MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Search Results
MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| XPH13016MC | Toshiba Electronic Devices & Storage Corporation | P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) | Datasheet | ||
| TPH3R10AQM | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) | Datasheet | ||
| XPH8R316MC | Toshiba Electronic Devices & Storage Corporation | P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) | Datasheet | ||
| XPH2R106NC | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) | Datasheet | ||
| XPH3R206NC | Toshiba Electronic Devices & Storage Corporation | N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) | Datasheet |
MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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antimony trioxide epoxy molding
Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
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antimony trioxide epoxy moldingmaterial declaration semiconductor packagematerial declarationorganic materials oxygen+2 | |
PGA68
Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
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gs-150t102x51x19gs-100tgs-r1005+10 | |
VSC8664XIC-03
Abstract: VSC8664 VSC8664XIC VSC8664IC VSC8664IC-03 transformerless ethernet design VSC8664 PCB design guide VSC8634 VSC8634XIC VSC8634IC
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vsc863410/100/1000base-t10base-t100base-tx+10 | |
J-STD-020 MSL Rating
Abstract: "IPC 1752" gold material declaration semiconductor package G8211
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ipc-1752j-std-020 msl ratingipc 1752" goldmaterial declaration semiconductor package+1 | |
material declaration vishay
Abstract: asbestos safety TbA 8220 m CAS No. 28064-14-4 DO-214 diode 84084 material declaration semiconductor package sot-363 Package material 28064-14-4 40039
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llp-7529-apr-04material declaration vishayasbestos safety+8 | |
material declaration semiconductor package
Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
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llp-7506-may-04material declaration semiconductor packageasbestos safety+4 | |
40039
Abstract: SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323
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llp-7506-may-0440039sod-523 do-219ab+7 | |
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Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard (cpu board) Model designation: D955XCS Date: 27 June 2005 Lead-free product: Yes, containing (2) SLI chipsets |
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d955xcs | |
SE7230NH1Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop board Model designation: SE7230NH1 Date: 12 June 2006 Product weight: 726.2 grams Lead-free product: Lead-free Second Level Interconnects (SLI) only |
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se7230nh1 | |
d945gtp
Abstract: intel d945gtp
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d945gtpd85051-001intel d945gtp | |
DG965WHContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DG965WH Date: 27 July 2006 Product weight: 731 grams Lead-free product: Lead-free Second Level Interconnect (SLI) |
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dg965whd85051-001 | |
DQ33HS
Abstract: Desktop motherboard
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dq33hsd85051-001desktop motherboard | |
DX38BTContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DX38BT Date: 15 October 2007 Product weight: 908.1 grams Lead-free product: Lead-free Second Level Interconnect (SLI) |
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dx38btd85051-001 | |
intel material declaration
Abstract: DQ963FX
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dq963fxd85051-001intel material declaration | |
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BLKDB43LDContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 23 April 2009 Equipment type: Desktop CPU Board Lead-free product: Lead-free Second Level Interconnect (SLI) Product Codes: BOXDQ43AP, BLKDQ43AP, BLKDB43LD |
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boxdq43apblkdq43apblkdb43ldd85051-001 | |
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Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 20 April 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) Equipment type: Server CPU Board Product Code: WX58BP (BOXWX58BP, BLKWX58BP) |
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wx58bpboxwx58bpblkwx58bpd85051-001 | |
DP55WBContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop CPU Board Product Code: DP55WB Date: 07 August 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) RoHS Definitions : |
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dp55wbd85051-001 | |
DG33TLContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DG33TL Date: 25 May 2007 Product weight: 639.6 grams Lead-free product: Lead-free Second Level Interconnect (SLI) |
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dg33tld85051-001 | |
D945GCNL
Abstract: intel d945gcnl d945gcnl intel motherboard D945GC types of motherboard motherboard chip level
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d945gcnld85051-001intel d945gcnld945gcnl intel motherboard+3 | |
DQ965
Abstract: DQ965WC
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dq965wcd85051-001dq965 | |
DX48BTContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DX48BT Date: 05 December 2007 Product weight: 908.1 grams Lead-free product: Lead-free Second Level Interconnect (SLI) |
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dx48btd85051-001 | |
DP965LTContextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DP965LT Date: 31 May 2006 Product weight: 710.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI) |
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dp965ltd85051-001 | |
D945GCPE
Abstract: intel d945gcpe Desktop motherboard
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d945gcped85051-001intel d945gcpedesktop motherboard | |
asbestos
Abstract: DQ965CO
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dq965cod85051-001asbestos | |