MATERIAL COMPOSITION DECLARATION Search Results
MATERIAL COMPOSITION DECLARATION Equivalents
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MATERIAL COMPOSITION DECLARATION Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
|---|---|---|---|---|---|
| 65352-001LF |
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MINI LATCH HSG .125X.250-CC DR | |||
| UE62B46200S021 |
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1x4 OSFP cage with stainless steel material | |||
| UE62B46230S021 |
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1x4 OSFP cage with stainless steel material | |||
| AFE4300PN |
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Weigh Scale / Body Composition Analog Front End 80-LQFP 0 to 70 |
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| AFE4300PNR |
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Weigh Scale / Body Composition Analog Front End 80-LQFP 0 to 70 |
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MATERIAL COMPOSITION DECLARATION Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package SVT Package Weight mg 45000 Product Group Type No. S30VT60 – S30VT160 S50VT60 – S50VT160 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating |
Original |
s30vt60s30vt160s50vt60s50vt160+1 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation |
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ars50alars50jl2011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation |
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ar50alar50jl2011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBP Package Weight mg 1700 Product Group Type No. GBP200 – GBP210 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Solder Alloy Leadframe MSL Rating |
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gbp200gbp2102011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MB-S Package Weight mg 120 Product Group Type No. B1S – B10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach |
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2011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBP Package Weight mg 1700 Product Group Type No. KBP150 – KBP1510 KBP200 – KBP2010 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin |
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kbp150kbp1510kbp200kbp2010+1 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TB-S Package Weight mg 100 Product Group Type No. TB1S – TB10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach |
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tb10s2011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MBL-S Package Weight mg 100 Product Group Type No. LB1S – LB10S Solder Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Doped Silicon* Die Attach |
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lb10s2011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C35/C35M Package Weight mg 440 Product Group Type No. C3520, C3524, C3536 C35A – C35K G35160 Component Die Material Solder Alloy Slug Copper Alloy Plating Silver Passivation |
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c35/c35mc3520c3524c3536+2 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBL Package Weight mg 5600 Product Group Type No. KBL400 – KBL410 KBL400G – KBL410G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin |
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kbl400kbl410kbl400gkbl410g+1 | |
C5024Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C50 Package Weight mg 620 Product Group Type No. C5020, C5024, C5036 C50A – C50K C7020, C7024, C7036 Component Die Material Solder Alloy Slug Copper Alloy Plating Silver |
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c5020c5024c5036c7020+3 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package AR Package Weight mg 1800 Product Group Type No. AR25A – AR25J AR35A – AR35J AR50A – AR50J Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material |
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ar25aar25jar35aar35j+3 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TO-247AC Package Weight mg 5600 Product Group Type No. RURG1520 – RURG1560 RURG3020 – RURG3060 Component Material Die Doped Silicon* Die Attach Solder Alloy Wire Bond |
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o-247acrurg1520rurg1560rurg3020+2 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package C25 Package Weight mg 370 Product Group Type No. C25A – C25K Component Die Material Solder Alloy Slug Copper Alloy Plating Silver Passivation Silastic Tolerance MSL Rating |
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2011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MP-10 Package Weight mg 3800 Product Group Type No. MP1000 – MP1010 MP1000G – MP1010G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin |
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mp-10mp1000mp1010mp1000g+2 | |
GBJ25QContextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBJ-6 Package Weight mg 7000 Product Group Type No. GBJ6A – GBJ6M GBJ8A – GBJ8M GBJ15A – GBJ15Q GBJ25A – GBJ25Q GBJ35A – GBJ35Q Component Material Doped Silicon* |
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gbj15agbj15qgbj25agbj25q+3 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBJ-4 Package Weight mg 4600 Product Group Type No. GBJ4A – GBJ4M GBJ10A – GBJ10M Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin |
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gbj10agbj10m2011/65/eu | |
MP1500GContextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MP-15 Package Weight mg 5400 Product Group Type No. MP1500 – MP1510 MP1500G – MP1510G Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin |
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mp-15mp1500mp1510mp1500g+2 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package MT Package Weight mg 21000 Product Group Type No. MT2500 – MT2516 MT3500 – MT3516 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Nickel Jumper |
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mt2500mt2516mt3500mt3516+1 | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBL Package Weight mg 2000 Product Group Type No. GBJ2A – GBJ2M GBL00 – GBL10 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation |
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gbl00gbl102011/65/eu | |
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Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package R-1 Package Weight mg 181 Product Group Type No. 1H1 – 1H8 1A1 – 1A7 Material Die Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin Encapsulation |
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2011/65/eu | |
Material Composition DeclarationContextual Info: RoHS Material Composition Declaration Manufacturer Information Company: Authorised Representative Anton Walles Name: Senior Logistics Engineer Title: +27 21 863 0033 Phone: anton.walles@azoteq.com Email: www.azoteq.com Web: Azoteq Pty Ltd 109 Main Road Paarl |
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iqs259qfn16material composition declaration | |
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Contextual Info: RoHS Material Composition Declaration Manufacturer Information Company: Authorised Representative Anton Walles Name: Senior Logistics Engineer Title: +27 21 863 0033 Phone: anton.walles@azoteq.com Email: www.azoteq.com Web: Azoteq Pty Ltd 109 Main Road Paarl |
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iqs156msop/10ld | |
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Contextual Info: RoHS Material Composition Declaration Manufacturer Information Company: Authorised Representative Anton Walles Name: Senior Logistics Engineer Title: +27 21 863 0033 Phone: anton.walles@azoteq.com Email: www.azoteq.com Web: Azoteq Pty Ltd 109 Main Road Paarl |
Original |
iqs128tsot23/6ld | |