MARKING 2299 MOS Search Results

Contextual Info: LTC2299 Dual 14-Bit, 80Msps Low Power 3V ADC U FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ DESCRIPTIO Integrated Dual 14-Bit ADCs Sample Rate: 80Msps Single 3V Supply 2.7V to 3.4V Low Power: 444mW 73dB SNR at 70MHz Input 90dB SFDR at 70MHz Input

LT 8209

Abstract: FS 8201 jedec package MO-220 64-led LTC2282 LTC2284 LTC2291 LTC2292 LTC2293 LTC2294 LTC2296
Contextual Info: LTC2299 Dual 14-Bit, 80Msps Low Power 3V ADC U FEATURES DESCRIPTIO • The LTC 2299 is a 14-bit 80Msps, low power dual 3V A/D converter designed for digitizing high frequency, wide dynamic range signals. The LTC2299 is perfect for demanding imaging and communications applications

Contextual Info: Winbond DC Fan Pre-Driver W83391TS W83391TG W83391TS/TG W83391TS/TG Data Sheet Revision History VERSION PAGES DATES VERSION 1. N.A Sep/04 0.5 N.A. All versions before 0.5 are for internal use and W83391DG/TG/QG are Pb-free package. 2. N.A Jan/06 0.51 N.A Remove W83391DS/DG

KTY81

Abstract: KTY81-220 KTY81-220 w 23 KTY81-2series KTY81-210 KTY81-222 W1 3009
Contextual Info: KTY81 series Silicon temperature sensors Rev. 05 — 25 April 2008 Product data sheet 1. Product profile 1.1 General description The temperature sensors in the KTY81 series have a positive temperature coefficient of resistance and are suitable for use in measurement and control systems. The sensors are

KTY82-150

Abstract: BLD 122 KTY82-1 Series MSA923 1937 sot23 el 1533 max 1786 STR 2367 941 3m 24 5077 50 110 861
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D088 KTY82-1 series Silicon temperature sensors Product specification Supersedes data of 1996 Dec 05 File under Discrete Semiconductors, SC17 1998 Mar 26 Philips Semiconductors Product specification Silicon temperature sensors

232-100-H5

Abstract: J29-J35
Contextual Info: A H G K B J MIL-DTL 38999 F E C MS27478 Solder Mount Hermetic Receptacle D MIL-DTL-38999 Series II How To Order: MS Shell Style MS27478 - Solder Mount, Series II B Contact Termination P - Pin, Solder Cup S - Socket, Solder Cup X - Pin, Eyelet Z - Socket, Eyelet

06324 wire feed through

Abstract: MS27471
Contextual Info: MIL-DTL 38999 MS27471 Solder Mount Hermetic Receptacle MIL-DTL-38999 Series I How To Order: MS Shell Style B MS27471 - Solder Mount, Series I Contact Termination P - Pin, Solder Cup S - Socket, Solder Cup X - Pin, Eyelet Z - Socket, Eyelet C - Pin, PCB D - Socket, PCB

MS2747

Abstract: MS27476
Contextual Info: D38999 QPL Hermetics MS27476 Box Mount Hermetic Receptacle MIL-DTL-38999 Series II How To Order: MS Connector Material / Finish D - Carbon Steel - Fused Tin Finish E - Stainless Steel - Passivate Finish N - Stainless Steel - Nickel Finish Shell Style MS27476 - Box Mount, Series II

232-100-H0

Abstract: 06324 wire feed through MARKING code h97 1725B MS27475
Contextual Info: MIL-DTL 38999 MS27475 Wall Mount Hermetic Receptacle MIL-DTL-38999 Series II How To Order: MS Shell Style MS27475 - Wall Mount, Series II B Contact Termination P - Pin, Solder Cup S - Socket, Solder Cup H X - Pin, Eyelet A Z - Socket, Eyelet B C - Pin, PCB

MS27469

Contextual Info: MIL-DTL 38999 MS27469 Wall Mount Hermetic Receptacle MIL-DTL-38999 Series I ø How To Order: MS A H Shell Style B MS27469 - Wall Mount, Series I Connector Material / Finish D - Carbon Steel - Fused Tin Finish E - Stainless Steel - Passivate Finish N - Stainless Steel - Nickel Finish

kty81 application note

Abstract: ,kty81 application note SOD70 KTY81-110 KTY81 Philips application note using kty81 el 1533 KTY81-122 KTY81-122 application MSA923
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D239 KTY81-1 series Silicon temperature sensors Product specification Supersedes data of 1998 Mar 26 2000 Aug 25 Philips Semiconductors Product specification Silicon temperature sensors KTY81-1 series DESCRIPTION

Contextual Info: /Turm _LTC1049 TECHNOLOGY Low Power Chopper Stabilized Operational Amplifier with Internal Capacitors F€OTUR€S D C S C R IPTIO n • Low Supply Current 200|liA ■ No External Components Required ■ Maximum Offset Voltage lO^V ■ Maximum Offset Voltage Drift 0.1 iV/°C

Contextual Info: Winbond ExpressCard Power Interface Switch W83L351G W83L351G PRELIMINARY W83L351G Data Sheet Revision History 1. PAGES DATES VERSION N.A Mar./06 0.5 VERSION ON WEB N.A. MAIN CONTENTS All versions before 0.5 are for internal use only. Please note that all data and specifications are subject to change without notice. All

Contextual Info: SN54LV164A, SN74LV164A 8-BIT PARALLEL-OUT SERIAL SHIFT REGISTERS SCLS403D – APRIL 1998 – REVISED JANUARY 2001 D D D D SN54LV164A . . . J OR W PACKAGE SN74LV164A . . . D, DB, DGV, NS, OR PW PACKAGE TOP VIEW 2-V to 5.5-V VCC Operation Typical VOLP (Output Ground Bounce)

M39029/88

Abstract: 40M38298 D38999/49
Contextual Info: Qwik Connect GLENAIR n A p ril 2011 n VOLUME 15 n NUMBER 2 Connector Reference Guide QwikConnect WELCOME INTERCONNECT PROFESSIONALS! H igh performance MS type electrical connectors have been around since the late ’30s. As military and aerospace electronics became more prevalent and sophisticated, so did

marking BDR

Abstract: 10SON
Contextual Info: TPS61020, TPS61024 TPS61025, TPS61027, TPS61028 3,25 mm x 3,25 mm www.ti.com SLVS451C – SEPTEMBER 2003 – REVISED JUNE 2005 96% EFFICIENT SYNCHRONOUS BOOST CONVERTER WITH 1.5-A SWITCH FEATURES • • • • • • • • • • • DESCRIPTION 96% Efficient Synchronous Boost Converter

w39v040bpz

Abstract: WINBOND W39v040BPZ W39V040BP FFBC0000 FFBC0100 W39V040A W39V040B
Contextual Info: W39V040B Data Sheet 512K x 8 CMOS FLASH MEMORY WITH LPC INTERFACE Table of Contents1. GENERAL DESCRIPTION . 3 2. FEATURES . 3

W39V040BP

Contextual Info: W39V040B Data Sheet 512K x 8 CMOS FLASH MEMORY WITH LPC INTERFACE Table of Contents1. GENERAL DESCRIPTION . 3 2. FEATURES . 3

winbond 25X80VSIG

Abstract: Winbond 25X80VAIZ Winbond 25X40VAIZ 25X80VAIZ winbond WINBOND 25x40vsig
Contextual Info: W25X10, W25X20, W25X40, W25X80 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI -1- Publication Release Date: March 21, 2007 Revision K W25X10, W25X20, W25X40, W25X80 Table of Contents 1. GENERAL DESCRIPTION . 4

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge -I- Publication Release Date: April 14, 2005 Revision 1.0 Preliminary W86L488 Table of Content: 1. GENERAL DESCRIPTION . 1

plji

Contextual Info: COM’L: H-5/7/10/15/25, Q-10/15/25 IND: H-10/15/20/25 PALCE22V10 Family 24-Pin EE CMOS Versatile PAL Device MIL: H-10/15/20/25/30 a Advanced Micro Devices DISTINCTIVE CHARACTERISTICS • As fast as 5 ns propagation delay and 142.8 MHz fMAx external Global asynchronous reset and synchronous

Contextual Info: W39V040A Data Sheet 512K x 8 CMOS FLASH MEMORY WITH LPC INTERFACE Table of Contents1. GENERAL DESCRIPTION . 4 2. FEATURES . 4

dc welding machine circuit diagram rohs ct 416

Abstract: KEMA KEUR thermostat submersible motor winding formula
Contextual Info: Cord & Cordset Products FO R INDU STRIAL, COMME RCI AL AN D SP ECI ALT Y AP P L I CAT I O N S Cord & Cordset This catalog contains in-depth information on the most comprehensive line of cord and cordset products. General Cable’s flexible cord products are available

Contextual Info: W25X16, W25X32, W25X64 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI -1- Publication Release Date: February 2, 2007 Preliminary - Revision D W25X16, W25X32, W25X64 Table of Contents1. GENERAL DESCRIPTION . 4