MATERIAL COMPOSITION OF PCB Search Results

Contextual Info: Material Composition Survey and Response Manual December 15, 2006 Third Edition Data Format Ver. 3.21 compliant Japan Green Procurement Survey Standardization Initiative Revision History: January 6, 2006: First Edition – Newly created upon the introduction of the JIG

sw 2604 ic

Abstract: ic sw 2604 AOT-2015HPW-1751B LT1618 LTC3452 Sw 2604 flyback led driver with pwm dimming 12V, 350mA LED driver LTC1697 LTC3212
Contextual Info: 02.2008 Power Management for LEDs High Performance Analog ICs LEDs and LED Driver Technology A light-emitting diode LED is a semiconductor device that emits incoherent narrow-spectrum light when electrically forward biased, resulting in a form of electroluminescence. The color of the emitted light depends on the chemical composition of the semiconductor material used, and can be near-ultraviolet, visible or infrared. LEDs are more prevalent today

BT 1610

Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

FBGA-484 datasheet

Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

FBGA-484 datasheet

Abstract: arria MS-034 AGX52014-1
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:

BGA PACKAGE thermal profile

Abstract: BGA 256 PACKAGE thermal resistance 484-pin BGA The Diode Data Book with Package Outlines CII51015-2 EP2C20 EP2C35 EP2C50 F256 MS 034 aaj
Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. The chapters in this section contain the required PCB layout guidelines and package specifications.

Contextual Info: 3M HDC Socket .100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit HDC Series • Ideal for parallel four-row PCB stacking • Press-Fit tail requires only flat push tool for installation • Mates with four-row single-bay headers and plugs • Optional feed-through tails

RIA 250

Abstract: HDCR18041
Contextual Info: 3M HDC Socket .100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit HDC Series • Ideal for parallel four-row PCB stacking • Press-Fit tail requires only flat push tool for installation • Mates with four-row single-bay headers and plugs • Optional feed-through tails

CMOS handbook

Abstract: error 41 barrier EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines BGA PACKAGE OUTLINE
Contextual Info: Section II. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for MAX II devices. It contains the required printed circuit board PCB layout guidelines, device pin tables, and package specifications.

Contextual Info: 3M DIN C-Form Socket .100″ Standard Mount, Vertical, Solder Tail or Press-Fit Terminanion DIN 41612 Ser. • Multi-pin count socket for VME, Multibus II, and VXI backpanels • Press-fit or solder tail terminals for PCB • Expanded pin counts • Optional retention clips

Contextual Info: 3M HDC Header .100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit HDC Series • High density, up to 240 contacts single bay • Early Mate Late Break EMLB grounding contacts for hot swapping • Mates with three-row and four-row sockets • RoHS* compliant. See the Regulatory Information

hdch128

Abstract: h128 transistor datasheet equivalent integrated circuit H102 HDC-H128-41 LY 9525 31XX s 8050 d HDC-H096-31XX-XXXX
Contextual Info: 3M HDC Header .100” Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit HDC Series • High density, up to 240 contacts single bay • Early Mate Late Break EMLB grounding contacts for hot swapping • Mates with three-row and four-row sockets • RoHS* compliant. See the Regulatory Information

AgCu28

Contextual Info: CHAPTER 7 ENVIRONMENTAL INFORMATION page Introduction 7-2 Explanation of the tables 7-2 General safety remarks 7-5 Substances not used by Philips Semiconductors 7-6 Disposal and recycling 7-7 General warnings 7-7 Chemical content tables: Diodes Transistors

Contextual Info: Product Number: 3128-2-00-01-00-00-08-0 Description: 3128 - Solder Mount PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3128-2-00-01-00-00-08-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 8953-0-05-15-00-00-03-0 Description: 8953 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 8953-0-05-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 9081-0-00-34-00-00-08-0 Description: 9081 - Solder Mount PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 9081-0-00-34-00-00-08-0 50 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16

Contextual Info: Product Number: 1940-0-00-01-00-00-03-0 Description: 1940 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 1940-0-00-01-00-00-03-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 9159-0-00-80-00-00-03-0 Description: 9159 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 9159-0-00-80-00-00-03-0 200 - 300 " Tin matte finish over Nickel 00 RoHS Compliant

Contextual Info: Product Number: 9159-0-00-15-00-00-03-0 Description: 9159 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 9159-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 3128-4-00-80-00-00-08-0 Description: 3128 - Solder Mount PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3128-4-00-80-00-00-08-0 200 - 300 " Tin matte finish over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 8831-0-00-80-00-00-03-0 Description: 8831 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 8831-0-00-80-00-00-03-0 200 - 300 µ" Tin matte finish over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 3128-4-00-01-00-00-08-0 Description: 3128 - Solder Mount PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3128-4-00-01-00-00-08-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:

Contextual Info: Product Number: 1942-0-00-34-00-00-03-0 Description: 1942 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 1942-0-00-34-00-00-03-0 50 µ" Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16

Contextual Info: Product Number: 3121-2-00-34-00-00-08-0 Description: 3121 - Solder Mount PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3121-2-00-34-00-00-08-0 50 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16