|
54112-106101000RLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54112-106101050LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54122-106101000RLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch |
PDF
|
|
|
10129206-1010001LF
|
|
Amphenol Communications Solutions
|
DDR4 Ultra Low Profile Memory Module Sockets, Storage and Server System, Through Hole Termination, 288 Positions, 0.85mm (0.033in) Pitch. |
PDF
|
|
