MARKING CND Search Results

TLR 308

Abstract: MLT 22 706 MLT 22 542 indigo MARKING 1F mlt 22 814 RK73G 0603 black marking color SG73P kt 814
Contextual Info: Appendix D marking and standard values KSE Part Designation RK73B RK73Z RK73H RK73G RK73A KSE Part Designation Color Body Marking 1F 01005 1H (0201) 1E (0402) 1J (0603) 2A (0805) 2B (1206) 2E (1210) 2H (2010) 3A (2512) 1F,1H 1E (0402) 1J (0603) 2A (0805)

SG73P-RT

Abstract: RK73G-RT MLT 22 634 SG73S-RT HV73-RT RK73H-RT WK73-RT
Contextual Info: Appendix D marking and standard values marking Color KSE Part Designation Body 1F 01005 1H (0201) 1E (0402) 1J (0603) RK73B 2A (0805) RK73B-RT 2B (1206) 2E (1210) 2H (2010) 3A (2512) 1F,1H 1E (0402) 1J (0603) RK73Z 2A (0805) RK73Z-RT 2B (1206) 2E (1210)

CND2A10Y

Contextual Info: CND resistors bussed square corner resistor array features • • • • • Manufactured to type RK73 standards Concave or convex terminations Less board space than individual chips Eight bussed resistor elements included in one array Marking: Marked with resistance value

CND1J

Abstract: array resistor datasheet mil CND1J10K CND1J10Y RK73
Contextual Info: CND resistors bussed square corner resistor array features • • • • • • Manufactured to type RK73 standards Concave or convex terminations Less board space than individual chips Eight bussed resistor elements included in one array Marking: Marked with resistance value

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Electrode Ceramic substrate IDENTIFICATION COATING COLOR TYPE MARKING White, 3 digits „•“ marks pin 1 & 6 White, 3 digits

CND1J10Y

Abstract: CND2A10Y CND1J10VK
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Electrode Ceramic substrate IDENTIFICATION COATING COLOR TYPE MARKING White, 3 digits „•“ marks pin 1 & 6 White, 3 digits

cnd2b10

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Electrode Ceramic substrate IDENTIFICATION COATING COLOR TYPE MARKING White, 3 digits „•“ marks pin 1 & 6 White, 3 digits

Contextual Info: CND resistors bussed square corner resistor array features • • • • • • Manufactured to type RK73 standards Concave or convex terminations Less board space than individual chips Eight bussed resistor elements included in one array Marking: Marked with resistance value

Contextual Info: Screw Connection Dual Level ̋"Plastic Body: Ron{cmidg"88.8"XQ ̋ Internal Bus: Uinxgr"rnctgd"corrgr ̋"Clamp: Jcrdgngd"stggn."gngctro/ rnctgd"witj"|inc"{gnnow"cjromctgd ̋"Screws: Utggn."|inc"rnctgd"" cnd"{gnnow"cjromctgd ̋"Marking: 4"snots"on"dotj"" sides

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR MARKING White, 3 digits „•“ marks pin 1 & 6

Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR MARKING White, 3 digits „•“ marks pin 1 & 6

Contextual Info: 6104500 5x20 Fuse ̋" Plastic Body: Rqn{cokfg"808 Fuse 6104110 5x20 LED 6104600 5x20 Disconnect ̋"Clamp: Jctfgpgf"uvggn."gngevtq/ rncvgf"ykvj"|kpe"{gnqy"ejtqocvgf ̋"Screws: Uvggn."|kpe"rncvgf"cpf" {gnnqy"ejtqocvgf ̋"Marking: 6"unqvu"qp"dqvj"ukfgu ̋"Tracking Resistance: "

Contextual Info: TA4101F TOSHIBA TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC T A A 1 fl 1 F • M m ■ ■ ■ ■ UHF VHF MIX APPLICATION FEATURES • Double Balance circuit PIN ASSIGNMENT TOP VIEW MARKING 8 7 6 5 n n n n 8 7 6 5 n n n n / . / 4101F u

CND1J

Abstract: CND1J10K CND1J10Y CND2B10 CND2B10V MARKING CND
Contextual Info: NETWORKS bussed r-networks CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR a b CND1J10VK , CND2B10 a CND1J10K Black CND2B10Vb CND1J10Y, CND2A10Y

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

TI QFN marking

Abstract: TPS59611
Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION

2E9Z

Abstract: 2b5z
Contextual Info: KOA SPEER ELECTRONICS, INC. SS-217 R1 AHA 4/21/05 Chip Networks Resistors Type CNB & CND Series CERTIFIED CERTIFIED 1. Features • ■ ■ ■ Manufactured to type RK73 standards Four or eight bussed resistor elements included in one array Concave or convex termnations

CND1J

Abstract: SS 3002 array resistor mil kt 814 CND1J10K CND1J10Y RK73
Contextual Info: SS-217 R2 6/4/07 1:29 PM Page 1 KOA SPEER ELECTRONICS, INC. SS-217 R2 AHA 6/04/07 Chip Networks Resistors Type CNB & CND Series CERTIFIED CERTIFIED 1. Features • ■ ■ ■ Concave or convex termnations Manufactured to type RK73 standards Four or eight bussed resistor elements included in one array

Contextual Info: KOA SPEER ELECTRONICS, INC. SS-217 R4 AHA 8/16/12 Chip Networks Resistors Type CNB & CND Series CERTIFIED CERTIFIED 1. Features • Concave or convex termnations Manufactured to type RK73 standards ■ Four or eight bussed resistor elements included in one array ■ Less board space than individual chips

Contextual Info: 0.500±0.02 12.70±0.61 0.22 5.59 0.083 2.11 0.16 4.00 0.19±0.006 4.7±0.15 0.211±0.012 5.35±0.30 0.45±0.006 11.4±0.15 0.083 2.11 Recommended Land Pattern 0.374 9.50 0.406 Max. 10.31 0.16 Max. 4.2 Input/ Output Input/ Output CND 0.0276±0.004 0.70±0.10

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE OPTION ADDENDUM

Cat3

Abstract: PAIR CAT3 25 Pair cable
Contextual Info: 25P Cat3 UTP with GEL , Direct burial Cable Specification 25x2×0.475 Cross Section Performance Electrical Characteristics: Impendance ohms Jacket Cndutor Insulation 17 16 18 6 5 15 19 7 4 14 2 20 8 1 3 12 13 21 9 10 11 25 22 23 24 Jacket Twisted pair Rip

Contextual Info: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE OPTION ADDENDUM

SN 4931

Contextual Info: Data sheet E 1/4.931 - 10497 CND. 4to precision resistor networks dual - in - line 22 – ceramic sandwich or conformal coating 45iV A dual - in - line ceramic package in an almost limitless variety of sizes and configurations. A rugged packaging technique with 4 - 22 leads that allows higher resistance integration than chip and wire ceramic packages.