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    LAND PATTERN 0805 Search Results

    LAND PATTERN 0805 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    G832MB110805022HR
    Amphenol Communications Solutions 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black. PDF
    G832MB010805022HR
    Amphenol Communications Solutions 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black. PDF
    G832MC110805022HR
    Amphenol Communications Solutions 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black. PDF
    57102-G08-05
    Amphenol Communications Solutions Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 10 Positions - 2mm (0.079inch) - Vertical PDF
    57102-S08-05ULF
    Amphenol Communications Solutions Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.078in) Pitch.. PDF

    LAND PATTERN 0805 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern 0805

    Abstract: 0402 0603 0805 land
    Contextual Info: 4/2/02 http:www.niccomp.com Technical Inquiries: tpmg@niccomp.com SOLDERING LAND PATTERNS PRODUCTS: NRC SERIES, THICK FILM CHIP RESISTORS SOLDERING LAND PATTERN DIMENSIONS mm SIZE 0201 0402 0603 0805 1206 1210 2010 2512 A 0.3~0.4 0.5~0.6 0.8~1.0 1.2~1.4


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    01005 land pattern

    Abstract: 0402 land pattern
    Contextual Info: NMC SERIES - LAND PATTERN DIMENSIONS Component Outline D Solder Resist A C Land Pads B 1. Flow Soldering Dimension mm A B C D 0603 0.8 ~ 1.0 2.6 ~ 3.2 0.7 ~ 0.8 0.8 ~ 1.2 Size 1206 1.8 ~ 2.4 4.2 ~ 5.2 1.2 ~ 1.6 0.9 ~ 1.7 1210 1.8 ~ 2.4 4.2 ~ 5.2 1.8 ~ 2.5


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    Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805CD SERIES Wirewound ceramic core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Reference Electrical Specifications @ 25°C


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    0805CD PE-0805CD2N8KTT PE-0805CD3N0KTT PE-0805CD030KTT PE-0805CD050KTT PE-0805CD060KTT PE-0805CD7N5KTT PE-0805CD080KTT PE-0805CD100KTT PE-0805CD120KTT PDF

    Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21L CIG21LR47MNE CIG21L1R0MNE CIG21L1R2MNE PDF

    Contextual Info: WIRE-WOUND RF CHIP INDUCTORS - 0805CM SERIES Wirewound ceramic core construction High Q values and self resonant frequency Industry standard 0805 2012 surface mount land pattern See page 3 for Competition Cross Electrical Specifications @ 25°C Part Number


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    0805CM PE-0805CM030KTT PE-0805CM060KTT PE-0805CM080KTT PE-0805CM100KTT PE-0805CM120KTT PE-0805CM150KTT PE-0805CM180KTT PE-0805CM220KTT PE-0805CM270KTT PDF

    Contextual Info: Ver. 201207 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure


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    CIG21F CIG21FR47MNC CIG21F1R0MNC PDF

    Contextual Info: Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series 2012/ EIA 0805 APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm Perfect shape for automatic mounting, with no directionality.


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    CIB/CIM21 PDF

    Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure


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    CIG21F CIG21FR47MNC CIG21F1R0MNC CIG21F1R5MNC CIG21F2R2MNC PDF

    Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21F Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure


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    CIG21F CIG21FR47MNC CIG21F1R0MNC PDF

    Contextual Info: Ver. 201306 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21C CIG21C2R2MNE CIG21C4R7MNE PDF

    inductor 2r2

    Abstract: CIG21C2R2MNE
    Contextual Info: Ver. 201011 Multilayer Power Inductor CIG21C Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21C CIG21C2R2MNE CIG21C4R7MNE inductor 2r2 PDF

    land pattern 0805

    Abstract: CIG21LR47MNE CIG21L4R7MNE CIG21LR47M CIG21L1R0MNE CIG21L3R3MNE land pattern 0805 inductor land pattern inductor 0805 CIG21L2R2MNE
    Contextual Info: Ver. 201007 Multilayer Power Inductor CIG21L Series 2012/ EIA 0805 APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances


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    CIG21L CIG21LR47MNE CIG21L1R0MNE CIG21L1R5MNE CIG21L2R2MNE CIG21L3R3MNE CIG21L4R7MNE land pattern 0805 CIG21LR47M land pattern 0805 inductor land pattern inductor 0805 PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Absolute Maximum Ratings Ambient Temperature 25°C : Properties Test conditions Power dissipation Peak Forward Current duty/10@1kHz Continuous Forward Current Reverse Voltage ESD Threshold/ Human Body Modell


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    duty/10 PDF

    Contextual Info: A Dimensions: [mm] B Land Pattern: [mm] D Electrical Properties: Properties Test conditions Inductance getAttribute "TC_L",-1 Q-factor 50 MHz 300 DC Resistance IR RDC Self Resonant Frequency SRF Rated Current Value Unit Tol. L 0.047 µH ±20% Q 20 mA max.


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    Contextual Info: A Dimensions: [mm] B Land Pattern: [mm] D Electrical Properties: Properties Test conditions Inductance getAttribute "TC_L",-1 Q-factor 25 MHz 150 DC Resistance IR RDC Self Resonant Frequency SRF Rated Current Value Unit Tol. L 0.56 µH ±10% Q 25 mA max.


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    Contextual Info: A Dimensions: [mm] B Land Pattern: [mm] D Electrical Properties: Properties Test conditions Inductance getAttribute "TC_L",-1 Q-factor 25 MHz 250 DC Resistance IR RDC Self Resonant Frequency SRF Rated Current Value Unit Tol. L 0.27 µH ±10% Q 20 mA max.


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    Contextual Info: A Dimensions: [mm] B Land Pattern: [mm] D Electrical Properties: Properties Test conditions Inductance getAttribute "TC_L",-1 Q-factor 25 MHz 250 DC Resistance IR RDC Self Resonant Frequency SRF Rated Current Value Unit Tol. L 0.33 µH ±10% Q 20 mA max.


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    74479032

    Contextual Info: A Dimensions: [mm] B Land Pattern: [mm] D Electrical Properties: Properties Test conditions Inductance getAttribute "TC_L",-1 Q-factor 25 MHz 200 DC Resistance IR RDC Self Resonant Frequency SRF Rated Current Value Unit Tol. L 0.47 µH ±10% Q 25 mA max.


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    KF 520

    Contextual Info: Chip Inductors • ND Type 2012 0805 ● Recommended Land Pattern in mm (not to scale) 1.25 0.9 to 1.3 1.0 1.25 ● Dimensions in mm (not to scale) (1.2) 1.0 to 1.2 3.0 to 3.8 0.4 2.0 ■ Standard Packing Quantity ● 3000 pcs./Reel ■ Standard Parts Inductnce


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    ELJND10NKF ELJND12NKF ELJND15NKF ELJND18NKF ELJND22NKF ELJND27NKF ELJND33NJ/KF ELJND39NJ/KF ELJND47NJ/KF ELJND56NJ/KF KF 520 PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Value Unit Tol. Impedance 100 MHz Z 67 Ω ±25% Rated current ∆T = 40 K IR RDC 320 mA max. 0.24 Ω max. DC Resistance Cut-off frequency |Sdd21| = 3 dB


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    Sdd21| PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Impedance @ 100 MHz 100 MHz Maximum impedance 120 MHz Rated current ΔT = 20K DC Resistance Type Value Unit Tol. Z 1000 Ω ±25% Z 1050 Ω typ. IR RDC 200


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    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Inductance 10 MHz Q-factor 10 MHz 50 DC Resistance IR RDC Self resonant frequency SRF Rated current Value Unit Tol. L 1.5 µH ±10% Q 45 mA max. 0.5 Ω


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    2012ury PDF

    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Impedance @ 100 MHz 100 MHz Maximum impedance 100 MHz Rated current ΔT = 20K DC Resistance Type Value Unit Tol. Z 2700 Ω ±25% Z 2700 Ω typ. IR RDC 200


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    Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Inductance 25 MHz Q-factor 25 MHz 150 DC Resistance IR RDC Self resonant frequency SRF Rated current Value Unit Tol. L 0.82 µH ±10% Q 25 mA max. 1.0 Ω


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