MARKING CODE C72 Search Results
MARKING CODE C72 Result Highlights (5)
| Part | ECAD Model | Manufacturer | Description | Download | Buy |
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| 5446/BEA | Rochester Electronics LLC | 5446 - Decoder, BCD-To-7-Segment, With Open-Collector Outputs - Dual marked (M38510/01006BEA) |
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| 54LS190/BEA | Rochester Electronics LLC | 54LS190 - BCD Counter, 4-Bit Synchronous Up/Down, With Mode Control - Dual marked (M38510/31513BEA) |
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| 2910/BQA | Rochester Electronics LLC | 2910 - Microprogram Controller - Dual marked (7801701QA) |
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| MQ80C186-12/BYA | Rochester Electronics LLC | 80C186 - Microprocessor, 16-Bit -Dual marked (5962-8850102YA) |
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| 54L04/BDA | Rochester Electronics LLC | 54L04 - Hex Inverter - Dual marked (M38510/02005BDA) |
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MARKING CODE C72 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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C723
Abstract: N-CHANNEL MOSFET 30V 2A SOT-23
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c723n3mtb55n03n3ot-23ul94v-0+2 | |
8N45
Abstract: MTN8N45E3 you isd electronics
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c720e3mtn8n45e3o-220ul94v-0+2 | |
8N65
Abstract: 700v 7.5A mosfet F 8N65 20/tubes
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mtn8n65fpc727fpo-220fpul94v-0+4 | |
10N65
Abstract: MOSFET 700V 10A MTN10N65FP mtn10n65
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mtn10n65fpc725fpo-220fpul94v-0+3 | |
C728
Abstract: sop8 Package dimension marking 5c 12
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c728q8mtb13n03q8ul94v-0c728+2 | |
b17a03
Abstract: MTB17A03Q8 CYStech Electronics b17a SOP8 Package equivalent MOSFET dual SOP-8
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c729q8mtb17a03q8ul94v-0b17a03+4 | |
MSFA0M02X8
Abstract: DFN3
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c724x8msfa0m02x8ul94v-0dfn3 | |
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Contextual Info: [ /Title CD74H C7266 /Subject (High Speed CMOS Logic Quad 2Input EXCLUSIVE CD54HC7266, CD74HC7266 Data sheet acquired from Harris Semiconductor SCHS219D High-Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate August 1997 - Revised September 2003 Features Description |
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cd74hc7266cd54hc7266cd74hc7266+4 | |
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Contextual Info: [ /Title CD74H C7266 /Subject (High Speed CMOS Logic Quad 2Input EXCLUSIVE CD54HC7266, CD74HC7266 Data sheet acquired from Harris Semiconductor SCHS219D High-Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate August 1997 - Revised September 2003 Features Description |
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cd54hc7266cd74hc7266schs219dhc7266+3 | |
MB2000Contextual Info: Series MB2000 Toggles Electrical Capacity Resistive Load Tilt Tactiles Slides Rotaries Keylocks Programmable Illuminated PB Pushbuttons General Specifications Rockers Miniature Pushbuttons C Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) |
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mb2000 | |
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Contextual Info: Toggles Series MB2000 Electrical Capacity Resistive Load Power Level (silver): Logic Level (gold): Logic/Power Level: (gold over silver) C Other Ratings Contact Resistance: Insulation Resistance: Dielectric Strength: Mechanical Life: Electrical Life: Nominal Operating Force: |
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mb2000 | |
0402 0603 0805 landContextual Info: CERAMIC OPEN MODE CAPACITORS FEATURES KEMET’s Open Mode Ceramic Surface Mount Capacitor is designed to significantly minimize the probability of a low IR or Short Circuit Condition when forced to failure in a board flex situation. This reduces the potential for causing catastrophic failures. This product is RoHS Compliant. |
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eia-1980402 0603 0805 land | |
dd marking
Abstract: Marking KA3 f105k
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eia-198dd markingmarking ka3f105k | |
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Contextual Info: CERAMIC OPEN MODE CAPACITORS FEATURES KEMET’s Open Mode Ceramic Surface Mount Capacitor is designed to significantly minimize the probability of a low IR or Short Circuit Condition when forced to failure in a board flex situation. This reduces the potential for causing catastrophic failures. This product is RoHS Compliant. |
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eia-198 | |
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1206 fuse FD
Abstract: IEC-286-6 capacitor DD dd marking fd 223 fd 35 k marking code gb transistor fg 680 gd f105k
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eia-1981206 fuse fdiec-286-6capacitor dd+6 | |
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Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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eia481-1iec60286-6eia-198 | |
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Contextual Info: CERAMIC CHIP CAPACITORS FEATURES • C0G NP0 , X7R, X5R, Z5U and Y5V Dielectrics • 10, 16, 25, 50, 100 and 200 Volts • Standard End Metalization: Tin-plate over nickel barrier • Available Capacitance Tolerances: ±0.10 pF; ±0.25 pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and |
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eia481-1iec60286-6eia-198 | |
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Contextual Info: CERAMIC CHIP / HIGH VOLTAGE KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin Sn plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering |
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eia-198 | |
IEC-286-6
Abstract: ceramic capacitor 68 pF 100v recommended land pattern for 0402 cap marking RAC 81 CROSS KEMET
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english000eia-198iec-286-6ceramic capacitor 68 pf 100v+3 | |
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Contextual Info: CERAMIC CHIP / HIGH VOLTAGE KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin Sn plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering |
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eia-198 | |
EB smd code marking tantalum capacitor
Abstract: capacitor SMD 476 35v SMD ka3 SMD 1206 ka3 IEC-286-6 BME MLCC KA3 smd code
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eia481-1iec60286-6eia-198eb smd code marking tantalum capacitor+6 | |
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Contextual Info: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the |
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eia-198 | |
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Contextual Info: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the |
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capaci00eia-198 | |
sealing cap
Abstract: CC 0201 K R kemet 7867
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eia481-1iec60286-6sealing capcc 0201 k r+1 | |