LCC 44 Search Results

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

XC3030A

Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

304 MQFP

Abstract: MQ240 XC3030A
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC9572 VQ44

Abstract: XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A
Contextual Info: 44 64 68 84 100 120 132 144 156 160 164 175 24 176 191 196 208 223 225 228 240 256 299 304 352 411 432 475 559 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC VQFP PLASTIC LCC CERAMIC LCC PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC PQFP PLASTIC TQFP

XC2064

Abstract: XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090
Contextual Info: 44 10 ◆ = New since last issue of XCELL 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3042A PQ100

Abstract: WC68 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L wc84 XC3064L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC4010XL PQ160

Abstract: XC3030A CQFP 208 datasheet XC95144 PQ100 PP132 XCS20 PQ208 XC4013XL HT144 XC4028EX hq208 XCS40 BG432
Contextual Info: 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 38 223 225 228 240 256 299 304 352 411 432 475 559 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC VQFP PLASTIC LCC CERAMIC LCC PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC PQFP PLASTIC TQFP

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Contextual Info: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC5200

Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

lcc 44 socket

Abstract: lcc 28 socket d 2588
Contextual Info: CHIP CARRIER SOCKETS PX Series KYCON RoHS Ordering Information 44 PX Series LCC Number of Contacts LCC: PBT LCC-1: PPS Dimensions PX Series Through Hole PLCC Socket Features B D 1.27 1.27 LR78160 • Applications Include All Electronic PC Boards Requiring the

68 pin plcc socket view bottom

Abstract: MO-047 MO-052 2358
Contextual Info: CHIP CARRIER SOCKETS P Series KYCON Ordering Information _ P Series 44 LCC Number of Contacts LCC: PBT LCC-1: PPS Dimensions A1 C 1.27 [.050] P Series Through Hole PLCC Socket 1.27 [.050] A Features B LR78160 • Applications Include All Electronic PC Boards Requiring the

lcc 44 socket

Abstract: lcc 28 socket
Contextual Info: CHIP CARRIER SOCKETS PX Series KYCON RoHS Ordering Information Click here for more information 44 PX Series LCC Number of Contacts LCC: PBT LCC-1: PPS Dimensions PX Series Through Hole PLCC Socket Features B D 1.27 1.27 LR78160 • Applications Include All Electronic PC Boards Requiring the

HC2702SLCC

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 C2700 HC2700LLCC TY 1016 HC2700 HC2701 HC2702
Contextual Info: H C2700 LCC Series +10V, Ð 1 0V, and ± 10V Leadless Chip Carrier Precision V oltage References JED EC- Compatible FEA TURES • 2700 Type Reference in Standard LCC Packages • JEDEC-Compatible 28 Pin LCC Style Package • +10, –10, + / –10V olt Ranges

LCC-044-H210-55

Abstract: HCL-044 lcc 44 socket PUL-100 HCL-032 LCC-032-H210-55 smd code LCC 1pf smd
Contextual Info: LCC Series - LCC Sockets JEDEC Type "C" Production sockets for JEDEC Type "C" LCC chips. Socket design for automatic assembly and vacuum pick and place machines. Sockets available in soldertail and SMD version. The SMD terminals extend beyond the side of the socket body,

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 50 PIN PLASTIC LCC-50P-M02 50-pin plastic SOJ Lead pitch 0.80mm Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-50P-M02 50-pin plastic SOJ (LCC-50P-M02) * : Resin protrusion. (Each side : 0.15 (.006) max)

9744

Abstract: 438 j
Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50mil Package width 432mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010) 10.98±0.25 (.432±.010)

Package 48 LCC

Abstract: QFN048-C-S560-1 LCC 48 CERAMIC LEADLESS CHIP CARRIER LCC-48C-A01 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 40MIL
Contextual Info: LEADLESS CHIP CARRIER 48 PAD CERAMIC LCC-48C-A01 EIAJ code : ∗QFN048-C-S560-1 Lead pitch 40mil Package width x package length 560 × 560mil Sealing method Metal seal 48-pad ceramic LCC LCC-48C-A01 *Shape of PIN NO.1 INDEX : Subject to change without notice.

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 32 PIN PLASTIC LCC-32P-M03 EIAJ code : ∗SOJ032-P-0400-1 32-pin plastic SOJ Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-32P-M03 32-pin plastic SOJ (LCC-32P-M03) * : Resin protrusion. (Each side : 0.15 (.006) max)

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1 CERAMIC LEADLESS CHIP CARRIER LCC 44
Contextual Info: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width x package length 650 × 650 mil Sealing method Frit seal

LCC 18 Pin Package

Abstract: QFJ044-P-S653-2
Contextual Info: PLASTIC LEADED CHIP CARRIER 44 PIN PLASTIC LCC-44P-M02 EIAJ code : ∗QFJ044-P-S653-2 Lead pitch 50mil Package width x package length 653 × 653mil Lead shape J bend Sealing method Plastic mold 44-pin plastic QFJ PLCC (LCC-44P-M02) 44-pin plastic QFJ (PLCC)

Contextual Info: Features * Industry Standard Architecture - Low Cost Easy-to-Use Software Tools * High-Speed, Electrically-Erasable Programmable Logic Devices - 7.5 ns Maximum Pin-to-Pin Delay * Several Power Saving Options Device lcc, Stand-By lcc, Active ATF22V10B 85 mA

20P2S

Abstract: 20V8B
Contextual Info: Features Industry Standard Architecture - Emulates Many 24-Pin PALs - Low Cost Easy-to-Use Software Tools High-Speed Electrically Erasable Programmable Logic Devices - 7.5 ns Maximum Pin-to-Pin Delay Several Power Saving Options Device lcc, Stand-By lcc, Active