MICRO OHM CORP Search Results
MICRO OHM CORP Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CS-USB2AMBMMC-001 |
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Amphenol CS-USB2AMBMMC-001 Amphenol USB 2.0 High Speed Certified [480 Mbps] USB Type A to Micro B Cable - USB 2.0 Type A Male to Micro B Male [Android Sync + 28 AWG Fast Charge Ready] 1m (3.3') | |||
CS-USB2AMBMMC-002 |
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Amphenol CS-USB2AMBMMC-002 Amphenol USB 2.0 High Speed Certified [480 Mbps] USB Type A to Micro B Cable - USB 2.0 Type A Male to Micro B Male [Android Sync + 28 AWG Fast Charge Ready] 2m (6.6') | |||
CS-USB3IN1WHT-000 |
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Amphenol CS-USB3IN1WHT-000 3-in-1 USB 2.0 Universal Apple/Android Charge & Sync Cable Adapter - USB Type A Male In - Apple Lightning (8-Pin) / Apple 30-Pin / USB Micro-B (Android) Male Out - White | |||
TMPM3HMF10BFG |
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Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 | Datasheet | ||
TMPM3HLF10BUG |
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Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 | Datasheet |
MICRO OHM CORP Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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CTL4468-002
Abstract: lbff 1408150-1
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30Jan08 28Mar07 18Feb08. CTL4468-002 EME4468-003. lbff 1408150-1 | |
Contextual Info: TM CALIFORNIA MICRO DEVICES Thin Film Resistor Series California Micro Devices offers the proven reliability of Tantalum Nitride in a high meg ohm resistor chip. Series TM high meg ohm resistor chips are available in values from 1 meg ohms to 20.0 meg ohms and tolerances to |
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100Vdc C1330800 | |
2.F 1 markingContextual Info: TE CALIFORNIA MICRO DEVICES Thin Film Resistor Series California Micro Devices offers the proven reliability of Tantalum Nitride in a high meg ohm resistor chip. Series TE high meg ohm resistor chips are available in values from 1.0 meg ohms to 10.0 meg ohms and tolerances to |
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100Vdc C1310800 2.F 1 marking | |
Contextual Info: BULLETIN11196 MICRO-OHM CORPORATION MODEL CWX4T WIREWOUND RESISTORS COMMERCIAL POWER, FOUR LEAD 3Ü H ËM TÏÏT FEATURES: • FIREPROOF INORGANIC CONSTRUCTION • EXTREMELY LOW RESISTANCE VALUES •CURRENT SENSING CURRENT LEADS • LOW TEMPERATURE COEFFICIENTS |
OCR Scan |
BULLETIN11196 CW34T CW54T CW74T CW104T CW154T | |
g060Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BERYLLIUM COPPER, WHITE BRONZE PLATING CONTACT -BERYLLIUM COPPER, GOLD PLATING INSULATORS - DELRIN k TEFLON FERRULE - COPPER, WHITE BRONZE PLATING 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM |
OCR Scan |
919-NM122P-51A SIZ6AU-50 29-Ju RG-178) G\CNPD\919\NM 122P\51A-DSZ g060 | |
48675
Abstract: 8241F
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OCR Scan |
8241F, Jul--11 \DWG\CNPD\31 \00-AFSZ 48675 8241F | |
SMA6252A2-3GT50G-50
Abstract: 901-143-6RFX sma6252a2
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\RD-DM10052801F\ 1-Jun-10' 1/4-36UNS-2A 01-Jun-10 12-Sep-06 \SMA\SMA6252A2-3GT50G-50 SMA6252A2-3GT50G-50 116252AAG01GA5F 901-143-6RFX SMA6252A2-3GT50G-50 901-143-6RFX sma6252a2 | |
1001T1
Abstract: AMPHENOL bnc connector
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OCR Scan |
M22520/5-01) M22520/5-11) Jan--11 \DWG\CNPD\31 \4700-KSZ 1001T1 AMPHENOL bnc connector | |
Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - PTFE, NATURAL ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 4 GHz 1500 VRMS, MIN. C. DIELECTRIC WITHSTANDING VOLTAGE: |
OCR Scan |
r--10' \31\315\1005-HSZ | |
Contextual Info: R E VIS IO N S THIRD ANGLE PROJ. NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, SILVER PLATING CONTACT - BRASS & BERYLLIUM COPPER, SILVER PLATING INSULATOR - PTFE, NATURAL 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: |
OCR Scan |
05-Mar-08 21-Dec-09 26-Dec-11 Dec--11 21-Dec-09 12-Dec-11 \DWG\CNPD\31 \2208-AJSZ | |
31-5900Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - ZINC DIECAST, NICKEL PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - PTFE & T.P.X, NATURAL & WHITE 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 4 GHz C. DIELECTRIC WITHSTANDING VOLTAGE: |
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RG--59 \DWG\CNPD\31 5900-HSZ 31-5900 | |
Contextual Info: REVISIO N S TH IR D AN G LE PRO J. NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - TEFLON, NATURAL 2. ELECTRICAL: A. IMPEDANCE: 75 OHM C. DIELECTRIC WITHSTANDING VOLTAGE: |
OCR Scan |
28-Feb-08 17--Mar--10 27-Dec-10 27-Dec-10 \DWG\CNPD\31 \70022-FSZ | |
CV7559
Abstract: 1RD10 DWG 70008
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OCR Scan |
27-Dec-10 \DWG\CNPD\31 \70008\3000-ESZ CV7559 1RD10 DWG 70008 | |
Contextual Info: 4. R EVIS IO N S THIRD ANGLE PROJ. NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT - BRASS, GOLD PLATING INSULATOR - PTFE, NATURAL 2 . ELECTRICAL: A. IMPEDANCE: 5 0 OHM B. FREQUENCY RANGE: DC 0 - 4 GHz |
OCR Scan |
22--Jul--11 G\CNPD\31\320-10 06-FSZ | |
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RC07
Abstract: RC-07 RC20
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OCR Scan |
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Contextual Info: THIRD ANGLE PRO J. NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRA SS, NICKEL PLATING CONTACT - BRA SS, GOLD PLATING INSULATOR - PTFE, NATURAL 2 . ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: DC 0 - 4 GHz C. DIELECTRIC WITHSTANDING VOLTAGE: |
OCR Scan |
12--Ja | |
Contextual Info: NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT -P H O SP H O R BRONZE, GOLD PLATING INSULATOR - PTFE 2. ELECTRICAL: A. IMPEDANCE: 75 OHM B. FREQUENCY RANGE: DC 0 - 2 GHz C. VSWR(RETURN LOSS): 1.3, MAX. |
OCR Scan |
B6251F1-005-N 17-Jan-07 016251ACR05NA7F \DWG\B\6251 F1\005\75\NT3GSZ B6251 | |
Contextual Info: R E V IS IO N S TH IRD AN G LE PROJ. NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, GOLD PLATING(.000010 ” MIN.) CONTACT - BRASS, GOLD PU\TING(.000030” MIN.) INSULATOR - PTFE ELECTRICAL: A. IMPEDANCE: 50 OHM B. FREQUENCY RANGE: |
OCR Scan |
24-Mar-05 17-Mar-09 24-Mar-05 Mar-05 SMB1421A1 -316U 121421AAA36GM5F \DWG\SMB\1421 \316U-50\10GT30G-CSZ | |
Contextual Info: PRELIMINARY CALIFORNIA MICRO DEVICES PRN 146/147 ►► ► ►► ZERO OHM JUMPER ARRAY Featu res A p p lica tio n s • Stable low resistance circuit interconnect • 10 or 12 jumpers/package • Saves board space and reduces assembly cost • Industry standard SOIC and |
OCR Scan |
PRN146/147 PRN146-S/R PRN146-Q/R PRN147-S/R PRN147-Q/R PRN146-S PRN146-Q PRN147-S PRN147 PRN146-S/T | |
Contextual Info: DESCRIPTION 02 DRAFT BY APPD DATE XXX PSM 11/16/05 NOTES: 1. MATERIAL AND FINISHES: BODY : BRASS, TRIMETAL 30 MICRO OVER COPPER CONTACT: COPPER ALLOY, GOLD 30 OVER NICKEL INSULATOR: PTFE REV 2. ELECTRICAL: IMPEDANCE: 50 OHM FREQUENCY: DC - 6 GHZ VSWR: -34 dB TO 3 GHZ; -28 TO 6GHZ |
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5M-1994 990-500-1BILITY: 990-500-1410R RG-402 SD990-500-1410R | |
100R0
Abstract: RN65E 4m99 DIN44061
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OCR Scan |
DIN44061 IL10509 100R0 15ppm 25ppm 50ppm RN65E 4m99 | |
tm 2312
Abstract: DL4728 DL4761 ZMY75G
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Jun-1st-2010 MMTZJ39 DLZ39D ZMY75G DL4728 DL4761 DO-35 tm 2312 DL4761 ZMY75G | |
2EZ39D5
Abstract: MTZJ BZM55C2V0 BZM55C2V2 BZM55C2V4 BZM55C39 BZM55C43 BZM55C75 BZT55C2V0 BZT55C2V2
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Feb-11th-2010 BZM55C2V0 BZM55C2V2 BZM55C2V4 BZM55C39 BZT52C2V4S BZT52C39S BZM55C43 BZM55C75 BZT55C2V0 2EZ39D5 MTZJ BZM55C2V2 BZM55C39 BZM55C75 BZT55C2V2 | |
micro MELF dimensions st
Abstract: DL4728 DL4761 ZMY75G
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Jun-1st-2010 MMTZJ39 DLZ39D ZMY75G DL4728 DL4761 micro MELF dimensions st DL4761 ZMY75G |