| 54112-109160800LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch. | PDF |  | 
| 75160-806-10LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch | PDF |  | 
| 59132-G26-08-035LF |  | Amphenol Communications Solutions | Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch | PDF |  | 
| 460-8025-063 |  | Amphenol Communications Solutions | VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, open, adv mate, 4.25mm (0.167in), Header. | PDF |  | 
| 75160-802-04LF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,4 position, 2.54mm pitch | PDF |  |