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77313-418-72LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions |
PDF
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77313-418-70LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 70 Positions |
PDF
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10080054-187LF
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Amphenol Communications Solutions
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Quickie Header, Wire to Board Connector, Double Row, 44 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating. |
PDF
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OPA4187IPW
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Texas Instruments
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0.001-µV/°C Drift, low power, rail-to-rail Output, 36-V operational amplifiers zero-drift series 14-TSSOP -40 to 125 |
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OPA4187ID
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Texas Instruments
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0.001-µV/°C Drift, low power, rail-to-rail Output, 36-V operational amplifiers zero-drift series 14-SOIC -40 to 125 |
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