MGT170 Search Results
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MGT170 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA3682 Multiple voltage regulator with power switches Product specification Supersedes data of 2000 Nov 20 2002 Mar 11 Philips Semiconductors Product specification Multiple voltage regulator with power switches TDA3682 FEATURES |
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TDA3682 TDA3682 SCA74 753503/02/pp20 | |
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Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53170R-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to |
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ATS-53170R-C2-R0 GR-63-Core MIL-STD-810 ATS-53170R-C1-R0 MGT170 | |
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Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53170K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to |
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ATS-53170K-C2-R0 GR-63-Core MIL-STD-810 ATS-53170K-C1-R0 MGT170 | |
philips capacitor 1200 k 400 MKTContextual Info: INTEGRATED CIRCUITS DATA SHEET TDA3682 Multiple voltage regulator with power switches Preliminary specification File under Integrated Circuits, IC01 2000 Nov 20 Philips Semiconductors Preliminary specification Multiple voltage regulator with power switches |
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TDA3682 753503/25/01/pp20 philips capacitor 1200 k 400 MKT | |
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Contextual Info: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-51170D-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » |
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ATS-51170D-C2-R0 GR-63-Core MIL-STD-810 ATS-51170D-C1-R0 MGT170 | |
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Contextual Info: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-51170K-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » |
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ATS-51170K-C2-R0 GR-63-Core MIL-STD-810 ATS-51170K-C1-R0 MGT170 | |
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Contextual Info: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53170D-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to |
Original |
ATS-53170D-C2-R0 GR-63-Core MIL-STD-810 ATS-53170D-C1-R0 MGT170 | |
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Contextual Info: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-51170R-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » |
Original |
ATS-51170R-C2-R0 GR-63-Core MIL-STD-810 ATS-51170R-C1-R0 MGT170 | |
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Contextual Info: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-50170G-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » |
Original |
ATS-50170G-C2-R0 GR-63-Core MIL-STD-810 ATS-50170G-C1-R0 MGT170 | |
ATS-50170B-C1-R0Contextual Info: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-50170B-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » |
Original |
ATS-50170B-C2-R0 GR-63-Core MIL-STD-810 ATS-50170B-C1-R0 MGT170 | |
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Contextual Info: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-50170P-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » |
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ATS-50170P-C2-R0 GR-63-Core MIL-STD-810 ATS-50170P-C1-R0 MGT170 |