MATERIAL INSPECTION PROCEDURE Search Results

60Co

Contextual Info: CHAPTER 7 SCINTILLATION COUNTING Radiation of various types is widely utilized for non-destructive inspection and testing such as in medical diagnosis, industrial inspection, material analysis and other diverse fields. In such applications, radiation detectors play an important role. There are various methods

waffle

Contextual Info: CHIP SENTRY CARRIER OPENING PROCEDURE I C A U TIO N : ELECTROSTATIC SENSITIVE The die is an electrostatic sensitive device. Special handling methods and equipment must be used to prevent damage. 1. Ensure inspection area is ESD compliant. A clean room environment is desirable to minimize foreign material

bellmouth

Abstract: crimp dimension tolerance crimp height tyco 53880
Contextual Info: Instruction Sheet Inspection of Crimped 408-3196 Power Lock Series 2 Contacts 53880-[ ] 08 SEP 08 1. INTRODUCTION be installed ONLY as shown in instruction material packaged with the connectors. ! 2. REVISION SUMMARY Inspect crimped contacts for “ACCEPT” or “REJECT”

Contextual Info: QUALITY ASSURANCE Pulsar Microwave Corporation employs stringent quality assurance polices and procedures which are defined by our in house Quality Assurance Manual. Pulsar's Quality Assurance Manual encompasses the requirements of MIL1-45208 Inspection Systems , M IL-STD-45662 (Calibration o f T est Equipment) and M IL-STD -105 (Material

BS0001

Abstract: BS-0001 INCOMING RAW MATERIAL INSPECTION method centrifuge
Contextual Info: m o \ Reliability Program ELECTRONIC DESIGNS IN C . Quality Control Tests and Procedures Electronic Designs, Inc.'s continuing effort to be a leader in providing top quality products has lead us to com plete our m ission to become IS 09001 certified. The certification is the most comprehensive quality

TCA 290

Abstract: HR05 FORM0263 HR93
Contextual Info: EMC Technology Procedure: STANDARD Document Number: High Reliability Acceptance Testing TP-8965 Rev.: C OPERATING Application: PROCEDURE HR Series Attenuators and Thermopads Written By: Original Issue Date: D. Raymond 11-28-03 Approved By: Approved By: Approved By:

Contextual Info: c QUALITY ASSURANCE 3 Pulsar Microwave Corporation employs stringent quality assurance polices and procedures which are defined by our in house Quality Assurance Manual. Pulsar's Quality Assurance Manual encompasses the requirements of MIL-I-45208 Inspection Systems , MIL-STD-45662 (Calibration of Test Equipment) andMIL-STD-105

transistor D1564

Abstract: D1564 d1564 transistor electrode oven calibration certificate formats MIL-STD-883H INCOMING RAW MATERIAL INSPECTION procedure rf A434 Hardness Tester SH 21 poly aluminum chloride UPS chloride linear plus
Contextual Info: MIL-STD-883H METHOD 5010.4 TEST PROCEDURES FOR COMPLEX MONOLITHIC MICROCIRCUITS 1. PURPOSE. This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the following levels of quality class level B and S and reliability

DAEWON tray tsop 48LD

Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures

IPC-J-STD-001

Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures

INCOMING RAW MATERIAL INSPECTION procedure

Abstract: INCOMING RAW MATERIAL INSPECTION tabla PS-9406 Raychem Contacts D-602 INCOMING RAW MATERIAL INSPECTION method PS-9407 PS-D-098 T9926 cuidado del micrometro
Contextual Info: ICD Products Group Engineering Standard DCR: T992683 No: Rev: Date: Page: ES 61208 C May 19, 1999 1 of 40 Workmanship Standard For SolderTact Contacts 1. 1.1 Scope This Engineering Standard ES describes the inspection procedure for the manufacturing inspection and assembly requirements for the SolderTact® product line.

Contextual Info: 16 15 14 13 12 11 $ 10 a KEY PRODUCT CHARACTERISTIC SYMBOLS 0, INDICATE PRODUCT CHARACTERISTICS THAT REQUIRE SPECIAL CARE, DOCUMENTATION, AND ACCEPTANCE CRITERIA PER GM 1805 QN AND DELPHI PACKARD ELECTRIC SYSTEMS PROCEDURES. M KEY PRODUCT CHARACTERISTICS

565435-5

Abstract: maintenance manual 565435-5
Contextual Info: Instruction Sheet 408-2648 AMP-TAPEMATIC* Crimping Dies This instruction sheet provides instructions on product application; and maintenance and inspection procedures for AMP–TAPEMATIC crimping dies. AMP–TAPEMATIC crimping dies 69930, 69931, 69932, 69954, 69955, and 69956 are used in the

MDC 2301

Abstract: 74ACT04 J330 LM108 MIL-HDBK-263 National semiconductor die fr003 NSC die
Contextual Info: Name: ME MAS-2301 Department Specification Title:" GENERAL PROCEDURE FOR DIE AND WAFER SALES " Rev:"2.0" Page: 1 TABLE OF CONTENTS 1. PURPOSE 2 2. APPLICABLE DOCUMENTS 2 3. GENERAL INFORMATION 2 4. DIE AND WAFER PACKAGING SPECIFICATIONS 3 5. GENERAL INSPECTION CRITERIA

15443075

Abstract: Delphi PA66 121463
Contextual Info: 12 11 10 KEY PRODUCT CHARACTERISTIC SYMBOLS 0, INDICATE PRODUCT CHARACTERISTICS THAT REQUIRE SPECIAL CARE, DOCUMENTATION, AND ACCEPTANCE CRITERIA PER GM 1805 QN AND DELPHI PACKARD ELECTRIC SYSTEMS PROCEDURES. H I B SYMBOL D E FIN ITIO N MISSING SYMBOLS

PD9002

Abstract: comparison cd 4093 smd code marking a3a SCCB spec stanag LISTING 2N2369 military AQAP-1 IC cd 4093 CECC - Detail Specifications smd code marking a4a
Contextual Info: EXPERIENCE AND INNOVATION EXPERIENCE AND INNOVATION EXPERIENCE AND INNOVATION HIGH RELIABILITY and SCREENING OPTIONS DOC 2624 ISS 4 Contents 1. Introduction 1 2. Quality Approvals 2 3. Material Qualification 3 3.1 Header/Cap/Wire Approval Procedures 3.2 Die Approval Procedure

RCPS-100-70

Abstract: Raychem installation procedure rcps-100-70 RAY5103
Contextual Info: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 U.S.A. Raychem Devices No: Rev: Date: Page RCPS-100-70 G August 7, 2007 1 of 10 Installation Procedure for Standard SolderSleeve Shield Terminators 1.0 Scope: This standard covers the installation procedure and inspection requirements for

hl2010e

Abstract: AD-1319 AT-1319-24 steinel Alpha 611 raychem ad-1319 raychem termination instructions ES-61218 Steinel hl2010e 979663 reflector
Contextual Info: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 USA Raychem SolderTacts Specification: Rev: Date: Pages: ES-61218 C July 30, 2009 1 of 13 Termination Procedure for Size 12, Series “999” SolderTact Contacts for Twisted Pair Cable: D-602-0146, -0147

AMP crimper 69710-1

Abstract: BASE TOOL AMP crimper 69710-1 Instruction Sheet 408-2095 408-7424 AMP crimper 69710-1 408-2095 BASE TOOL AMP crimper 69710-1 manual RS-1019-5LP anvil crimp RS-1019-5L Amp 408-2095
Contextual Info: Instruction Sheet Crimping Die Assemblies 356611-1, 356611-2, and 356612-1 for POWERBAND* Contacts 408-4324 2 6 JA N 00 Rev a The contact support prevents the contact from bending during the crimping procedure. 3. CRIMPING PROCEDURE Install the die assembly in the tooling according to the

Contextual Info: •AMI Quality Program AMERICAN MICROSYSTEMS, INC. General Information August 1996 Introduction QA Operations checks all phases of the manufacturing process, including incoming materials, to insure adherence to specifications and procedures through the use of audits, inspections, and other monitoring

AMP crimper 69710-1

Abstract: 69710-1 REV G BASE TOOL AMP crimper 69710-1 Dies for AMP crimper 69710-1 Amp 408-2095 AMP crimper Dies
Contextual Info: Crimping Die Assemblies Instruction Sheet 408-4324 356611-1, 356611-2, and 356612-1 for POWERB AND* Contacts 2 6 JA N 00 Rev a The contact support prevents the contact from bending during the crimping procedure. 3. CRIMPING PROCEDURE Install the die assembly in the tooling according to the

5962-E296

Abstract: ce pe SMD switch rick jd SMD MARKING CODE A12 KL2 smd
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA Redrawn with changes. Delete vendor CAGE 27014 for PINs 01J, 01L, 013, 02J, 02L, 023, 03J, 03L, and 033. Add vendor CAGE 07933 for PINs 01J, 01X, and 01L. Change vendor CAGE 18324 similar PIN for devices 03J and 033. Remove programming procedures, waveforms and

MSC 5010

Abstract: Microwave Semiconductors MIL883 leak
Contextual Info: SIEMENS 1 HiRel Discrete and Microwave Semiconductors Preliminary Remarks This paragraph gives an overview on the HiRel Discrete and Microwave Semiconductors available from Siemens. For detailed descriptions, screening procedures and quality specifications as well as full data sheets, please refer to our “HiRel Discrete and

82074

Abstract: 69710 40875 AMP catalog 82074
Contextual Info: Instruction Sheet 408–6775 Crimping Die Assembly 59993–1 Stationary Die Indenter Rev A 3. CRIMPING PROCEDURE Install dies according to the instructions packaged with the tooling. Then proceed as follows: NOTE Screw Movable Die (Anvil) Ferrule Crimping