LCC PACKAGE Search Results

smd 662

Abstract: 2N7422 2n7425 2N7426 2N7383 601 SMD 2N7389 IRHM9260 2N7422U 2N7219U
Contextual Info: QPL Product Matrix February, 1999 Government & Space Products Package TO39 LCC MO036 MO036 MO036 TO39 LCC TO39 LCC TO3 TO39 LCC TO3 TO39 LCC TO39 LCC TO257 TO257 TO39 LCC TO254 SMD-1 TO254 SMD-1 TO3 TO254 SMD-1 TO254 SMD-1 TO254 TO-254 SMD-1 TO-254 SMD-2 TO-254

CERAMIC LEADLESS CHIP CARRIER

Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
Contextual Info: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)

36 pin CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)

WQFN032-C-R450-1

Abstract: C038
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)

WQFN032-G-R450-1

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Contextual Info: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)

QFN048-C-S560-1

Abstract: LCC-48C-A01
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal LCC-48C-A01 48-pad ceramic LCC (LCC-48C-A01)

QFN016-G-S250-1

Abstract: LCC-16C-F01 R030
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)

WQFN032-C-S420-1

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal LCC-32C-A06 32-pad ceramic LCC (LCC-32C-A06)

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: LCC-64 R020 LCC64 LCC-64C-A01 QFN064-C-S720-1
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal LCC-64C-A01 64-pad ceramic LCC (LCC-64C-A01)

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC5200

Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
Contextual Info: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)

HC2702SLCC

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 C2700 HC2700LLCC TY 1016 HC2700 HC2701 HC2702
Contextual Info: H C2700 LCC Series +10V, Ð 1 0V, and ± 10V Leadless Chip Carrier Precision V oltage References JED EC- Compatible FEA TURES • 2700 Type Reference in Standard LCC Packages • JEDEC-Compatible 28 Pin LCC Style Package • +10, –10, + / –10V olt Ranges

Contextual Info: BUMP CHIP CARRIER 16 PAD PLASTIC LCC-16P-M02 Lead pitch Vertical: 0.80mm Horizontal: 0.65mm Package width x package length 3.40 × 4.55mm Sealing method Plastic mold 16-pads plastic BCC LCC-16P-M02 16-pads plastic BCC (LCC-16P-M02) 4.55±0.10 (.179±.004)

LCC-16P-M03

Contextual Info: BUMP CHIP CARRIER 16 PAD PLASTIC LCC-16P-M03 Lead pitch Vertical: 0.80mm Horizontal: 0.65mm Package width x package length 4.20 × 4.55mm Sealing method Plastic mold 16-pads plastic BCC LCC-16P-M03 16-pads plastic BCC (LCC-16P-M03) 4.55±0.10 (.179±.004)

Contextual Info: PD - 93983A REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS SURFACE MOUNT LCC-18 IRFE120 JANTX2N6788U REF:MIL-PRF-19500/555 100V, N-CHANNEL Product Summary Part Number BVDSS RDS(on) ID IRFE120 100V 0.30Ω 4.5A LCC-18 The leadless chip carrier (LCC) package represents the

IRF 260 N

Abstract: IRFE220 JANTX2N6790U LCC-18
Contextual Info: PD - 93984A REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS SURFACE MOUNT LCC-18 IRFE220 JANTX2N6790U REF:MIL-PRF-19500/555 200V, N-CHANNEL Product Summary Part Number IRFE220 BVDSS 100V RDS(on) 0.80Ω ID 2.8A LCC-18 The leadless chip carrier (LCC) package represents the

IRF 534

Abstract: diode.18 IRFE120 JANTX2N6788U LCC-18
Contextual Info: PD - 93983A REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS SURFACE MOUNT LCC-18 IRFE120 JANTX2N6788U REF:MIL-PRF-19500/555 100V, N-CHANNEL Product Summary Part Number BVDSS RDS(on) ID IRFE120 100V 0.30Ω 4.5A LCC-18 The leadless chip carrier (LCC) package represents the

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 50 PIN PLASTIC LCC-50P-M02 50-pin plastic SOJ Lead pitch 0.80mm Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-50P-M02 50-pin plastic SOJ (LCC-50P-M02) * : Resin protrusion. (Each side : 0.15 (.006) max)

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 26 PIN PLASTIC LCC-26P-M09 26-pin plastic SOJ Lead pitch 50mil Package width 300mil Lead shape J bend Sealing method Plastic mold LCC-26P-M09 26-pin plastic SOJ (LCC-26P-M09) * : Resin protrusion. (Each side : 0.15 (.006) max)

9744

Abstract: 438 j
Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50mil Package width 432mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010) 10.98±0.25 (.432±.010)

CERAMIC LEADLESS CHIP CARRIER

Abstract: a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
Contextual Info: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40mil Package width x package length 420 × 420mil Sealing method Metal seal LCC-32C-A06 *Shape of PIN NO.1 INDEX : Subject to change without notice.