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    LAND PATTERN QFP 208 Search Results

    LAND PATTERN QFP 208 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BQ2052SN-A515
    		Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70 Visit Texas Instruments Buy
    SM34020APCM40
    		Texas Instruments SM34020APCM40 144-QFP Visit Texas Instruments
    5962-9679002NXB
    		Texas Instruments Digital Signal Processor 144-QFP -55 to 125 Visit Texas Instruments
    DP83843BVJE/NOPB
    		Texas Instruments PHYTER 80-QFP 0 to 70 Visit Texas Instruments Buy
    5962-9679001NXB
    		Texas Instruments Digital Signal Processor 144-QFP -55 to 125 Visit Texas Instruments

    LAND PATTERN QFP 208 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SF-QFE208SB-L-01

    Contextual Info: see detail A 1.165" 1.125" Detail A 0.005" 0.012" 0.020" 0.050" 0.018"±0.001" dia 0.250" 0.063" 0.5mm. pitch ±0.08mm. from true center compatible target board land dimensions Ax< 1.125" Bx> 1.225" Ay< 1.125" By> 1.225" Bx Ax By Ay Description: Surface mountable QFP emulator Foot; leadless version, sized to fit on 208 position QFP land pattern


    Original     		SF-QFE208SB-L-01 PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    J-STD-001C

    Abstract: IPC-SM-782 land pattern QFP 208 guidelines J-STD001C
    Contextual Info: DIMENSIONS: LEAD FORMING APPLY THE TO E N S U R E ONTO T H I S 1 2) 3) 4) FOLLOWING LEAD FORMING G U I D E L I N E S THE 208-LEAD C E R A M I C QFP WI L L FIT FOOTPRINT. THE BY FOOT inches) GUIDELINES: 33 . 8 3 1 . 3 3 2 FIRST LEAD BEND IS 1.14 ±.13 (.045


    OCR Scan     		208-LEAD 012x0. J-STD-001C IPC-SM-782 land pattern QFP 208 guidelines J-STD001C PDF

    land pattern QFP 208

    Contextual Info: DIMENSIONS: LEAD FORMING APPLY THE TO E N S U R E ONTO T H I S 1 2) 3) 4) 33 . 8 3 1 . 3 3 2 FOLLOWING LEAD FORMING GUIDELINES THE 208-LEAD CERAMIC QFP WI LL FIT FOOTPRINT. THE BY FOOT i n c h e s ) G U I D E L I N E S : 0 - . 4 6 OF ) 2 8 . 1 0 ( 1 . 1 0 6 )


    OCR Scan     		208-LEAD 012x0 U-STD-001C land pattern QFP 208 PDF

    land pattern QFP 208

    Abstract: CA-QFE208SA1-L-Z-T-02
    Contextual Info: 1 Material: 0.0625" ± 0.007" Fr4/G10 Pins: shell material- Brass; finish2 10µ" Gold over 50µ" Nickel min. . Test Points: 0.25" sq. post. Gold flash 3 on contact area, 150µ" Tin on tail. Top view 3 2.450" 4.000" Side view 1.053" 1 1.120"* * Assembled 2


    Original     		Fr4/G10 CA-QFE208SA1-L-Z-T-02 land pattern QFP 208 PDF

    land pattern QFP 208

    Abstract: CA-QFE208SB-L-S-01 SF-QFE208SB-L-01
    Contextual Info: 1.240" 0.100" 0.5mm typ. 1.340" 1.040" Top View 1.340" 30.6mm 1 0.300" 3 0.050"±0.002" 2 SF-QFE208SB-L-01 sub assembly, included 0.125"(assembled) Side View 0.5mm pitch 1.165" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: material- Brass; finish- 10µ" gold over


    Original     		SF-QFE208SB-L-01 FR4/G10 CA-QFE208SB-L-S-01 land pattern QFP 208 SF-QFE208SB-L-01 PDF

    land pattern QFP 208

    Abstract: CA-QFE208SA-L-S-01 SF-QFE208SA-L-01
    Contextual Info: 1.240" 0.100" 0.5mm typ. 1.340" 1.040" Top View 1.340" 30.0mm 1 0.300" 3 0.050"±0.002" 2 SF-QFE208SA-L-01 sub assembly, included 0.125"(assembled) Side View 0.5mm pitch 1.140" 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 2 Pins: material- Brass; finish- 10µ" gold over


    Original     		SF-QFE208SA-L-01 FR4/G10 CA-QFE208SA-L-S-01 CA-QFE208Sx-L-S-01 land pattern QFP 208 SF-QFE208SA-L-01 PDF

    FBGA-484

    Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
    Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly


    Original     		FBGA484 SI-SX32-ACQ256SFG484 SI-SX72-ACQ256SFG484) SI-SX72-ACQ256SFG484 CQ256 FG484 SI-SX72ACQ256SFG484) FBGA-484 A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 PDF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    land pattern QFP 208

    Abstract: PA-QFE208S-A-S-01
    Contextual Info: 2.200" 0.100" 0.300" 0.100" 0.010" 1.051" 1.251" 2.800" 0.50mm 1 0.250" 0.120" 6 2 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. .


    Original     		FR4/G10 SB-PGA28/208A-01 PA-QFE208S-A-S-01 land pattern QFP 208 PDF

    land pattern QFP 208

    Abstract: PA-QFE208SB-P-S-01
    Contextual Info: 2.100" 1.255" 1.115" 0.011" 2.100" 0.100" 0.700" 1.255" 1.115" 0.507" -01W version 3 level, 0.025" Sqr. WW pin Detail for wrap version dimensions, add W to end of part number Rev Add 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating


    Original     		FR4/G10 SB-PGA21/208A-01W. PA-QFE208SB-P-S-01 land pattern QFP 208 PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Contextual Info: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF