|
TLP109
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), 1 Mbps, 3750 Vrms, 5pin SO6 |
Datasheet
|
|
|
95278-502B34LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating |
PDF
|
|
|
95278-102B34LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating |
PDF
|
|
|
95278-802B34LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating |
PDF
|
|
|
95278-402B34LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
