LASER CUTTING CIRCUIT Search Results

2338 philips

Abstract: philips 2338 2338 resistor 2338 resistor philips philips resistor 0805 2338 2338 734
Contextual Info: Preliminary Specification Philips Components Trimmable Resistor Chip Size 0805 0/-20% and 0/-30% FEATU RES Lower assembly costs o o o • o—. £ E -H Cutting speed = 30 to 300 mm/s Q. Q. O O Trimming Instructions with YAG-laser showing typical values for:

Contextual Info: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0402 1005 /5514 Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.

Contextual Info: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0402 1005 /5514 Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.

c 5516

Contextual Info: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0603 1608 /5516 Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.

221-51

Contextual Info: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0603 1608 /5516 —— Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.

sem 5025

Abstract: gs 31 thermal printer head Al2O3 HA-96-2 AS970 amorphous head laser cutting circuit drilling machine applications
Contextual Info: アルミナ基板〔Al2O3〕 ALUMINA SUBSTRATES [ Al2O3 ] The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. 回路部品 CIRCUIT CERAMICS

bolometer

Abstract: bolometer application LASER BURN circuit diagram l41c LZT983 garnet Trimming
Contextual Info: JOHANSON LASERtrim Tuning Application Notes ACTIVE TRIMMING CHARACTERISTICS OF LASERtrim® CHIP CAPACITORS LASER TRIMMING PROCESS INTRODUCTION LASERtrim® chip capacitors are laser adjustable surface mount multi-layer ceramic MLCC capacitors intended for active trimming applications in various RF circuits.

gs32

Abstract: Maruwa substrate amorphous head AS970 maruwa network resistor
Contextual Info: MARUWA GENERAL CATALOG ALUMINA SUBSTRATES [ Al2O3 ] The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. a Features State : Good smoothness/flatness with less porosity due to fine particles. Excellent in adhesion with thick/thin film materials.

Contextual Info: PBW J GEC PLESSEY CT3193-1.4 PLANAR INSERTED FERRITE SUBSTRATES FOR MICROWAVE INTEGRATED CIRCUITS GPS have the capability to supply a variety of metalised substrates manufactured using the state-of-the-art pattern plating technique. * FILMS: ADHESION LAYER

Contextual Info: VISHAY BEYSCHLAG www.vishay.com Resistors Application Note Using Laser Trimmable Resistors By Thomas Bluhm PURPOSE AND APPROACH Recently, trimmable resistors have been in high demand due to their properties. Many manufacturers of electronic equipment see the benefits of using these components in

Fujikura panda fiber

Contextual Info: High-power pulsed fiber lasers and their evolution Yoshihiro Terada,1 Michihiro Nakai,1 and Yasuhiro Oba1 Fujikura has achieved an output power of 30 W from a Q-switched pulsed fiber laser with a pulse width about 100 ns for the first time in the world. Following the achievement, we

maxim CODE TOP MARKING

Abstract: maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations
Contextual Info: 1 Maxim Integrated Products Assembly and Packaging Group Application Notes Wafer-Level Ultra-Chip-Scale Package 1.0 Introduction to Ultra-Chip-Scale Package UCSP The packaging technology in the Ultra-Chip-Scale Package (UCSP) enables the integrated circuit

Precision Monolithics OP07

Contextual Info: MT-037 TUTORIAL Op Amp Input Offset Voltage DEFINITION OF INPUT OFFSET VOLTAGE Ideally, if both inputs of an op amp are at exactly the same voltage, then the output should be at zero volts. In practice, a small differential voltage must be applied to the inputs to force the

cd-rom circuit diagram

Abstract: cd-rom ic focus signal servo track 100 pin ic with feedback
Contextual Info: SM9404AF Read Channel IC for DVD-RAM/ROM NIPPON PRECISION CIRCUITS INC. OVERVIEW The SM9404AF is a read channel IC for DVD-RAM 4.7Gbyte , ROM (1/2- to 4x-speed), and CD-ROM (4×to 32-speed). FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ Equalizer for waveform equivalence

CD Laser pickup focus tracking

Contextual Info: Panasonic Hologram Unit HUL7001 Hologram Unit Index mark for No.l U nit : mm For optical inform ation processing • Features il" T¡gi r • Smaller package size achieved through micro-mirror integration 4.8 X 8.2 X 4.3 mm • Focus error signal detection : SSD method

CD Laser pickup focus tracking

Abstract: CD laser pickup assembly OPTICAL PICKUP PANASONIC CD OPTICAL PICKUP PANASONIC optical CD pickup assembly HUL7001 hologram unit "focus error signal" 805nm OPTICAL laser pickup
Contextual Info: Panasonic Hologram Unit HUL7001 Hologram Unit Index mark for No.l Unit : mm For optical information processing • F eatures • Sm aller package size achieved through m icro-m irror integration 4.8 X 8.2 X 4.3 mm • Focus error signal detection : SSD method

schematic diagram of ip camera

Abstract: of IC micro A 741 schematic diagram ip camera diagram co2 tester power supply tester schematic diagram the working of the IC 741 as an oscillator L7270 OF IC 741 main working power supply laser co2 CCD CAMERA
Contextual Info: PATENT PENDING DUV Laser Application IC MICRO ABLATOR L7270 Allows selective removal of just the IC passivation film polyimides, SiN, etc. and upper metallization layer (Al, etc.). 30µm Strips away aluminum pattern DUV laser beam SiN passivation film Aluminum pattern

Contextual Info: 3 Stack Pulsed Laser Diode L11854-307-05 Features Radiant peak output power: > =21 W Peak emission wavelength: 905 nm Emitting area size: 70 mm x 10 mm Applications Laser range finder Security Measuring instruments Absolute maximum ratings Top(c = 25 ℃)

FX888

Contextual Info: Pro Soldering Tool Kit Page 1 of 1 Pro Soldering Tool Kit This is a complete DIY Soldering kit that includes a Panavise circuit board holder and has instructional "How to Solder" directions etched right on its base. The kit includes a Hakko #FX888 soldering station, small pair of

CD laser pickup assembly

Abstract: ultrasonic movement DETECTOR CIRCUIT DIAGRAM HUL7001 "focus error signal" OPTICAL PICKUP PANASONIC CD panasonic disk drive cw-8124
Contextual Info: Hologram Unit HUL7001 Hologram Unit Unit : mm M Di ain sc te on na tin nc ue e/ d 0.3 11.2±0.2 8.2±0.2 ø8.0 +0 –0.05 Smaller package size achieved through micro-mirror integration (4.8 x 8.2 × 4.3 mm) 1 2 3 4 5 6 O Y (0.2) (0.5) Reference plane Focus error signal detection : SSD method

1064 nm

Abstract: RLTCO-1064-400W
Contextual Info: RLTCO-1064-400W TECHNICAL DATA High Power Infrared Diode Pumped Solid State Laser Features Applications • • • • • • • • • Output Power: 400 W 1064 nm Emission Wavelength Small Size, Compact Package Water-Cooled, High Efficiency High Beam Quality, Stability and Reliability

1064 nm

Abstract: RLTCO-1064-500W
Contextual Info: RLTCO-1064-500W TECHNICAL DATA High Power Infrared Diode Pumped Solid State Laser Features Applications • • • • • • • • • Output Power: 500 W 1064 nm Emission Wavelength Small Size, Compact Package Water-Cooled, High Efficiency High Beam Quality, Stability and Reliability

1064 nm

Abstract: RLTCO-1064-300W
Contextual Info: RLTCO-1064-300W TECHNICAL DATA High Power Infrared Diode Pumped Solid State Laser Features Applications • • • • • • • • • Output Power: 300 W 1064 nm Emission Wavelength Small Size, Compact Package Water-Cooled, High Efficiency High Beam Quality, Stability and Reliability

OPTICAL PICKUP PANASONIC CD

Abstract: CD laser pickup assembly ultrasonic movement DETECTOR CIRCUIT DIAGRAM HUL7001 CD Laser pickup focus tracking optical pickup unit ultrasonic movement detector
Contextual Info: Hologram Unit HUL7001 Hologram Unit Unit : mm Index mark for No.1 pin on reverse side 4.8 x 8.2 × 4.3 mm Y Reference plane Focus error signal detection : SSD method Reference plane Apparent emitting point SEC. X-O-Y Apparent emitting point Reference plane