MICRO COPPER ALLOY Search Results

MIL-PRF-8351

Abstract: micro-d connectors SOURIAU 8351 MICRO-D 51 CONNECTORS
Contextual Info: Hermetic Micro-D The only Laser Weldable Hermetic Micro-D with Copper Contacts Ultra rugged, compact, lightweight hermetic micro-Ds with copper alloy contacts with a leak rate less than 10-9 atm.cm³/s. These connectors are capable of performing at extreme temperatures and are built to exceed

SD472

Contextual Info: DESCRIPTION A EWR 06-413 BY APPD DATE DCam .276 7.01 1. FOR GENERAL SERIES SPECIFICATIONS, SEE SD47-0000. REV PSM 07/27/05 NOTES: UNLESS OTHERWISE SPECIFIED 2. MATERIAL AND FINISHES: BODY : BRASS PER ASTM B16, GOLD 15 MICRO OVER COPPER CONTACT: COPPER ALLOY, GOLD 30 MICRO OVER COPPER

Contextual Info: AD-V8V8 50Ω ø11 ø.433 SHV Jack To SHV Jack 50 (1.969) Parts Material Plating (Micro-inch) Lock Washer Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50 Contact Pin Brass Gold 10 Over Nickel 50 Over Copper 50 Insulator Teflon Body Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50

Contextual Info: TNC9100-L400 ø9.6 ø.378 ø7.5 (ø.295) 7/16-28UNEF TNC Reverse Polarity Jack Crimp 50Ω 38.3 (1.508) NOTE: REVERSE POLARITY JACK Parts Material Plating(Micro-inch) Ferrule Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50 Barrel Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50

MLDM Low Profile Metal Shell Micro-D Solid Wire Termination

Abstract: MLDM2L
Contextual Info: Micro-D Double and Triple Row MLDM Low Profile Metal Shell Micro-D Solid Wire Termination Low profile MLDM connectors have reduced flange height compared to standard MWDM Micro-D connectors. These .050" pitch Micro-D connectors are supplied with solid copper

C5210

Abstract: 302206S 302208S
Contextual Info: Dual Row Multi Port Right Angle s s s Standard contact plating is 15 micro inches of gold. For optional platings add dash number as follows: -30 = 30 Micro inches -50 = 50 Micro inches s s Materials Shielded: Housing: 0.25mm Thickness Copper Alloy with Tin Plated

Contextual Info: 8270 Micro USB Verbinder - SMT Micro USB Connector - SMT W+P PRODUCTS Technische Daten /Technical Data Isolierkörper Thermoplastischer Kunststoff, nach UL94 V-0 Insulator Thermoplastic, rated UL94 V-0 Kontaktmaterial Kupferlegierung Contact Material Copper alloy

Contextual Info: Micro Miniature Pushbuttons with Tactile Feel “Right Angle” FSMRAJ Series MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Copper alloy, silver plate

FSMRACDA

Contextual Info: Micro Miniature Pushbuttons with “Square Button” FSMCD/A & FSMRACD/A MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Copper alloy, silver plate

G111P

Abstract: G103P GMPM E113 G103
Contextual Info: Micro-D Combo Combo Solder Cup Micro-D for High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper

Contextual Info: Micro-D Combo Combo Solder Cup Micro-D for High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper

D113P

Abstract: E113P GMPM 5 G101 GMPM E113 G103P G111P magnetic head 2mm D112R Hysol ee4215 MAGNETIC HEAD
Contextual Info: Micro-D Combo Combo Solder Cup Micro-D For High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. A Solder Cup Contacts – Gold plated beryllium copper

solder cup awg 16

Contextual Info: Section E Combo Micro-D For High Power Applications OVERVIEW AND PRODUCT SELECTION GUIDE Aluminum Alloy Shell Aluminum Alloy Shell Gold Plated Four Tine Beryllium Copper Power Contact LCP Thermoplastic Insulator Standard Micro-D Socket Contact .079 Inch 2mm

15j 5kv

Abstract: FSM 23
Contextual Info: Micro Miniature Vertical Pushbuttons with Tactile Feel & ESD Grounding Terminal FSMJ Series MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Copper alloy, silver plate

micro SD connector

Abstract: SD connector Micro SD
Contextual Info: Amphenol Micro SD Connector 1. Material: Contact: Alloy copper Shell:Alloy copper Insulator: High temperature. Thermoplastic, UL94V-0, 30%glass-filled. 2. Finish : Contact:0.38 micron gold plated at mating area. 4 micron Tin plated on solder tails. Shell:1.25 micron Tin plater overall.

Contextual Info: MMS Series Slide Switches, Micro Size, Instrumentation Grade B MATERIAL SPECIFICATIONS: TYPICAL PERFORMANCE CHARACTERISTICS: Contacts .Silver over nickel over copper alloy Case Material .Polyacetal UL94HB

Contextual Info: Micro-D Double and Tri ple Row Low Proile Metal and Plastic Shell Micro-D MWDL Plastic Shell Solid Wire Termination Low Proile MWDL Plastic Shell Micro-D with Solid Wire Termination These all-plastic MWDL connectors are supplied with single strand copper wire. Contacts

Contextual Info: Combo Solder Cup Micro-D For High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper

G111P

Contextual Info: Combo Solder Cup Micro-D For High Power Applications 13 Amp Current Rating – Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts – Gold plated beryllium copper

plating microinch

Abstract: AD-B8B8-75
Contextual Info: AD-B8B8 50Ω BNC Jack To BNC Jack 32.5 1.280 Typical VSWR Part Number AD-B8B8 1 Ghz 1.16 2 Ghz 1.16 3 Ghz 1.16 Parts Material Plating (Micro-inch) Contact Pin Phosphor Bronze Gold 10 Over Nickel 50 Over Copper 50 Insulator Teflon Body Brass Tin-Zinc-Copper-Alloy 100 Over Copper 50

Contextual Info: Micro-D Combo GMPM Combo Micro-D for High Power Applications Solder Cup 13 Amp Current Rating– Combo Micro-D's combine the size and weight advantages of a Micro -D connector with the added ability to handle higher power needs. Solder Cup Contacts– Gold plated beryllium copper power

micro-x

Abstract: Micro-X Marking E MP86E MP86 MSL Rating micro-x marking 3
Contextual Info: v01.1103 MP86 E – 4 LEAD PLASTIC MICRO-P PLASTIC PACKAGE (A.K.A. MICRO-X) PACKAGE OUTLINES MP86 (E) Package Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

Contextual Info: Amphenol Micro SD Card Conn. 1.Materials: Housing: High temperature thermoplastic, UL 94V-0 rated. Contact: Copper alloy Cover: SUS304 Ground: Copper alloy selective gold 1u" flash plating, over nickel plating 50U" min 2.Contact finish: Selective 1~15u" gold on contact area plating,

Contextual Info: 1 6174 SER IES NOTE 1 1 MICRO SD TRANS FLASH CARD SOCKET F L IP - U P TYPE 1.MATERIAL : HOUSING : HIGH TEMPERATURE PLASTIC(UL94V-0), BLACK. COVER : HIGH TEMPERATURE PLASTIC(UL94V-0), BLACK TERMINAL : COPPER ALLOY. GROUND-LEG : COPPER ALLOY. SHELL : STAINLESS STEEL.