LQFP32 PACKAGE Search Results

EP116

Abstract: EP105 LVE164 LVEP210 ECLLQFP32EVB LQFP32 RO4003 capacitor 0.1 mf EP1968 EP451
Contextual Info: ECLLQFP32EVB Evaluation Board Manual for High Frequency LQFP32 http://onsemi.com EVALUATION BOARD MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 32-lead LQFP package. These evaluation boards are offered as a convenience for the customers

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT401-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: ECLLQFP32EVB Evaluation Board User's Manual for High Frequency LQFP32 http://onsemi.com EVAL BOARD USER’S MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 32−lead LQFP package. These evaluation boards are offered as a convenience for the customers

Contextual Info: L99H01 Motor bridge driver for automotive applications Datasheet - production data Applications • Wiper • Power door • Seat belt tensioner • Seat positioning LQFP32 7x7mm PowerSSO-36 • Valve tronic • Park break • 2H motors Features Description

Contextual Info: Philips Semiconductors CMOS and NMOS 8-bit microcontroller family 3300 FAMILY CMOS continued TYPE 3359A ROM 2 RAM SPEED (MHz) 64 1-16 PACKAGE DIL28 S028 LQFP32 3745A 4.5k (OTP) 256 1-16 FUNCTIONS OM5501/2 16 I/O lines, 8-bit timer, RTC, VDD 1.8V-6V 2 Programmable

32P6U-A

Contextual Info: R8C/11 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol

STM8S103FX

Abstract: stm8sp103 STM8S103K3 STM8S103F3 STM8S103Kx STM8S103 UFQFPN20-pin stm8s103xx STM8S103F2 adc example sTM8s
Contextual Info: STM8S103K3 STM8S103F3 STM8S103F2 Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data EEPROM,10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts LQFP32 7x7 UFQFPN32 5x5 • • Up to 27 external interrupts on 6 vectors

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LQFP32 package SOT358-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: L99H01 Motor bridge driver for automotive applications Datasheet - production data Applications • Wiper • Power door • Seat belt tensioner • Seat positioning LQFP32 7x7mm PowerSSO-36 • Valve tronic • Park break • 2H motors Features Description

PLQP0032GB-A

Abstract: P-LQFP32 32P6U-A lqfp32 91ze 1D24
Contextual Info: JEITA Package Code P-LQFP32-7x7-0.80 RENESAS Code PLQP0032GB-A Previous Code 32P6U-A MASS[Typ.] 0.2g HD *1 D 24 17 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 16 25 bp c c1 HE *2 E b1 Reference

LQFP32-P-0707-0

Abstract: 32P6U-a
Contextual Info: R8C/10 Group Appendix 1. Package Dimensions Appendix 1. Package Dimensions 32P6U-A MMP Plastic 32pin 7✕7mm body LQFP Weight g JEDEC Code – Lead Material Cu Alloy MD b2 HD D 32 ME e EIAJ Package Code LQFP32-P-0707-0.80 25 I2 24 Recommended Mount Pad Symbol

STM8S

Abstract: 5401 DM transistor STM8S003F3 UFQFPN20-pin PWM generation STM8s stm8s003 STM8S003K3 STM8S00 5401 DM STM8 CPU programming manual
Contextual Info: STM8S003K3 STM8S003F3 Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts • • Up to 27 external interrupts on 6 vectors LQFP32 7x7

stm8s003

Abstract: STM8S003F3 STM8S003F STM8S003K3 5401 DM transistor UFQFPN20-pin stm8s00 5401 DM transistor equivalent 505a PWM generation STM8s
Contextual Info: STM8S003K3 STM8S003F3 Value line, 16 MHz STM8S 8-bit MCU, 8 Kbytes Flash, 128 bytes data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²C Interrupt management Nested interrupt controller with 32 interrupts • • Up to 27 external interrupts on 6 vectors LQFP32 7x7

JEP95

Abstract: bc 7-25 LQFP32 LQFp32 weight A2MA
Contextual Info: ZMD-Standard April 2002 Package LQFP32 7 x 7 MDS 738 Supersedes Edition 11.95 Dimensions in millimetres Based on JEDEC JEP95: MO-136 BC 1 Dimensions Detail Z A A2 Z G c LP HE 32 e E b 0,2 M A1 0,1 1 D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1

Contextual Info: Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1 c y X 24 A 17 16 25 ZE e E HE A A2 A 1 A 3 wM θ bp Lp pin 1 index L 32 9 1 detail X 8 e ZD wM bp v M A D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

HTQFP100

Abstract: LQFP48 HBCC32 DB4042 CGY2110 TZA3001 TZA3013 TZA3023 TZA3031 TZA3033
Contextual Info: MSD818 Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part number Datarate Mb/s Package Type Bare Die TRANSIMPEDANCE AMPLIFIERS TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 155 622 1250 2488 3250 10700 39813 SO8 SO8 SO8 HVQFN24

LQFP48

Abstract: cgy2141 LQFP32 TZA3013 TZA3023 TZA3033 TZA3043 TZA3012 CGY2151
Contextual Info: Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part Number Datarate Mb/s TRANSIMPEDANCE AMPLIFIERS TZA3033 155 TZA3023 622 TZA3043 1250 TZA3013 2488 CGY2102 3250 CGY2110 9953 CGY2140 39813 Package Type SO8 SO8 SO8 - Bare Die X X X X X X X

8401B

Contextual Info: Phifips Semiconductors CMOS and NMOS 8-bit microcontroller family 8400 FAMILY NMOS TY P E ROM RAM SPEED M H z 8411 8421 8441 8461 1k 2k 4k 6k 64 64 128 128 6 6 6 6 D1L28/S028 DIL28/S028 DIL28/S028 DIL28/S028 20 I/O lines 8-bit timeF Byte |2C 8422 8442 2k

as202-321

Abstract: AS204-80
Contextual Info: Frequency GHz Description Insertion Loss Range (dB) Typ. Isolation Range (dB) Typ. IP3 > 0.5 GHz (dBm) Typ. Package Part Number ♦ 1 ASC02D2-12 GaAsRFICs and Modules Switches Multiport Switches — Typical Power Rating 27 dBm Diversity Switch 0.90-1.30

C8051F350DK

Abstract: C8051F330DK C8051F000 C8051F001 C8051F002 C8051F005 C8051F006 C8051F007 C8051F010 C8051F011
Contextual Info: Flash MIPS Memory RAM Part Number peak (bytes) (bytes) C8051F000 20 32KB 256 C8051F001 20 32KB 256 C8051F002 20 32KB 256 C8051F005 25 32KB 2304 C8051F006 25 32KB 2304 C8051F007 25 32KB 2304 C8051F010 20 32KB 256 C8051F011 20 32KB 256 C8051F012 20 32KB 256

AS121-12

Abstract: ass38 AS131-59 SOT-6 1C
Contextual Info: EHA lpha Commercial 1C Products Selection Guide Plastic Packaged Control Products FETs and Switches Frequency GHz 0.7-2.5 Description Insertion Loss Isolation Range Range (dB) Tÿp. (dB)TVp. High Isolation, Dual Pos. CTL IP3 >0.5 GHz (dBm)Typ. Package Part

FTDI Devices T&R Dimensions

Abstract: FT232R LQFP Package tray SSOP-28 FTDI FT232RL
Contextual Info: Future Technology Devices International Ltd. Application Note AN_116 FTDI Devices T&R Dimensions Document Reference No.: FT_000154 Version 1.5 Issue Date: 2012-12-10 This document provides information on the tape and reel dimensions for FT232BL, FT245BL, FT232BQ,

NCP1204

Abstract: bipolar power transistor data NCP4000 SO32W NCP1450 dual zener common anode NCP801 DC-DC Step-Up Converter for White LED TSOP RECEIVER MOSFET P-CH 250V 5A
Contextual Info: Rev. 9, 2Q02 SGD503/D POWER MANAGEMENT SOLUTIONS ANALOG PRODUCTS DC/DC: Multiphase Controllers Device CS5323 NCP5332A POWER MANAGEMENT SOLUTIONS ANALOG cont. Gate Drive External On-chip Compliance VRM 9.0 VRM 9.0 Package SO-20W SO-28W Availability NOW May-02

usb 2.0 to ide cable circuit diagram

Abstract: flash interface C8051F340 8051 CPU C8051F320DK microcontroller 8051 medical APPLICATION LQFP32 c8051f320 usb LQFP32 package C8051F340 C8051F343
Contextual Info: USB Microcontrollers INTEGRATED USB 2.0 FUNCTION CONTROLLER FEATURES • USB 2.0 – Integrated transceiver – Integrated clock recovery – 1 kB buffer RAM – Full 12 Mbps or low-speed operation – Control endpoint plus six bi-directional endpoint pipes