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    MD-2017 Search Results

    MD-2017 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD2017FN
    		Toshiba Electronic Devices & Storage Corporation Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30 Datasheet
    67292-017LF
    		Amphenol Communications Solutions BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. PDF
    59112-T40-20-171LF
    		Amphenol Communications Solutions Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Through Hole - Double row - 40 Positions - 2mm (0.079inch) - Vertical. PDF
    54242-108201750LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. PDF
    75844-201-72LF
    		Amphenol Communications Solutions BERGSTIK PDF
    SF Impression Pixel

    MD-2017 Price and Stock

    Honeywell Sensing and Control / MICRO SWITCH

    Honeywell Sensing and Control / MICRO SWITCH EMD2017

    Speed Sensors
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