LGA RESISTANCE Search Results

LGC-KP609

Abstract: LGA-S601LC LGA-S620LC
Contextual Info: Optical Fiber Connectors MU-Type Optical Fixed Attenuator Optical Fixed Attenuator MU-Type MU-Type Optical Fixed Attenuator Item number Mode Attenuation Quantity and Tolerance LGA-S601KCA 1±0.5dB LGA-S603KCA 3±1.0dB LGA-S605KCA LGA-S610KCA Single Mode 5±1.5dB

Contextual Info: Optical Fiber Connectors SC-Type Optical Fixed Attenuator Optical Fixed Attenuator SC-Type SC-Type Optical Fixed Attenuators Item number Mode Attenuation Quantity and Tolerance LGA-SHP305S 5±1.5dB LGA-SHP310S 10±1.5dB LGA-SHP320S Optical Max Resistance Input

LGA-G103

Contextual Info: Optical Fiber Connectors FC-Type Optical Fixed Attenuator Optical Fixed Attenuator FC-Type FC-Type Optical Fixed Attenuator Mode Single Mode 10±1.5dB LGA-SE115C 15±1.5dB LGA-SE120C 20±1.5dB LGA-SHPE105C 5±1.5dB LGA-SHPE110C 10±1.5dB Single Mode 1.55 Single Mode

LGA1366

Abstract: LGA 1366 socket LGA 1366
Contextual Info: Introducing Sockets and Hardware for LGA 1366 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The

socket lga 1156

Abstract: LGA1156 socket 1156 Intel lga 1156 lga 1156
Contextual Info: Introducing Sockets and Hardware for LGA 1156 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever

lga 1366

Abstract: LGA1366 1981837-1 1981467-1 1939739-1 1981837-2
Contextual Info: Introducing Sockets and Hardware for LGA 1366 Processors Tyco Electronics’ surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The

lga 1156

Abstract: socket lga 1156 LGA1156 tyco reference Socket gold Intel lga 1156 Intel nor flash
Contextual Info: Introducing Sockets and Hardware for LGA 1156 Processors Tyco Electronics’ surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever

LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

LICC

Abstract: kyocera mlcc military capacitors lga components
Contextual Info: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown

LGS-5A-15-OV-R

Abstract: Lambda Hybrid LGS-FA-28-OV-R lambda lgs f 28 ov r LGS-FA-15-0V-R lambda lg lgs-eea lambda lga f lambda lgs-eea-15 lambda LAS
Contextual Info: 5 YEAR GUARANTEED SWITCHING Lambda LG and LGA series Features—LG and LGA series 5-year guaranteed switching power supplies Sprague computer grade hermetically sealed 10-year life electrolytic capacitor 4 package sizes up to 190A, up to 48 Volts Hermetically sealed semiconductors

land pattern 0805

Abstract: T5500
Contextual Info: FL02M653.02 - Page 1 of 2 Product Family: Bessel Absorptive Filter—5th Order, LGA Part Number Series: FL5-LGA Series Construction: Features: •       High Purity Alumina Substrate Nickel alloy thin-film resistive element

L00103

Abstract: CISPR22 SR-332 048X0 L01103
Contextual Info: MYLG100503 Series www.murata-ps.com Programmable Output 3-Amp LGA-SMT PoLs PRODUCT OVERVIEW Typical unit The MYLG1 series are miniature non-isolated Point-of-Load PoL DC/DC power converters for embedded applications. The tiny form factor is configured on a Land Grid Array (LGA) assembly

EIA 364-60

Abstract: EIA-364-60 EIA-364-32 Socket-F Tyco AMD thermal design retention mechanism LGA1207 EIA-364-20 EIA-364-21 LF-LGA1207 LGA socket
Contextual Info: lever actuated Land Grid Array LGA 1207 position socket LGA1207 and LF-LGA1207 1. SCOPE 1.1. Content Product specification 108-78375 24 AUG 2006 Rev.A This specification covers performance, tests and quality requirements for the Tyco Electronics lever actuated Land Grid Array (LGA) socket F 1207.

LGA 2011 Socket diagram

Abstract: BR17
Contextual Info: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X and i7-3970X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series

NP195

Contextual Info: NP195 - Zero Insertion Force Land Grid Array - Open Top LGA Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Contact Force: Part Number (Details) NP195 - 625 01 - x 1,000MΩ min. at 500V DC

pogo pins

Abstract: IC274-084344 bga 1296 lga 388 IC274-036274 IC274-048278 IC274-056310 IC274-073158 IC274-080305 IC274-11901
Contextual Info: IC274 Series Test Contactor SMT Pogo Pins (LGA, BGA, CSP - 0.50 to 1.50mm Pitch) Part Number (Details) Specifications 1MΩ min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 200m Ω max. at 10mA/20mV max.

lsm9ds1tr

Abstract: LGA-24L
Contextual Info: LSM9DS1 iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer Datasheet - preliminary data Applications • Indoor navigation  Smart user interfaces  Advanced gesture recognition  Gaming and virtual reality input devices LGA-24L 3.5x3x1.0 mm

LSM9DS0

Contextual Info: LSM9DS0 iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer Datasheet - production data Applications • Indoor navigation  Smart user interfaces  Advanced gesture recognition  Gaming and virtual reality input devices LGA-24 4x4x1.0 mm

LIS2DH12

Contextual Info: LIS2DH12 MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer Datasheet - production data Applications • Motion-activated functions  Display orientation  Shake control  Pedometer LGA-12 2.0x2.0x1 mm

Contextual Info: BMA222 BMA222 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA222 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15

LIS302DL c source

Abstract: LIS302DL self test example AN2335 LIS302DL self test LIS302DL LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14
Contextual Info: AN2335 Application note LIS302DL: 3-Axis - ±2g/±8g digital output ultracompact linear accelerometer Introduction This document is intended to give application notes for the low-voltage 3-axis digital output linear MEMS accelerometer provided in LGA package.

Contextual Info: Freescale Semiconductor Advance Information Document Number: MKW22D512V Rev. 0.0, 06/2012 MKW22D512V MKW22D512V


MKW22D512V Also covers MKW21D512V and MKW21D256V Package Information Plastic Package 8x8 56-pin LGA Case 2234-01 Ordering Information Device

MKW22D512V

Abstract: MC13242 ieee 1149.7 MKW21D256V MKW21D512V oqpsk receiver mban VDC to dbm conversion pan1 ewm high precision
Contextual Info: Freescale Semiconductor Advance Information Document Number: MKW22D512V Rev. 0.0, 06/2012 MKW22D512V MKW22D512V


MKW22D512V Also covers MKW21D512V and MKW21D256V Package Information Plastic Package 8x8 56-pin LGA Case 2234-01 Ordering Information Device

Contextual Info: Freescale Semiconductor Advance Information Document Number: MKW22D512V Rev. 0.1, 01/2013 MKW24D512V MKW24D512V


MKW24D512V Also covers MKW22D512V and MKW21D256V Package Information Plastic Package 8x8 56-pin LGA Case 2234-01 Ordering Information Device