MARKING JE 6 PIN Search Results

FPM DRAM 30-pin SIMM

Abstract: MT8048
Contextual Info: M IC R O N 4 iVIEG DRAM MODULE X MT8D48 3 DRAM MODULE 4 MEG X 8 4 MEGABYTE, 5V, FAST PAGE MODE FEATURES OPTIONS MARKING • Tim ing 60ns access 70ns access -6 -7 P ackages 3 0 -pin SIM M DRAM SIMM • JE D E C - and in d u stry -stan d ard pin ou t in a 30-pin

marking date code Sanyo semiconductor

Abstract: marking date code Sanyo SANYO marking date code date code Sanyo semiconductor Sanyo date code marking jedec package
Contextual Info: OUTLINE DRAWING Measure 5 0 / 1 NTS M a s s (g) 0. 0 0 0 6 IFor reference 0 . 6 *0.05 Pin 1 Marking 0 . 3 5 *0.05 0 . 15 *0.035 0 . 15 *0.035 0 . 5 *0.035 SANYO P a c k a g e Code JEDEC P a c k a g e Code JE I TA P a c k a g e Code T S L P -3 -1 Drawn D r a w i n g No.

jedec Package

Abstract: TSLP-2-7
Contextual Info: Measure OUTLI NE DRAWING 50/1 NTS M a s s (g) 0. 000G IFor reference 0 . 6 *0.05 11111 Pin I Marking SANYO P a c k a g e Code JEDEC P a c k a g e Code JE I TA P a c k a g e Code T S L P -2-7 D r a w i n g No. E n a c t No. TC-0 0 00 1 823 Drawn Checked SANYO S e m i c o n d u c t o r C o . , L t d .

KRA725E

Contextual Info: SEMICONDUCTOR KRA725E MARKING SPECIFICATION TES6 PACKAGE 1. Marking method Laser Marking JE 1 3 No. 0 1 2. Marking 2 Item Marking Description Device Mark JE KRA725E hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Pin No. Dot Pin 1 Index.

marking JE

Abstract: KRA725U marking JE 6 pin
Contextual Info: SEMICONDUCTOR KRA725U MARKING SPECIFICATION US6 PACKAGE 1. Marking method Laser Marking JE 1 3 No. 0 1 2. Marking 2 Item Marking Description Device Mark JE KRA725U hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Pin No. Dot Pin 1 Index.

MARKING 720 SOT23

Abstract: SOT23 MARKING CODE 720 BCX71H BCX71J BCX71K BCX70 BCX71 BCX71G transistor with marking BH BJ MARKING CODE
Contextual Info: Philips Sem iconductors Product specification PNP general purpose transistors BCX71 series FE A T U R E S PINNING • Low current max. 100 mA PIN DESCRIPTION • Low voltage (max. 45 V) 1 base • Low noise. 2 emitter 3 collector APPLICATIONS • Low level, low noise, low frequency applications in

Contextual Info: Philips Semiconductors Product specification NPN switching transistor PMBT3904 FEATURES PINNING • Low current max. 100 mA PIN • Low voltage (max. 40 V). APPLICATIONS DESCRIPTION 1 base 2 emitter 3 collector • Telephony and professional communication equipment.

BCW69

Abstract: BCW70 BCW71 BCW72 sot23 marking JR
Contextual Info: Philips Sem iconductors Product specification PNP general purpose transistors BCW69; BCW70 FE A T U R E S PINNING • Low current max. 100 mA PIN • Low voltage (max. 45 V). APPLICATIONS DESCRIPTION 1 base 2 emitter 3 collector • General purpose switching and amplification.

Contextual Info: Philips Sem iconductors Product specification PNP switching transistor PMBT3906 FEATURES PINNING • Low current max. 100 mA PIN • Low voltage (max. 40 V). APPLICATIONS DESCRIPTION 1 base 2 emitter 3 collector • Telephony and professional communication equipment.

564 marking 6 pin

Contextual Info: THICK FILM CONFORMAL SIPs ULTRALOW PROFILE, 4 THROUGH 12 PIN • Low profile is compatible with DIPs ■ Wide assortment of pin packages enhances design flexibility ■ High temperature lead attachment to withstand reflow temperatures up to 260°C p O T L T R lS r S

Contextual Info: IRFH8334PbF-1 VDS VGS max RDS on max 30 V ± 20 V 9.0 (@VGS = 10V) (@VGS = 4.5V) 13.5 Qg typ. 7.1 ID 25 (@Tc(Bottom) = 25°C) HEXFET Power MOSFET mΩ nC i PQFN 5X6 mm A Applications • Control MOSFET for high frequency buck converters Features Industry-standard pinout PQFN 5 x 6mm Package

Contextual Info: THICK FILM MOLDED DIPs 8, 14, 16, 18 AND 20 PIN • Compatible with automatic insertion equipment ■ Copper leads for excellent heat dissipation ■ High temperature lead attachment to withstand reflow solder temperatures up to 260°C ■ Trifurcated Krimp-Joint lead attachment for product reliability and

IRFTS9342TRPBF

Contextual Info: IRF5801PbF-1 HEXFET Power MOSFET VDS RDS on max (@VGS = 10V) Qg (typical) ID (@TA = 25°C) 200 V 2.20 Ω 3.9 0.6 D 1 6 D nC D 2 5 D A G 3 4 S TSOP-6 Features Industry-standard pinout TSOP-6 Package Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free

TIC 220

Abstract: ic HM 392 - 560
Contextual Info: THICK FILM CONFORMAL SIPs, LOW PROFILE 4 THROUGH 14 PIN • Low profile is com patible with DIPs ■ W id e assortm ent of pin packages enhances design flexibility ■ High tem perature lead attachm ent to withstand reflow tem peratures up to 2 6 0 °C pOURNS

6-PIN marking FA

Abstract: TE MARKING CODE 6-PIN
Contextual Info: THIN FILM RESISTOR NETWORK NARROW BODY GULL WING/ 8, 14 AND 16 PIN • Low noise characteristics ■ Thin film precision •. _. ".« r PO U H N S ■ Increased lead density ■ JEDEC standard package fo r pick and place M odel 4K00T FOR SCHEMATICS, SEE FOLLOWING PAGE.

sot363a

Abstract: 3064 6pin BFM505 semiconductors bi 370 MAM210 NPN power transistor spice marking aded bi 370 transistor
Contextual Info: Philips Semiconductors Product specification Dual NPN wideband transistor BFM505 PINNING - SOT363A FEATURES • Sm all size PIN SYMBOL • Temperature and hpE matched 1 bi base 1 • Low noise and high gain 2 01 emitter 1 • High gain at low current and low capacitance at low

MIL-R-8340

Abstract: marking 6H1 MC225
Contextual Info: THICK FILM CONFORMAI. SIPs, HIGH PROFILE 4 THROUGH 14 PIN • High profile offers increased power handling ■ Wide assortment of pin packages enhances design flexibility •., . —-—1111111111111^ . W ; ■ High temperature lead attachment to withstand reflow

Contextual Info: THIN FILM RESISTOR NETWORK CONFORMAL SIP/LOW, MEDIUM AND HIGH PROFILE, 4 THROUGH 16 PIN • Low profile provides com patibility with DIPs ■ Also available in medium profile 4600S and high profile (4600K) ■ Laser marking on contrasting background Model 4600T, S, K Series

4816P-001

Abstract: 4816P-002 marking S0M 4816P-001- G
Contextual Info: THICK FILM SURFACE MOUNTED MEDIUM BODY 5.59MM SOM PACKAGE/ 14, 16, 18 AND 20 PINS • Standard E.I.A. (SOGN-0002) package compatible with automatic placement equipment ■ High temperature lead attachment to withstand reflow temperatures up to 260°C ■ Tape and reel packaging standard (see page 94 for dimensions)

TE MARKING CODE 6-PIN

Contextual Info: THICK FILM MOLDED SIPs, HIGH PROFILE 4, 6, 8, AND 10 PIN • High profile offers increased power handling ■ Compatible with automatic insertion equipment ■ High temperature lead attachment to withstand reflow temperatures up to 260°C ■ Copper leads for excellent heat dissipation

HDMI to hdmi Cable pin diagram

Abstract: TMDS ip marking JE 6 pin cable hdmi
Contextual Info: S E E NOTE 1.1 S E E NOTE 1.1 PIN 2 PIN 18 Hl/JH DETAIL A DETAIL B 8.6 ±0.5 — - 27.3+0.5- 34.8 ± 0 .5 LENGTH- HDMI M up JÉ HDMI(M) IP Él DETAIL B DETAIL A S E E NOTE 1.2 S E E NOTE 1.2 BACK SIDE BACK SIDE 68803-0021 HDMI TO HDMI CABLE ASS'Y,10FT 3048 ± 80

Contextual Info: IRF7103PbF-1 HEXFET Power MOSFET VDS RDS on max (@VGS = 10V) RDS(on) max (@VGS = 4.5V) Qg (typical) ID (@TA = 25°C) 50 V 0.13 Ω 0.20 Ω 12 nC 3.0 A S1 1 8 D1 G1 2 7 D1 S2 3 6 D2 G2 4 5 D2 SO-8 Top View Features Benefits Industry-standard pinout SO-8 Package

Contextual Info: IRF7342PbF-1 HEXFET Power MOSFET VDS -55 RDS on max (@VGS = -10V) Qg (typical) ID (@TA = 25°C) V S1 1 8 D1 G1 2 7 D1 3 6 D2 4 5 D2 0.105 Ω 26 nC S2 -3.4 A G2 SO-8 Top View Features Benefits Industry-standard pinout SO-8 Package Compatible with Existing Surface Mount Techniques

Contextual Info: IRF7324PbF-1 HEXFET Power MOSFET VDS RDS on max (@VGS = -4.5V) -20 V 0.018 Ω 42 nC -9.0 A Qg (typical) ID (@TA = 25°C) S1 1 8 D1 G1 2 7 D1 S2 3 6 D2 G2 4 5 D2 SO-8 Top View Features Benefits Industry-standard pinout SO-8 Package Compatible with Existing Surface Mount Techniques