MARKING CODE 506A Search Results

Contextual Info: NB3N3010B 3.3V, 12.288 MHz Audio Oversampling Clock Generator for USB Applications http://onsemi.com Description MARKING DIAGRAMS* 8 VDD 1 A L Y W M G 4 = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package Note: Microdot may be in either location

marking 802 soic8

Abstract: NB3N3010BDR2G DFN8 2X2
Contextual Info: NB3N3010B 3.3V, 12.288 MHz Audio Oversampling Clock Generator for USB Applications http://onsemi.com Description MARKING DIAGRAMS* 8 VDD 1 A L Y W M G 4 = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package Note: Microdot may be in either location

2x2 dfn

Abstract: 506AA-01 506AA 301-AA DFN8 2X2 MARKING CODE E2
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 2x2, 0.5P CASE 506AA−01 ISSUE E DATE 22 JAN 2010 1 SCALE 4:1 D PIN ONE REFERENCE 2X 0.10 C 2X A B ÎÎ ÎÎ ÎÎ 0.10 C L L1 DETAIL A E OPTIONAL CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e K L L1 ÏÏ ÏÏ EXPOSED Cu

DFN12

Abstract: marking code G dfn12
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN12 3.0x1.35, 0.5P CASE 506AD−01 ISSUE J 12 1 SCALE 4:1 DATE 09 JUL 2008 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO PLATED

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 CASE 506AK−01 ISSUE C 8 DATE 30 SEP 2005 1 SCALE 4:1 A D PIN ONE REFERENCE 2X 0.15 C B ÏÏÏ ÏÏÏ ÏÏÏ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 8 PIN UDFN, 2x2.2, 0.5P CASE 506AV−01 ISSUE B 8 1 DATE 20 SEP 2006 SCALE 4:1 PIN ONE REFERENCE 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN3 CASE 506AU−01 ISSUE O DATE 20 SEP 2005 1 SCALE 4:1 D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.

marking code EE

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6 1.2x1.0, 0.4P CASE 506AS−01 ISSUE C DATE 30 JUN 2008 SCALE 4:1 D L A B L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED

20x20

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 CASE 506AQ−01 ISSUE A DATE 15 AUG 2005 1 D A B SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6, 2x2 CASE 506AZ−01 ISSUE A DATE 25 APR 2006 SCALE 4:1 D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20mm FROM

506AP

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6 2x2 CASE 506AP−01 ISSUE B DATE 26 APR 2006 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20mm FROM

microdot

Abstract: WDFN12 506AY
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN12, 3x4, 0.5P CASE 506AY−01 ISSUE B 12 DATE 31 OCT 2006 1 D A PIN 1 INDEX AREA 2X 0.10 C 2X ÈÈÈÈ ÈÈÈÈ ÈÈÈÈ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER.

E2 liu

Abstract: wdfn6 506AN
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6 2x2, 0.65P CASE 506AN−01 ISSUE E DATE 20 AUG 2010 SCALE 4:1 D PIN ONE REFERENCE 0.10 C 0.10 C PLATING ÍÍ ÍÍ ÍÍ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.

DFN16

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN16, 4x1.6, 0.5P CASE 506AC−01 ISSUE C 16 1 SCALE 4:1 DATE 14 JAN 2010 A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO TERMINAL AND

DFN22-6

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN22 6*5*0.9 MM, 0.5 P CASE 506AF−01 ISSUE A 22 DATE 15 AUG 2005 1 SCALE 2:1 A D B NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN

marking code AYWW

Abstract: 506AH-01 DFN6 DFN-6 506AH
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN6 3*3 MM, 0.95 PITCH CASE 506AH−01 ISSUE O 1 SCALE 2:1 DATE 17 NOV 2004 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL

506AL

Abstract: 33X33
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 CASE 506AL−01 ISSUE A 8 1 DATE 20 DEC 2005 SCALE 2:1 PIN ONE REFERENCE 2X 0.15 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL

506AL

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 CASE 506AL−01 ISSUE A 8 1 DATE 20 DEC 2005 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN6 3*3 MM, 0.95 PITCH CASE 506AG−01 ISSUE O 1 SCALE 2:1 DATE 18 NOV 2004 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL

MOTOROLA LOT MARKINGS

Abstract: On semiconductor date Code IC Lot Code Identification marking code 6L QFN tray qfn 4x4 AND8002 ase qfn unisem QFN marking code onsemi Diode on alpha year and work week
Contextual Info: AND8002/D Clock Generation and Clock and Data Marking and Ordering Information Guide http://onsemi.com Prepared by: Paul Shockman ON Semiconductor APPLICATION NOTE Introduction This application note describes the device markings and ordering information for the following ON Semiconductor

BB301M

Contextual Info: BB301M Built in Biasing Circuit MOS FET IC VHF RF Amplifier REJ03G0824-0300 Previous ADE-208-506A Rev.3.00 Aug.10.2005 Features • Built in Biasing Circuit; To reduce using parts cost & PC board space. • Low noise characteristics; (NF = 1.3 dB typ. at f = 200 MHz)

Contextual Info: BB301M Built in Biasing Circuit MOS FET IC VHF RF Amplifier REJ03G0824-0300 Previous ADE-208-506A Rev.3.00 Aug.10.2005 Features • Built in Biasing Circuit; To reduce using parts cost & PC board space. • Low noise characteristics; (NF = 1.3 dB typ. at f = 200 MHz)

MARKING code u1 sot 563

Abstract: MT 1379 DEC sot-353 marking B2 marking ayWW SOT23
Contextual Info: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 874 CASE OUTLINES AND PACKAGE DIMENSIONS SOT−23 CASE 1212−01 ISSUE O DATE 07/03/1996 SCALE 2:1 A 5 E 1 A2 0.05 S B D A1 4 2 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES

NUF4211

Contextual Info: NUF4211MN 4-Channel EMI Filter with Integrated ESD Protection http://onsemi.com MARKING DIAGRAM DFN8 CASE 506AA PLASTIC 1 U5 M The NUF4211MN is a four−channel C−R−C Pi−style EMI filter array with integrated ESD protection. Its typical component values of