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    MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Search Results

    MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    XPH13016MC
    Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Datasheet
    TPH3R10AQM
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Datasheet
    XPH8R316MC
    Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Datasheet
    XPH2R106NC
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Datasheet
    XPH3R206NC
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Datasheet

    MATERIAL DECLARATION SEMICONDUCTOR PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    antimony trioxide epoxy molding

    Abstract: material declaration semiconductor package Material declaration organic materials oxygen material declaration amd 104 c1k
    Contextual Info: ‹ Chapter 4 Package Materials Material Declaration Data Sheets. AMD has created material data sheets for some of its more popular package designs. These data sheets are organized as follows: • Suface-Mount Array Packages Š PBGA, page 6-19 • Surface-Mount Leaded Packages


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    antimony trioxide epoxy moldingmaterial declaration semiconductor packagematerial declarationorganic materials oxygen+2material declaration amd104 c1k PDF

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Contextual Info: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


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    gs-150t102x51x19gs-100tgs-r1005+10pga68clcc44so53material declaration semiconductor packagefdip28schottky diode sb 5400clcc68clcc52smd transistor marking 7622dip40 weight PDF

    VSC8664XIC-03

    Abstract: VSC8664 VSC8664XIC VSC8664IC VSC8664IC-03 transformerless ethernet design VSC8664 PCB design guide VSC8634 VSC8634XIC VSC8634IC
    Contextual Info: Printer Friendly Page Page 1 of 3 Home » Products » 1GE PHYs » VSC8634 Quad 10/100/1000BASE-T Transceiver The VSC8634 is a low-power quad Gigabit Ethernet transceiver ideal for high-density switch and router applications. The device's compact package is optimal for multiport switch applications. Vitesse's mixed signal and


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    vsc863410/100/1000base-t10base-t100base-tx+101000base-tvsc8664xic-03vsc8664vsc8664xicvsc8664icvsc8664ic-03transformerless ethernet designvsc8664 pcb design guidevsc8634xicvsc8634ic PDF

    J-STD-020 MSL Rating

    Abstract: "IPC 1752" gold material declaration semiconductor package G8211
    Contextual Info: This document is a declaration of the substances within the manufacturer listed item s . Note: if the item(s) is an assembly with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility.


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    ipc-1752j-std-020 msl ratingipc 1752" goldmaterial declaration semiconductor package+1g8211 PDF

    material declaration vishay

    Abstract: asbestos safety TbA 8220 m CAS No. 28064-14-4 DO-214 diode 84084 material declaration semiconductor package sot-363 Package material 28064-14-4 40039
    Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their


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    llp-7529-apr-04material declaration vishayasbestos safety+8tba 8220 mcas no. 28064-14-4do-214 diode84084material declaration semiconductor packagesot-363 package material28064-14-440039 PDF

    material declaration semiconductor package

    Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
    Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their


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    llp-7506-may-04material declaration semiconductor packageasbestos safety+4material declaration vishay89901do-219ab58018 PDF

    40039

    Abstract: SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323
    Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their


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    llp-7506-may-0440039sod-523 do-219ab+7germanium do-35 diode89901cd 4553material declaration vishayasbestosdo-219abgermanium diode sod323 PDF

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard (cpu board) Model designation: D955XCS Date: 27 June 2005 Lead-free product: Yes, containing (2) SLI chipsets


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    d955xcs PDF

    SE7230NH1

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop board Model designation: SE7230NH1 Date: 12 June 2006 Product weight: 726.2 grams Lead-free product: Lead-free Second Level Interconnects (SLI) only


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    se7230nh1 PDF

    d945gtp

    Abstract: intel d945gtp
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: D945GTP Date: 07 June 2005 Product weight: 475.9 grams Lead-free product: Lead-free Second Level Interconnect (2LI)


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    d945gtpd85051-001intel d945gtp PDF

    DG965WH

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DG965WH Date: 27 July 2006 Product weight: 731 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dg965whd85051-001 PDF

    DQ33HS

    Abstract: Desktop motherboard
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ33HS Date: 01 November 2007 Product weight: 589.5 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dq33hsd85051-001desktop motherboard PDF

    DX38BT

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DX38BT Date: 15 October 2007 Product weight: 908.1 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dx38btd85051-001 PDF

    intel material declaration

    Abstract: DQ963FX
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ963FX Date: August 04 2006 Product weight: 720 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dq963fxd85051-001intel material declaration PDF

    BLKDB43LD

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 23 April 2009 Equipment type: Desktop CPU Board Lead-free product: Lead-free Second Level Interconnect (SLI) Product Codes: BOXDQ43AP, BLKDQ43AP, BLKDB43LD


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    boxdq43apblkdq43apblkdb43ldd85051-001 PDF

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 20 April 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) Equipment type: Server CPU Board Product Code: WX58BP (BOXWX58BP, BLKWX58BP)


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    wx58bpboxwx58bpblkwx58bpd85051-001 PDF

    DP55WB

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop CPU Board Product Code: DP55WB Date: 07 August 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) RoHS Definitions :


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    dp55wbd85051-001 PDF

    DG33TL

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DG33TL Date: 25 May 2007 Product weight: 639.6 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dg33tld85051-001 PDF

    D945GCNL

    Abstract: intel d945gcnl d945gcnl intel motherboard D945GC types of motherboard motherboard chip level
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop Motherboard Model designation: D945GCNL Date: 05 June 2007 Product weight: 619.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    d945gcnld85051-001intel d945gcnld945gcnl intel motherboard+3d945gctypes of motherboardmotherboard chip level PDF

    DQ965

    Abstract: DQ965WC
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ965WC Date: 18 Aug 2006 Product weight: 581 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dq965wcd85051-001dq965 PDF

    DX48BT

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DX48BT Date: 05 December 2007 Product weight: 908.1 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dx48btd85051-001 PDF

    DP965LT

    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DP965LT Date: 31 May 2006 Product weight: 710.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dp965ltd85051-001 PDF

    D945GCPE

    Abstract: intel d945gcpe Desktop motherboard
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop Motherboard Model designation: D945GCPE Date: 30 June 2007 Product weight: 619.3 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    d945gcped85051-001intel d945gcpedesktop motherboard PDF

    asbestos

    Abstract: DQ965CO
    Contextual Info: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: desktop motherboard Model designation: DQ965CO Date: 28 July 2006 Product weight: 684.4 grams Lead-free product: Lead-free Second Level Interconnect (SLI)


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    dq965cod85051-001asbestos PDF