LGA-16 LAND PATTERN Search Results

lga16 land pattern

Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
Contextual Info: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and

LGA16 footprint

Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
Contextual Info: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

WBSOIC-16

Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output

Si8233BB-C-IS

Abstract: LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments      Two completely isolated drivers  60 ns maximum propagation in one package delay Up to 5 kVRMS input-to-output  Independent HS and LS inputs or

LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

SI8235

Abstract: Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features   Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions

LGA land pattern

Abstract: SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SOIC-16 SI8233AD-C-IS si8235
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation

Si8235-BA-C-IS1

Abstract: LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions

Si8233

Abstract: LGA-24 land pattern LGA PACKAGE thermal resistance
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation

Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions

Si8237/8

Abstract: SI8233BD
Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions

LGA1366

Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
Contextual Info: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA

Contextual Info: P R E L I M I N A RY QuietPower QPI-2L QPI-2, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-2 The QPI-2 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active

Contextual Info: P R E L I M I N A RY QuietPower QPI-1 L QPI-1, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active

Contextual Info: P R E L I M I N A RY QuietPower QPI-1 B&L QPI-1, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active

LGA land pattern

Abstract: LGA resistance 12 pin lga
Contextual Info: P R E L I M I N A RY QuietPower QPI-1L QPI-1, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active

Contextual Info: P R E L I M I N A RY QPI-1 B&L QPI-1: 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-1 The QPI-1 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active filtering provides superior differential attenuation

pcb design of zigbee

Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
Contextual Info: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor

photodiode dvd cd

Abstract: photodetector IC dvd ic photodetector DVD PDIC dvd cd dvd laser pickup sony CD Laser pickup CXA2676GA PDIC dvd cd sony photodiode dvd cd photodetector
Contextual Info: Optical Pickup Chipset with CD/DVD Recording Photodetector IC PDIC Supports High-Speed Writing to both CD and DVD Media CXA2677GA CXA2676GA The signal processing required for DVD is far more complex than that for CD. Sony has now developed an optical pickup chipset, the

MMA7450L

Abstract: MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers
Contextual Info: Document Number: MMA7450L Rev 2, 7/2007 Freescale Semiconductor Technical Data ±2g/±4g/±8g Three Axis Low-g Digital Output Accelerometer The MMA7450L is a Digital Output I2C/SPI , low power, low profile capacitive micromachined accelerometer featuring signal conditioning, a low

MARKING T6C

Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
Contextual Info: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change

QAD-00046

Abstract: SE5503A 5503A JESD22-A114 P802 S211 S2132 SE5503A-R QAD-00047 LGA land pattern
Contextual Info: SE5503A Dual Band 802.11a/b/g/n Wireless LAN Front End Preliminary Information Applications ƒ ƒ ƒ ƒ ƒ Product Description The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,