LGA LAND PATTERN Search Results

LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

LICC

Abstract: kyocera mlcc military capacitors lga components
Contextual Info: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown

reflow profile FOR LGA COMPONENTS

Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
Contextual Info: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional

Contextual Info: 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.

Contextual Info: 2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.

LGA land pattern

Abstract: cases lga components
Contextual Info: LGA LAND PATTERN DIMENSIONS b2 e b2 e P-FLGA Unit:mm Pin pitch Land Pattern Dimensions Remark e Land dimeter φ b 2 0.80 0.65 0.45 0.35 0.50 0.24 to 0.30 (The reference value) Only representative dimensions are inscribed above. As there are cases where the dimensions

ST LGA marking code

Contextual Info: 3x5 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.

lga 115

Contextual Info: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector

IPC-7527

Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
Contextual Info: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single

IPC-7527

Abstract: IPC-7525 koki solder paste IPC7527
Contextual Info: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single

C2084

Abstract: AM05-0006 AM05-0005 AM05-0005-TB AM05-0006-TB
Contextual Info: Application Note C2084 Ceramic Surface Mount Amplifier Rev. V3 1. Introduction M/A-COM’s Ceramic Surface Mount amplifier platform offers superior intermodulation performance for IF amplifiers in a commercial LGA Land Grid Array package. This design approach

Ceramic Surface Mount Amplifiers

Abstract: SURFACE MOUNT rf TRANSFORMER AM05-0005 AM05-0005-TB AM05-0006 AM05-0006-TB C2084
Contextual Info: C2084 Application Notes Ceramic Surface Mount Amplifiers V 2.00 1. Introduction M/A-COM’s Ceramic Surface Mount amplifier platform offers superior intermodulation performance for IF amplifiers in a commercial LGA Land Grid Array package. This design approach integrates coupler

C25704-002

Abstract: LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452
Contextual Info: Intel Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #303730-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS

LGA voiding

Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
Contextual Info: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.

ATT0805-03R0DB-T1

Contextual Info: AT02M750.04 - Page 1 of 2 Preliminary Currently in development Construction: •    High Purity Alumina Substrate Ni alloy thin-film resistive elements Ground-Signal-Ground GSG , Land Grid Array (LGA) construction Immersion gold over Ni terminations

RF Board 600-034

Abstract: 25361 895910 data+8873+64+pin+colour+tv+ic
Contextual Info: AH4 The Communications Edge High Dynamic Range Amplifier Product Features Product Description Functional Diagram The AH4 is a high dynamic range amplifier • 0.25-6 GHz Bandwidth Pin 1 indicator packaged in a Land Grid Array LGA surface • 41 dBm Output IP3

AH 05

Abstract: AH05AB
Contextual Info: AH4 The Communications Edge High Dynamic Range Amplifier Actual Size Product Description The AH4 is a high dynamic range amplifier packaged in a Land Grid Array LGA surface mount package for applications thru 6 GHz. The combination of low noise figure and high output

C25704-002

Abstract: LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details
Contextual Info: Intel Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #302822-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS

lga16 land pattern

Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
Contextual Info: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and

LGA16 footprint

Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
Contextual Info: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents

pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
Contextual Info: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1

AN3484

Abstract: MMA73x1L LGA land pattern MMA745xL LGA14
Contextual Info: AN3484 Rev 2, 12/2008 Freescale Semiconductor Application Note Soldering and Mounting Guidelines for the LGA Accelerometer Sensor to a PC Board by: Kimberly Tuck, Cheol Han Sensors and Actuator Solutions Division Tempe, AZ INTRODUCTION MEMS based sensors are sensitive to Printed Circuit Board