LCC 910 Search Results

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

gold embrittlement

Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782
Contextual Info: AN-652 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards By Hubert Geitner

cmos not

Abstract: cross reference cmos 4000 7120 D 1163 A
Contextual Info: HYBRID CRYSTAL OSCILLATOR SUBMINIATURE HYBRID CRYSTAL OSCILLATORS LEADLESS CHIP CARRIER LCC FEATURES: SERIES: 7110 TTL/ 4110 CMOS 7119 TTL7 4119 CMOS *7120 TTL/ 4120 CMOS • High Reliability • Minimum Size • Surface Mountable • Hermetically Sealed

LT1124

Abstract: OP270 OP470 MSOP-9 op27
Contextual Info: RELIABILITY DATA LT1124 / 1125 / 1126 / 1127 / OP270 / OP470 12/8/2000 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC PLASTIC DIP SOIC/SOT/MSOP 42 9101 80 9318 1,869 9207 228 9505 2,219 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH

LM119

Abstract: LM319 LT1123
Contextual Info: RELIABILITY DATA LM119 / LM319 / LT1123 12/8/2000 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC HERMETIC PLASTIC DIP TO-92 1,058 8433 766 9109 1,934 8318 535 8411 630 8952 4,923 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH

LM119

Abstract: LM319 LT1123 9121
Contextual Info: RELIABILITY DATA LM119 / LM319 / LT1123 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC HERMETIC PLASTIC DIP TO-92 NEWEST DATE CODE 1,138 8433 926 9109 2,014 8318 535 8411 630 8952 5,243 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH

Contextual Info: LCC, TLCC Vishay Thin Film Hermetic, 50 mil Pitch, Leadless Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound

Contextual Info: LCC, TLCC Vishay Thin Film Hermetic, 50 mil Pitch, Leadless Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound

LT1124

Abstract: OP270 OP470
Contextual Info: RELIABILITY DATA LT1124 / 1125 / 1126 / 1127 / OP270 / OP470 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE CERDIP FLATPAK/LCC PLASTIC DIP SOIC/SOT/MSOP NEWEST DATE CODE 89 9101 80 9318 1,969 9207 459 9505 2,597 • HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH

11ax

Abstract: 80486 microprocessor pin out diagram
Contextual Info: PRELIMINARY CYPRESS SEMICONDUCTOR Features 32K x 9 Synchronous Cache R/W RAM • D irect interface with the processor and external cache controller Supports 66-M Hz Pentium " CPU cache systems • TWo complementary synchronous chip enables Available in standard PLCC/LCC

67-31H-GBC-AZ0Z2EZ3-BT

Abstract: 67-31H/GBC-AZ0Z2EZ3/BT
Contextual Info: EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet Power Top View LEDs with Lens 67-31H/GBC-AZ0Z2EZ3/BT Features ․P-LCC-3 package. ․High flux output. ․High current capability. ․White package. ․Optical indicator. ․Colorless clear window. ․Ideal for backlight and light pipe application.

c2003

Abstract: SAW filter marking code SF0869BA02618S marking code SAW
Contextual Info: 869 MHz SAW Filter 2 MHz Bandwidth Part Number: SF0869BA02618S DESCRIPTION • • • Miniature 869 MHz SAW IF Filter. 3 x 3 mm Ceramic LCC package. RoHS compliant TYPICAL PERFORMANCE SPECIFICATION Parameter Center Frequency FC Insertion Loss 868 – 870 MHz

TLCC20AE1002BUF

Abstract: TLCC
Contextual Info: SURFACE MOUNT NETWORKS LCC, TLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • Lead Pb -free available Pb-free • High purity alumina substrate for high power dissipation Available RoHS* • Leach resistant terminations with nickel barrier

Contextual Info: EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet Power Top View LED with Lens. 67-31J/T2C-EZ01Z12MZ3/BT Features ˙P-LCC-3 package. ․High flux output. ․High current capability. ․White package. ․Optical indicator. ․Colorless clear window. ․Ideal for backlight and light pipe application.

MPY100L

Contextual Info: BURR-BROldN CORP 0 3 E D | 17313LS BURR-BROW N •B B T -73-27 00130L>b b | MPY100L É LCC MULTIPLIER-DIVIDER APPLICATIONS FEATURES MULTIPLICATION LOW COST DIFFERENTIAL INPUT DIVISION ACCURACY 100% TESTED AND GUARANTEED SQUARING NO EXTERNAL TRIMMING REQUIRED

hp6263

Abstract: HP3314A AD842 EIA-481A HA2542 R-16 P6201
Contextual Info: APPLICATIONS Line Drivers DAC and ADC Buffers Video and Pulse Amplifiers Available in Plastic DIP, Hermetic Metal Can, Hermetic Cerdip, SOIC and LCC Packages and in Chip Form MIL-STD-883B Parts Available Available in Tape and Reel in Accordance with EIA-481A Standard

Contextual Info: GENERAL DESCRIPTION The AD2S80A is a monolithic 10-, 12-, 14-, or 16-bit tracking resolver-to-digital converter contained in a 40-lead DIP or 44terminal LCC ceramic package. It is manufactured on a BiMOS II process that combines the advantages of CMOS logic and

Contextual Info: APPLICATIONS Line Drivers DAC and ADC Buffers Video and Pulse Amplifiers Available in Plastic DIP, Hermetic Metal Can, Hermetic Cerdip, SOIC and LCC Packages and in Chip Form MIL-STD-883B Parts Available Available in Tape and Reel in Accordance with EIA-481A Standard

Contextual Info: LCC, TLCC www.vishay.com Vishay Dale Thin Film Hermetic, 50 mil Pitch, Leadless Thin Film Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound

VSM85

Contextual Info: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product

DAC80P

Contextual Info: BURR-BROW N |B DAC80 DAC80P j| AVAILABLE IN DIE FORM • • • • • INDUSTRY STANDARD PINOUT LOW POWER DISSIPATION: 345mW FULL ±10V SWING WITH \lcc = ±12VDC DIGITAL INPUTS ARE TTL- AND CMOS-COMPATIBLE 6UARANTEE0 SPECIFICATIONS WITH ±\ZV AND ±15V SUPPLIES

VS838

Abstract: 2S81 AD2S80A DB10 8 way dip switch AD2S80AUD osc1758
Contextual Info: GENERAL DESCRIPTION The AD2S80A is a monolithic 10-, 12-, 14-, or 16-bit tracking resolver-to-digital converter contained in a 40-lead DIP or 44terminal LCC ceramic package. It is manufactured on a BiMOS II process that combines the advantages of CMOS logic and

Contextual Info: LCC, TLCC www.vishay.com Vishay Dale Thin Film Hermetic, 50 mil Pitch, Leadless Thin Film Chip Resistor, Surface Mount Network FEATURES • High purity alumina substrate for high power dissipation • Leach resistant terminations with nickel barrier • 16, 20, 24 terminal gold plated wraparound

VSM85

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
Contextual Info: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product