1.D5 IS) /' 0 V> A • LdtttSE UL94V-0 HOUSING MATERIAL :HEAT RESISTANT POLYMER BLACK UL94-V0 2. ERR 2 - a. ±7 • • ■IT7A ; sHEdl ODD TERMINAL MATERIAL TOPPER ALOY :»S : -7 ±7Tffl8SS327 7 4= ( ggJSISKV 7-786 )

TC8705

Abstract: TSC8705CJ TC8705CPG
Contextual Info: T E L ED Y N E 3bE D COMPONENTS • fl'ilTbOE 0 0 0 7 2 4 0 b T WTELEDYNE COMPONENTS 5 M 0 - O . TC8702 TC8704 TC8705 BINARY OUTPUT ANALOG-TO-DIGITAL CONVERTERS FEATURES Latched Parallel Binary Outputs Three-State, Bus Compatible Outputs TC8704 and TC8705

MIL-PRF-38535

Abstract: QML-38535 MIL-PRF38535 MILPRF38535
Contextual Info: \ i u n n s t sww CWTU.C0LUM8« f-r O - :- <L> MIL-PRF-38535 CUSTOM MICROCIRCUIT CERTIFICATION FOR CLASS Q and V IS HEREBY AWARDED TO TEMIC SEMICONDUCTORS M H S S.A. BP 70602 la C h an trerie 44306 N antes Cedex 3 France ALL DESIGN. WAFER FABRICATION, ASSEM BLY AND TEST SHALL BE IN ACCORDANCE W ITH MTL-PRF-38535 AND THE

Contextual Info: 4 T H IS D R A W ING C 3 IS U N P U B L I S H E D . RELEASED C O P Y R I G H T I9 9 4 BY TYCO FOR E L E C T R O N IC S C O R P O R A T I O N . May PUBLICATION ALL R 1^ H T S 16 1994 LOC D IS T R E V IS I ONS RESERVED. EC R - 0 7 - 0 I 5 3 7 0 : - - : 0 .7

BZW04-12B

Abstract: BZW04-19B J-131 BZW04-5V5 BZW04-5V5B BZW04-5V8 BZW04-5V8B BZW04-6V0 BZW04-6V0B BZW04-6V4
Contextual Info: transient voltage suppressors «TRANSI!» diodes de protection «TRANSIL» Types •RM @ V r M Unidirectional | Bidirectional 150 W / fcAl / min @ I nom ■r | max ] mA i • V(BR)* (V) trt.P IÏIS 0^ Z (VI min nom @ max Ir V<CL) @ Ipp max 1 ms expo (V) J (A)

h51 diode

Contextual Info: ERB44 ia  jÈ S S S f t ^ V i—K • W fé '+ fè : Outline Drawings FAST RECOVERY DIODE ■ ¡E H I : Features :7jv : Marking High voltage by mesa design. • ftflM R tt # 7 - 3 - K: m High reliability Color code : Green ■ E J ii : Applications Abridged type name

BZW04-12V5

Abstract: BZW04-6V0 BZW04-6V6 BZW04-5V5 BZW04-5V5B BZW04-5V8 BZW04-5V8B BZW04-6V0B BZW04-6V4 BZW04-6V4B
Contextual Info: transient voltage suppressors «TRANSI!» diodes de protection «TRAN SIL» Types Unidirectional | 150 W / •RM @ V r M Bidirectional fcA l N N N N N N N N N N N N N N N N N N N N N N BZW04-5V5 BZW04-5V8 BZW04-6V0 BZW04-6V4 BZW04-6V6 BZW04-7V0 BZW04-7V4 BZW04-7V8

Contextual Info: ENS070-13 ij 3 > > V - '> 7 y V - ^ ± S S A : Outline D raw ings / < SILICO N SURGE ABSORBERS s 01 'r-T. □ n 02 ' - KÍSÍ 5 I H Ti-l I 7.6±0.3 . U -1 i~ m i 1.6+0.3 E rr] ¿±0,1 CiiHÄfT • 5 Ë fê 2 :!fêM'É : M a x i m u m R a ti n g s a n d C h a r a c te r i s ti c s

TC9405

Abstract: TC9405I 6522 mos 1134 scr SCR GATE DRIVER Bar-Graph Display Driver LED BARGRAPH peripheral driver DISPLAY HA 1133 R DRIVER SCR
Contextual Info: TELEDYNE 3bE » COMPONENTS • ôWbOE □Q07723 M « T S C WTELEDYNE COMPONENTS TC9405 16-BIT PARALLEL-LATCHED OUTPUT PERIPHERAL DRIVER FEATURES Saturation Voltage vs Sink Current ■ ■ ■ ■ ■ ■ ■ High Voltage

intersil im6100

Abstract: IM6654 512X8 24 PIN EPROM eprom 6653 J 6920 A IM6653 g 6653 4096-Bit UV Erasable PROM intersil eprom
Contextual Info: IM 6 6 5 3 /IM 6 6 5 4 4 0 9 6 Bit CMOS UV Erasable PROM INIERHL FEATURES GENERAL DESCRIPTION • O rganization — IM 6653: 1024 x 4 IM 6654: 5 1 2 x 8 • • Low Power — 770jiW M axim um Standby High Speed — 300ns 10V A ccess T im e for IM 6653/54 Al

Teledyne Semiconductor

Abstract: TSC9405 TSC9405CPG bar graph driver T-52-17 Latched relay driver TSC940
Contextual Info: TELEDYNE C OM P O N E N T S EflE D • Ö W büfi QQQStaa 7 T - M 'H TELEDYNE SEMICONDUCTOR TSC9405 16-BIT PARALLEL LATCHED OUTPUT PERIPHERAL DRIVER TSCM » -v Vsut Wr*ritv ' : 1 " ' “.j V ,*18V mA FEATURES . y: Isink - ■ ■ ■ ■ ■ ■ ■ 0.05