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    LGA PACKAGE THERMAL RESISTANCE Search Results

    LGA PACKAGE THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER
    Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical PDF
    TPH1R306PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQH
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Datasheet
    TPH9R00CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Datasheet
    TPHR8504PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Datasheet

    LGA PACKAGE THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    thermal analysis on pcb

    Abstract: flotherm MODEL AN2026 AN-2026 2026 led thermal cfd thermal resistance of low power semiconductor flotherm
    Contextual Info: National Semiconductor Application Note 2026 Lianxi Shen February 8, 2010 Summary Power Module better in thermal performance than other package types. For example, LGA packages have a θJC of about 5C/W or larger for the similar package size, depending on the


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    O-263. AN-2026 thermal analysis on pcb flotherm MODEL AN2026 AN-2026 2026 led thermal cfd thermal resistance of low power semiconductor flotherm PDF

    C25704-002

    Abstract: LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details
    Contextual Info: Intel Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #302822-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


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    775-Land C69175 PSC-2U001 775-Land C25704-002 LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details PDF

    TAIYO PSR 4000

    Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
    Contextual Info: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


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    an114fa AN114-8 TAIYO PSR 4000 TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600 PDF

    LGA 1366

    Abstract: socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 Intel lga 1156 LGA socket
    Contextual Info: Approved by Intel and supporting its top-of-the-line Core i-7 processors, the compact LGA 2011-0 CPU socket provides the electrical, thermal and mechanical reliability servers, workstations and high-end PCs need to achieve target processor performance levels


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    32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA 1366 socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 Intel lga 1156 LGA socket PDF

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


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    AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale PDF

    PI2121

    Abstract: PI2121-00-LGIZ PI2125-00-LGIZ
    Contextual Info: Cool-ORing Series Full-Function Active ORing Solutions, PI2121 / PI2123 / PI2125 PI2121 / PI2123 / PI2125 Features Combines a high-speed ORing MOSFET controller and a very low on-state resistance MOSFET Integrated high-performance MOSFET PI2121: 8 V, 24 A, 1.5 mΩ


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    PI2121 PI2123 PI2125 PI2125 PI2121: PI2123: PI2125: PI2121-00-LGIZ PI2125-00-LGIZ PDF

    SI8235

    Abstract: Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236
    Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features   Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


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    Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8235 Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236 PDF

    WBSOIC-16

    Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
    Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output


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    Si823x Si8230/1/2 SOIC-16 Si8233/4/5/6 LGA-14 SOIC-16 WBSOIC-16 LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS PDF

    Si8233BB-C-IS

    Abstract: LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233
    Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments      Two completely isolated drivers  60 ns maximum propagation in one package delay Up to 5 kVRMS input-to-output  Independent HS and LS inputs or


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    Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 Si8233BB-C-IS LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233 PDF

    Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


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    Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16 PDF

    LGA land pattern

    Abstract: SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SOIC-16 SI8233AD-C-IS si8235
    Contextual Info: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


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    Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 SOIC-16 LGA-14 LGA land pattern SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SI8233AD-C-IS si8235 PDF

    Contextual Info: LTM8023 2A, 36V DC/DC Step-Down µModule Regulator Description Features Complete Step-Down Switch Mode Power Supply Wide Input Voltage Range: 3.6V to 36V 2A Output Current 0.8V to 10V Output Voltage Selectable Switching Frequency: 200kHz to 2.4MHz Current Mode Control


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    LTM8023 200kHz LTM4612 EN55022B LTM4613 LTM8061 8023fi com/LTM8023 PDF

    IC 4614

    Abstract: IC ap 4614 LTM4614V 4614 fet ap 4614 LTM4614 LTM4614IV pin diagram for IC 4614 C4532X5R0J107M 10ce100fh
    Contextual Info: LTM4614 Dual 4A per Channel Low VIN DC/DC µModule Regulator FEATURES DESCRIPTION n The LTM 4614 is a complete 4A dual output switching mode DC/DC power supply. Included in the package are the switching controllers, power FETs, inductors and all support components. The dual 4A DC/DC converters


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    LTM4614 LTM4614 LTM8021 LTM8022 LTM8023 4614fa IC 4614 IC ap 4614 LTM4614V 4614 fet ap 4614 LTM4614IV pin diagram for IC 4614 C4532X5R0J107M 10ce100fh PDF

    l949a

    Contextual Info: Rev 3; 9/06 50MHz to 122.88MHz VCXO The DS4077 is an integrated voltage-controlled crystal oscillator VCXO module designed to provide reference clock generation in base stations, telecom/datacom, and wireless applications. The DS4077 is developed using a


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    50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz 80MHz 20MHz. l949a PDF

    Contextual Info: LTM8032 EN55022B Compliant 36V, 2A DC/DC µModule Regulator Description Features Complete Step-Down Switch Mode Power Supply n Wide Input Voltage Range: 3.6V to 36V n 2A Output Current n 0.8V to 10V Output Voltage n Selectable Switching Frequency: 200kHz to 2.4MHz


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    LTM8032 EN55022B 200kHz EN55022 EN55022. LTM4612 LTM4613 LTM8023 PDF

    Contextual Info: Rev 2; 6/06 50MHz to 122.88MHz VCXO The DS4077 is an integrated voltage-controlled crystal oscillator VCXO module designed to provide reference clock generation in base stations, telecom/datacom, and wireless applications. The DS4077 is developed using a


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    50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-ACN DS4077L-ADN PDF

    DS4077L-CC0

    Abstract: l949a
    Contextual Info: Rev 3; 9/06 50MHz to 122.88MHz VCXO The DS4077 is an integrated voltage-controlled crystal oscillator VCXO module designed to provide reference clock generation in base stations, telecom/datacom, and wireless applications. The DS4077 is developed using a


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    50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz DS4077L-CC0 l949a PDF

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


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    63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 PDF

    LTM8021

    Abstract: LTM4607 LTM4600 LTM4608 LTM4602 LTM4605
    Contextual Info: LTM8021 36VIN, 500mA Step-Down DC/DC µModule Features Description Complete Switch Mode Power Supply Wide Input Voltage Range: 3V to 36V 500mA Output Current 0.8V to 5V Output Voltage Fixed 1.1MHz Switching Frequency Current Mode Control e4 RoHS Compliant Package with Gold


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    LTM8021 36VIN, 500mA 500mA 36VIN 500mA, LTM8021 LTM8020 200mA LTM8022 LTM4607 LTM4600 LTM4608 LTM4602 LTM4605 PDF

    "Voltage Controlled Crystal Oscillator"

    Abstract: 20MHz quartz crystal CRYSTAL 50MHZ datasheet 80MHz quartz LGA Application Notes DS4077 DS4077L-CCN DS4077L-DCN DS4077L-ECN DS4077L-EDN
    Contextual Info: Rev 3; 9/06 50MHz to 122.88MHz VCXO The DS4077 is an integrated voltage-controlled crystal oscillator VCXO module designed to provide reference clock generation in base stations, telecom/datacom, and wireless applications. The DS4077 is developed using a


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    50MHz 88MHz DS4077 12kHz 20MHz -125dBc/Hz 80MHz 20MHz. "Voltage Controlled Crystal Oscillator" 20MHz quartz crystal CRYSTAL 50MHZ datasheet 80MHz quartz LGA Application Notes DS4077L-CCN DS4077L-DCN DS4077L-ECN DS4077L-EDN PDF

    Contextual Info: LTM8023 2A, 36V DC/DC Step-Down µModule Regulator Description Features Complete Step-Down Switch Mode Power Supply Wide Input Voltage Range: 3.6V to 36V 2A Output Current 0.8V to 10V Output Voltage Selectable Switching Frequency: 200kHz to 2.4MHz Current Mode Control


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    200kHz SAC305 LTM8023 8023fh com/LTM8023 PDF

    LTM8023Y

    Abstract: 105k 250v capacitor LGA-80 LGA-60 LTM8023IV-PBF ltm8023mpv#pbf lga60 AT8023 LTM8023V
    Contextual Info: LTM8023 2A, 36V DC/DC Step-Down µModule Regulator DESCRIPTION FEATURES n n n n n n n n n Complete Step-Down Switch Mode Power Supply Wide Input Voltage Range: 3.6V to 36V 2A Output Current 0.8V to 10V Output Voltage Selectable Switching Frequency: 200kHz to 2.4MHz


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    LTM8023 200kHz EN55022B 8023fg LTM8023Y 105k 250v capacitor LGA-80 LGA-60 LTM8023IV-PBF ltm8023mpv#pbf lga60 AT8023 LTM8023V PDF

    Contextual Info: LTM8023 2A, 36V DC/DC Step-Down µModule Regulator DESCRIPTION FEATURES n n n n n n n n n Complete Step-Down Switch Mode Power Supply Wide Input Voltage Range: 3.6V to 36V 2A Output Current 0.8V to 10V Output Voltage Selectable Switching Frequency: 200kHz to 2.4MHz


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    LTM8023 200kHz SAC305 LTM4612 EN55022B LTM4613 LTM8061 8023fg PDF

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Contextual Info: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" PDF