|
TMPM3HMFDAFG
|
|
Toshiba Electronic Devices & Storage Corporation
|
Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 |
Datasheet
|
|
|
68645-021
|
|
Amphenol Communications Solutions
|
Shrouded Right Angle Header, Through Hole, Double row , 46 Positions, 2.54mm (0.100in) Pitch |
PDF
|
|
|
10080054-502LF
|
|
Amphenol Communications Solutions
|
Quickie Header, Wire to Board Connector, Double Row, 16 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating. |
PDF
|
|
|
61083-204502LF
|
|
Amphenol Communications Solutions
|
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions. |
PDF
|
|
|
61082-144502LF
|
|
Amphenol Communications Solutions
|
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions. |
PDF
|
|
