LGA WEIGHT Search Results

LICC

Abstract: kyocera mlcc military capacitors lga components
Contextual Info: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown

LGS-5A-15-OV-R

Abstract: Lambda Hybrid LGS-FA-28-OV-R lambda lgs f 28 ov r LGS-FA-15-0V-R lambda lg lgs-eea lambda lga f lambda lgs-eea-15 lambda LAS
Contextual Info: 5 YEAR GUARANTEED SWITCHING Lambda LG and LGA series Features—LG and LGA series 5-year guaranteed switching power supplies Sprague computer grade hermetically sealed 10-year life electrolytic capacitor 4 package sizes up to 190A, up to 48 Volts Hermetically sealed semiconductors

L00103

Abstract: CISPR22 SR-332 048X0 L01103
Contextual Info: MYLG100503 Series www.murata-ps.com Programmable Output 3-Amp LGA-SMT PoLs PRODUCT OVERVIEW Typical unit The MYLG1 series are miniature non-isolated Point-of-Load PoL DC/DC power converters for embedded applications. The tiny form factor is configured on a Land Grid Array (LGA) assembly

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 8 x 8 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 6 x 7 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

LGA weight

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 4 x 4 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

LGA weight

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 6 x 6 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

"material declaration"

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 7 x 7 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 9 x 9 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 5 x 5 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: Restriction of Hazardous Substances RoHS Material Declaration: LGA 8L 4.9 x 3.2 mm (-315) Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):

Contextual Info: BMA222 BMA222 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA222 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15

LIS302DL c source

Abstract: LIS302DL self test example AN2335 LIS302DL self test LIS302DL LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14
Contextual Info: AN2335 Application note LIS302DL: 3-Axis - ±2g/±8g digital output ultracompact linear accelerometer Introduction This document is intended to give application notes for the low-voltage 3-axis digital output linear MEMS accelerometer provided in LGA package.

AN3308

Abstract: LIS3DH A1D15 mems accelerometer automotive lis3dh st AN330 A2D1 A3D9 A3D5 zd15
Contextual Info: AN3308 Application note LIS3DH: MEMS digital output motion sensor ultra low-power high performance 3-axis “nano” accelerometer Introduction This document describes the low-voltage 3-axis digital output linear MEMS accelerometer provided in an LGA package.

Contextual Info: This document was generated on 06/10/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: 105142-8100 Active Description: LGA 2011-0 Standard ILM Assembly with Cover Documents: Drawing PDF Application Specification AS-105142-001 (PDF)

IP2003AP

Contextual Info: PD-97051 iP2003APbF Synchronous Buck Multiphase Optimized LGA Power Block Features: • • • • • • • • • Integrated Power Semiconductors, Drivers & Passives Full function multiphase building block Output current 40A continuous with no derating up to

IP2003AP

Abstract: tx2420 IP2003APBF AN-1028 AN-1030 AN-1047 C3225X5R1C106KT EIA-541 LGA rework PD-97051A
Contextual Info: PD-97051A iP2003APbF Synchronous Buck Multiphase Optimized LGA Power Block Features: • • • • • • • • • Integrated Power Semiconductors, Drivers & Passives Full function multiphase building block Output current 40A continuous with no derating up to

IPC-7527

Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
Contextual Info: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single

Contextual Info: This document was generated on 02/04/2013 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 47594-0002 Active 1.01mm by 1.01mm Pitch LGA 1366 Server CPU Socket, 0.762µm Gold Au Plating, 1366 Circuits, Lead-Free Documents:

LGA1366

Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
Contextual Info: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA

BOSCH marking code

Abstract: bosch accelerometer sensor integrated circuit BOSCH BMA145 J-STD-033A MO-229 bosch 5.4 bosch vehicle sensors automotive sensors bosch bosch automotive electronic
Contextual Info: BMA145 BMA145 Data sheet Triaxial, analog Triaxial, acceleration sensor analog acceleration sensor Bosch Sensortec Data sheet BMA145 Data sheet Device order code 0 273 141 027 Package type 16-pin LGA Data sheet revision 1.2 Release date 06 February 2009 Document number

MX010

Abstract: MX08 H5401NL H5400NL H5400NLT MX37 mct2 TD018
Contextual Info: 1000BASE-T QUAD GIGABIT MAGNETICS Designed to Support PoE, Auto MDIX and RoHS Compliant IN AR Y World’s smallest Gigabit Quad isolation transformer module All pairs are symmetrical and balanced Reliable surface mount LGA land grid array Compact footprint, reduced board space

socket 775 pinout

Abstract: lga775land 775Vr socket 775 pinout bsel 60Ghz Pentium4 socket am3 pinout LGA775 pentium4 478 Socket 478 VID pinout
Contextual Info: Intel Pentium® 4 Processor Supporting Hyper-Threading Technology1 Datasheet 3.80F GHz, 3.60F GHz, 3.40F GHz, 3.20F GHz on 90 nm Process in 775-land LGA Package and supporting Intel® Extended Memory 64 Technology2 for single processor servers and workstations

q6600

Abstract: pinout diagram for q6600 xeon e5 cpuid intel(r) Q6600 intel core 2 extreme quad-core QX6700 socket 775 pinout bsel 06F7h pinout diagram for lga775 socket am3 pinout LGA775
Contextual Info: Intel Core 2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet —on 65 nm Process in the 775-land LGA Package supporting Intel® 64 architecture and Intel® Virtualization Technology± August 2007