MIL 45204 Search Results

Contextual Info: P\-oS-o\ a company built on proven reliability MICROWAVE Chip Capacitors Bond Strength — exceeds Mil Std-883, Method 2011 Sheer Strength — exceeds Mil Std-883, Method 2019 Metalization — Gold, Mil-G-45204 Type III Grade A Quality Control System approved to Mil-l-45208

C5586

Abstract: Capacitor ceramic c70 C-30 N1500 N2200 P180 c5587 2302B c50710 c557
Contextual Info: f\-0S -0\ a company built on proven reliability MICROWAVE Chip Capacitors Bond Strength — exceeds Mil Std-883, Method 2011 Sheer Strength — exceeds Mil Std-883, Method 2019 Metalization — Gold, Mil-G-45204 Type III Grade A Quality Control System approved to Mil-l-45208

Contextual Info: AMPLIMITE Connectors, ULTRA-LITE Connectors ULTRA-LITE Connector Plugs and Receptacles, Series 90 Connector Material and Finish Shell — Aluminum alloy, gold plated per MIL-G-45204 over nickel per MIL-C-26074. Insert — Blue diallyl phthalate per MIL-M-14 or black Polyphenylene

MIL-C-83446

Abstract: 10582
Contextual Info: Series 105/108 Micro i Chip Inductors Military Specifications Series 105 MIL-C-83446 Reference Series 108 MIL-C-83446/8 (Reference) Mechanical Configuration Units are epoxy encapsulated. Contact areas for reflow soldering are gold plated per MIL-G-45204 Type 1-Grade A. Internal

Amphenol

Abstract: M81969 M12883 SAE-AS39209 m22520 M39029 CNS101553 MIL-C-39029 B 1403 N dn2 relay
Contextual Info: Crimp Removable Socket Contacts MIL-C-39029/5, MIL-C-39029/101 Materials: Body: Copper Alloy, Hard Gold Plated per MIL-G-45204 Hood: Stainless Steel Passivated M39029/5 Contact Dimensions 1st A B 3rd Performance: Performance: Performance in Accord with SAE-AS39209 and Related

Contextual Info: AMPLIMITE Connectors, ULTRA-LITE Connectors ULTRA-LITE Connector Plugs and Receptacles, Series 109 Connector Material and Finish B Shell — Aluminum alloy, gold plated per MIL-G-45204 over nickel per MIL-C-26074. Insert — Blue diallyl phthalate per MIL-M-14 or black Polyphenylene

C1106

Contextual Info: NOTES: 1. MATERIALS: 2. PLATING: BERYLLIUM COPPER QQ-C-530, BRASS QQ-B-626. TEFLON M IL-P-19468. HARD GOLD PLATE MIL-G-45204 .00005 MIN., HARD GOLD PLATE MIL-G-45204 .0001 MIN. 3. INTERFACE PER MIL-C-39012. 4. ELECTRICAL CHARACTERISTICS: NOMINAL IMPEDANCE: 50 OHMS

Contextual Info: NOTES: 1. INTERFACE TO BE IN ACCORDANCE WITH MIL-STD-348 FIG. 313-2. 2. MATERIALS: INSULATOR-TEFLON. ASTM-D-4894 CENTER CONTACT-BER. COP., ASTM-B-196 SHRINK TUBING-POLYOLEFIN PER MIL-I-23053/5 BODY-BRASS, ASTM-B16 3. FINISHES: CENTER CONTACT-GOLD PLATE PER MIL-G-45204

C1106

Contextual Info: .98 REF. NOTES: 1. MATERIALS: BERYLLIUM COPPER QQ-C-530, BRASS QQ-B-626, TEFLON M IL -P -19468. 2. PLATING: HARD GOLD PLATE MIL-G-45204 .00005 MIN., HARD GOLD PLATE MIL-G-45204 .0001 MIN. 3. INTERFACE PER MIL-C-39012. 4. ELECTRICAL CHARACTERISTICS: NOMINAL IMPEDANCE: 50 OHMS

Contextual Info: SF2950—6067. NOTES: 1. MATING: Interface dimensions per Mil-C-39012/SMA Series and Solitron/Microwave MD-107. 2. MATERIALS: Body: Contact: Insulator: 3. FINISH: Body: Contact: 4. Passivate per QQ-P-35A, Type I. Gold per Mil-G-45204, Type II, Grade C, Class 2; over Copper per Mil-C-14550,

Contextual Info: Discrete Crimp-to-Wire Pins/Receptacles/ Housings 2.54 x 2.54 mm 0.100 x 0.100 in. Centerlines Latching System I Features Specifications • ■ ASTMB-122 ■ ASTM B-579 ■ MIL-G-45204 ■ ASTMB-159 ■ MIL-M-20693 ■ MIL-P-46129 ■ QQ-N-290 ■ QQ-B-613

Contextual Info: S D -7 34 15-1 04 MATERIALS AND FINISHES: BODY BRASS PER ASTM-B16 PLATED GOLD PER MIL-G-45204 .080 CONTACT BERYLLIUM COPPER PER ASTM-B196 PLATED GOLD PER MIL-G-45204 2.00 MAX PANEL INSULATOR TEFLON PER ASTM-D-1457 NUT BRASS PER ASTM-B16 PLATED GOLD PER MIL-G-45204

Contextual Info: Materials All metal parts: Kovar, gold plated per MIL-G-45204 type II, grade C, class 1 over nickel per MIL-C-26074, class 1, over copper per MIL-C-14550. Glass: Corning glass as noted: Frequency range: DC-26 GHz. Insertion loss: .1 Db max to 12.4 GHz. .2 Db max to 18 GHz.

Contextual Info: unted Term inations & Resis MECHANICAL SPECIFICATIONS Heat Sink Substrate Contact Copper, Nickel Plated per MIL-C-26074, Class 2. Beryllium Oxide Ceramic. Beryllium Copper, Gold Plated per MIL-G-45204. Thickness .004" ± .002". Alumina Ceramic. ± .010" unless specified.

Contextual Info: HOLLINGSWORTH .100 2,54 000 Ili 101 000 RECOMMENDED PCB PATTERN .100 (2,54) SPECIFICATIONS: MATERIALS: HOUSING: TERMINAL: PLATING: GLASS FILLED THERMOPLASTIC, U.L. 94V-0, BLACK PHOSPHOR BRONZE GOLD PER MIL-G-45204 TIN/LEAD PER MIL-T-81728 NICKEL PER QQ-N-290

ASTM-D-1457

Abstract: C1106
Contextual Info: NOTES: 1. INTERFACE PER MIL-STD-348. FIG. 314-1. 2. MATERIALS: INSULATOR: TEFLON, ASTM-D-1457 CENTER CONIACI i BRASS' ASTM-BI6 3 FINISHES* CENTER CONTACT: GOLD PLATE PER MIL-G-45204 BODY: KINGS TARNISH RESISTANT FINISH TR-5 4. ELECTRIAL CHARACTERISTICS:

Contextual Info: SMA SPECIFICATIONS MATERIALS ELECTRICAL Continued Bodies, nuts - Corrosion Resistant Steel per QQ-S-763 Contacts - Beryllium Copper per QQ-C-530 Insulators - Teflon per MIL - P -19468 Gaskets - Silicone Rubber per ZZ-R-765 ^FINISH Contact - .000050 min Gold per MIL-G-45204

Contextual Info: DRAWING Nil 1. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE ±.010” .254mm REV, 12-0003 B MATERIALS: BODY & COUPLING NUT: S.S. PER ASTM A582 CONTACT: BERYLLIUM COPPER PER ASTM B196 RESISTIVE: NICHROME FINISH: BODY: GOLD PER MIL-G-45204 CONTACT: GOLD PER MIL-G-45204

Contextual Info: Series 3090 Micro i Low Profile Chip Inductors SERIES 3090 IRON CORE MIL-C-83446 Reference for testing methods only. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal

Contextual Info: SMK - 50 Ohm Connectors 2.92mm INCHES (MILLIMETERS) • Plug to Jack In-Series Adapter GOLD PLATED 145-0901-821 MATERIAL SPECIFICATIONS Bodies: Stainless steel per QQ-B-626, gold plated* per MIL-G-45204 .00005" min. or passivated per MIL-F-14072 B (EL) 300

Contextual Info: Series 3090 Micro i Low Profile Chip Inductors SERIES 3090 IRON CORE MIL-C-83446 Reference for testing methods only. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal

Contextual Info: 2702-6015 NOTES MATING: Interface dimensions per Mil-C-39012/ssMâ Series and Solitron/Microwave MD-114. i MATERIAL : ' Body & '• Coupling Nut:Lockring Gasket:- FINISH: Body & Coupling Nut:Lockr ing :— — . — 4. -Gold per Mil-G-45204, Type II, Grade C, Class 1.

Contextual Info: SMK - 50 Ohm Connectors 2.92mm INCHES (MILLIMETERS) • Plug to Plug In-Series Adapter GOLD PLATED 145-0901-811 MATERIAL SPECIFICATIONS Bodies: Stainless steel per QQ-B-626, gold plated* per MIL-G-45204 .00005" min. or passivated per MIL-F-14072 B (EL) 300

Contextual Info: SMK - 50 Ohm Connectors 2.92mm INCHES (MILLIMETERS) • Jack to Jack In-Series Adapter GOLD PLATED 145-0901-801 MATERIAL SPECIFICATIONS Bodies: Stainless steel per QQ-B-626, gold plated* per MIL-G-45204 .00005" min. or passivated per MIL-F-14072 B (EL) 300