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    LCC PACKAGE Search Results

    LCC PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLC32044MFK/B Rochester Electronics LLC Rochester Manufactured TLC32044, VB Interface, 28 LCC Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    26LS32/B2A Rochester Electronics LLC Rochester Manufactured 26LS32, Line Driver, 20 LCC Package, SMD spec. Visit Rochester Electronics LLC Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    LCC PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    smd 662

    Abstract: 2N7422 2n7425 2N7426 2N7383 601 SMD 2N7389 IRHM9260 2N7422U 2N7219U
    Text: QPL Product Matrix February, 1999 Government & Space Products Package TO39 LCC MO036 MO036 MO036 TO39 LCC TO39 LCC TO3 TO39 LCC TO3 TO39 LCC TO39 LCC TO257 TO257 TO39 LCC TO254 SMD-1 TO254 SMD-1 TO3 TO254 SMD-1 TO254 SMD-1 TO254 TO-254 SMD-1 TO-254 SMD-2 TO-254


    Original     		PDF MO036 O-254 2N6782, IRFF110 2N6782U, IRFE110 smd 662 2N7422 2n7425 2N7426 2N7383 601 SMD 2N7389 IRHM9260 2N7422U 2N7219U

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038
    Text: LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50mil Package width x package length 550 × 550mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01) R0.20(.008) TYP (36 PLCS)


    Original     		PDF LCC-36C-F01 WQFN036-G-S550-1 50mil 550mil 36-pad LCC-36C-F01) C36001SC-1-2 CERAMIC LEADLESS CHIP CARRIER c3600 CERAMIC LEADLESS CHIP CARRIER LCC 68 transistor 36c PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1 C038

    36 pin CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 36-pad ceramic LCC Lead pitch 50 mil Package width x package length 550 × 550 mil Sealing method Frit seal LCC-36C-F01 36-pad ceramic LCC (LCC-36C-F01)


    Original     		PDF LCC-36C-F01 WQFN036-G-S550-1 36-pad LCC-36C-F01) C36001SC-1-2 36 pin CERAMIC LEADLESS CHIP CARRIER LCC transistor 36c WQFN036-G-S550-1 LCC-36C-F01 12 CERAMIC LEADLESS CHIP CARRIER LCC c3600

    WQFN032-C-R450-1

    Abstract: C038
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A01 EIAJ code : WQFN032-C-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Metal seal LCC-32C-A01 32-pad ceramic LCC (LCC-32C-A01)


    Original     		PDF LCC-32C-A01 WQFN032-C-R450-1 32-pad LCC-32C-A01) C32009SC-2-2 WQFN032-C-R450-1 C038

    WQFN032-G-R450-1

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-F01 EIAJ code : WQFN032-G-R450-1 32-pad ceramic LCC Lead pitch 50 mil Package width x package length 450 × 550 mil Sealing method Frit seal LCC-32C-F01 32-pad ceramic LCC (LCC-32C-F01)


    Original     		PDF LCC-32C-F01 WQFN032-G-R450-1 32-pad LCC-32C-F01) C32017SC-2-2 15TYP WQFN032-G-R450-1 CERAMIC LEADLESS CHIP CARRIER LCC 32

    LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
    Text: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)


    Original     		PDF LCC-44C-F01 WQFN044-G-S650-1 50mil 650mil 44-pad LCC-44C-F01) C44001SC-2-2 LCC 44 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1

    QFN048-C-S560-1

    Abstract: LCC-48C-A01
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 48 PAD CERAMIC LCC-48C-A01 EIAJ code :∗QFN048-C-S560-1 48-pad ceramic LCC Lead pitch 40 mil Package width x package length 560 × 560 mil Sealing method Metal seal LCC-48C-A01 48-pad ceramic LCC (LCC-48C-A01)


    Original     		PDF LCC-48C-A01 QFN048-C-S560-1 48-pad LCC-48C-A01) C4800( C48001SC-4-2 QFN048-C-S560-1 LCC-48C-A01

    QFN016-G-S250-1

    Abstract: LCC-16C-F01 R030
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 16 PAD CERAMIC LCC-16C-F01 EIAJ code :∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50 mil Package width x package length 250 × 250 mil Sealing method Frit seal LCC-16C-F01 16-pad ceramic LCC (LCC-16C-F01)


    Original     		PDF LCC-16C-F01 QFN016-G-S250-1 16-pad LCC-16C-F01) C16003S4 C16003SC-2-2 QFN016-G-S250-1 LCC-16C-F01 R030

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: LCC 44 WQFN044-G-S650-1 LCC44 44-pad
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01)


    Original     		PDF LCC-44C-F01 WQFN044-G-S650-1 44-pad LCC-44C-F01) C44001SC-2-2 CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC 44 WQFN044-G-S650-1 LCC44

    WQFN032-C-S420-1

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40 mil Package width x package length 420 × 420 mil Sealing method Metal seal LCC-32C-A06 32-pad ceramic LCC (LCC-32C-A06)


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 32-pad LCC-32C-A06) C32007SC-4-3 WQFN032-C-S420-1 CERAMIC LEADLESS CHIP CARRIER LCC 32

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: LCC-64 R020 LCC64 LCC-64C-A01 QFN064-C-S720-1
    Text: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 64 PAD CERAMIC LCC-64C-A01 EIAJ code :∗QFN064-C-S720-1 64-pad ceramic LCC Lead pitch 40 mil Package width x package length 720 × 720 mil Sealing method Metal seal LCC-64C-A01 64-pad ceramic LCC (LCC-64C-A01)


    Original     		PDF LCC-64C-A01 QFN064-C-S720-1 64-pad LCC-64C-A01) C64001SC-5-2 64 CERAMIC LEADLESS CHIP CARRIER LCC LCC-64 R020 LCC64 LCC-64C-A01 QFN064-C-S720-1

    XC3020A

    Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PDF XC8100 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L

    XC5200

    Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
    Text: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA


    Original     		PDF XC5200 16-Bit 24-Bit 16-to-1 XC5210-5 XC5210-3 XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    HC2702SLCC

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 C2700 HC2700LLCC TY 1016 HC2700 HC2701 HC2702
    Text: H C2700 LCC Series +10V, Ð 1 0V, and ± 10V Leadless Chip Carrier Precision V oltage References JED EC- Compatible FEA TURES • 2700 Type Reference in Standard LCC Packages • JEDEC-Compatible 28 Pin LCC Style Package • +10, –10, + / –10V olt Ranges


    Original     		PDF C2700 HC2700LCC HC2700, HC2701 HC2702 HC2700 HC2702SLCC CERAMIC LEADLESS CHIP CARRIER LCC 24 HC2700LLCC TY 1016

    Untitled

    Abstract: No abstract text available
    Text: BUMP CHIP CARRIER 16 PAD PLASTIC LCC-16P-M02 Lead pitch Vertical: 0.80mm Horizontal: 0.65mm Package width x package length 3.40 × 4.55mm Sealing method Plastic mold 16-pads plastic BCC LCC-16P-M02 16-pads plastic BCC (LCC-16P-M02) 4.55±0.10 (.179±.004)


    Original     		PDF LCC-16P-M02 16-pads LCC-16P-M02) C16013S-1C-1

    LCC-16P-M03

    Abstract: No abstract text available
    Text: BUMP CHIP CARRIER 16 PAD PLASTIC LCC-16P-M03 Lead pitch Vertical: 0.80mm Horizontal: 0.65mm Package width x package length 4.20 × 4.55mm Sealing method Plastic mold 16-pads plastic BCC LCC-16P-M03 16-pads plastic BCC (LCC-16P-M03) 4.55±0.10 (.179±.004)


    Original     		PDF LCC-16P-M03 16-pads LCC-16P-M03) 40package LCC-16P-M03

    Untitled

    Abstract: No abstract text available
    Text: PD - 93983A REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS SURFACE MOUNT LCC-18 IRFE120 JANTX2N6788U REF:MIL-PRF-19500/555 100V, N-CHANNEL Product Summary Part Number BVDSS RDS(on) ID IRFE120 100V 0.30Ω 4.5A LCC-18 The leadless chip carrier (LCC) package represents the


    Original     		PDF 3983A LCC-18) IRFE120 JANTX2N6788U MIL-PRF-19500/555 LCC-18 IRFE120,

    IRF 260 N

    Abstract: IRFE220 JANTX2N6790U LCC-18
    Text: PD - 93984A REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS SURFACE MOUNT LCC-18 IRFE220 JANTX2N6790U REF:MIL-PRF-19500/555 200V, N-CHANNEL Product Summary Part Number IRFE220 BVDSS 100V RDS(on) 0.80Ω ID 2.8A LCC-18 The leadless chip carrier (LCC) package represents the


    Original     		PDF 3984A LCC-18) IRFE220 JANTX2N6790U MIL-PRF-19500/555 LCC-18 IRFE220, IRF 260 N IRFE220 JANTX2N6790U LCC-18

    IRF 534

    Abstract: diode.18 IRFE120 JANTX2N6788U LCC-18
    Text: PD - 93983A REPETITIVE AVALANCHE AND dv/dt RATED HEXFET TRANSISTORS SURFACE MOUNT LCC-18 IRFE120 JANTX2N6788U REF:MIL-PRF-19500/555 100V, N-CHANNEL Product Summary Part Number BVDSS RDS(on) ID IRFE120 100V 0.30Ω 4.5A LCC-18 The leadless chip carrier (LCC) package represents the


    Original     		PDF 3983A LCC-18) IRFE120 JANTX2N6788U MIL-PRF-19500/555 LCC-18 IRFE120, IRF 534 diode.18 IRFE120 JANTX2N6788U LCC-18

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE J-LEADED PACKAGE 50 PIN PLASTIC LCC-50P-M02 50-pin plastic SOJ Lead pitch 0.80mm Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-50P-M02 50-pin plastic SOJ (LCC-50P-M02) * : Resin protrusion. (Each side : 0.15 (.006) max)


    Original     		PDF LCC-50P-M02 400mil 50-pin LCC-50P-M02) C50002S-2C-1

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE J-LEADED PACKAGE 26 PIN PLASTIC LCC-26P-M09 26-pin plastic SOJ Lead pitch 50mil Package width 300mil Lead shape J bend Sealing method Plastic mold LCC-26P-M09 26-pin plastic SOJ (LCC-26P-M09) * : Resin protrusion. (Each side : 0.15 (.006) max)


    Original     		PDF LCC-26P-M09 50mil 300mil 26-pin LCC-26P-M09) C26059S-3C-1

    9744

    Abstract: 438 j
    Text: SMALL OUTLINE J-LEADED PACKAGE 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50mil Package width 432mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010) 10.98±0.25 (.432±.010)


    Original     		PDF LCC-28C-A04 50mil 432mil 28-pin LCC-28C-A04) C28011SC-2-2 9744 438 j

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1
    Text: LEADLESS CHIP CARRIER 32 PAD CERAMIC LCC-32C-A06 EIAJ code : WQFN032-C-S420-1 32-pad ceramic LCC Lead pitch 40mil Package width x package length 420 × 420mil Sealing method Metal seal LCC-32C-A06 *Shape of PIN NO.1 INDEX : Subject to change without notice.


    Original     		PDF LCC-32C-A06 WQFN032-C-S420-1 40mil 420mil 32-pad LCC-32C-A06) C32007SC-4-3 CERAMIC LEADLESS CHIP CARRIER a06 transistor PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN032-C-S420-1