LAND GRID ARRAY Search Results

LGA voiding

Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

AN3281

Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

size 0204 capacitor

Abstract: z104m
Contextual Info: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s

LICC

Abstract: kyocera mlcc military capacitors lga components
Contextual Info: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown

Contextual Info: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector

lga 115

Contextual Info: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector

EIA 364-60

Abstract: EIA-364-60 EIA-364-32 Socket-F Tyco AMD thermal design retention mechanism LGA1207 EIA-364-20 EIA-364-21 LF-LGA1207 LGA socket
Contextual Info: lever actuated Land Grid Array LGA 1207 position socket LGA1207 and LF-LGA1207 1. SCOPE 1.1. Content Product specification 108-78375 24 AUG 2006 Rev.A This specification covers performance, tests and quality requirements for the Tyco Electronics lever actuated Land Grid Array (LGA) socket F 1207.

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Land Grid Array LGA capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance.

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s (Inter-Digitated Capacitors) but are built in a simplified 2 terminal package.

LGA48

Contextual Info: LAND GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC LGA-48P-M01 48-pin Plastic LGA Land pitch 1.00 mm Land matrix 6x8 Sealing method Resin seal LGA-48P-M01 48-pin Plastic LGA (LGA-48P-M01) Note: The actual shape of corners may differ from the dimension.

10-LEAD

Contextual Info: DATE: 01/26/09 DESCRIPTION: 10-Lead, Thin Leadframe Land Grid Array TLLGA PACKAGE CODE: XA10 DOCUMENT CONTROL #: PD-2095 09-0064 REVISION: -

leadframe

Contextual Info: DATE: 01/28/09 DESCRIPTION: 8-Lead, Thin Leadframe Land Grid Array TLLGA PACKAGE CODE: XA8 DOCUMENT CONTROL #: PD-2081 09-0065 REVISION: A

RT3PE3000L CQ256

Contextual Info: Revision 3 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array

Microsemi Military Products Selection Guide

Abstract: RT3PE3000L RT3PE600L CCGA 472 mechanical drawing CQ208 CQ256 LG484 AND SOC LG484
Contextual Info: Revision 2 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array

Contextual Info: Revision 5 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array

RT3PE3000L CQ256

Abstract: CG484 RT3PE3000L LG484 CCGA CCGA 472 CCGA 472 mechanical drawing RT3PE600L IO30PDB1V1 IO283PDB7V1
Contextual Info: Revision 5 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array

RT3PE3000L CQ256

Abstract: RT3PE3000L CQ256 RT3PE600L IO30PDB1V1 IO283PDB7V1 actel package mechanical drawing
Contextual Info: Revision 4 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array

Contextual Info: Aries Land Grid Array Socket, 16x16 Grid, 256 Pin, [.050] 1.27 Pitch FEATURES: • Uses same surface mount soldering technology as BGA devices. • LGA device is accurately aligned and seated in socket base prior to mounting of top. • Controlled contact deflection.

BGA Package 0.35mm pitch

Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
Contextual Info: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed

Contextual Info: Package outline HLLGA48R: plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.25 mm D SOT863-1 A B land 1 index area E e1 L1 v w b e 13 M M y1 C C A B C A y 24 L C 25 12 e e2 Eh 1 36 land 1 index area 48 37 Dh

Contextual Info: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 L1 L v w b e 18 M M y1 C C A B C A C y 34 35 17 e e2 Eh 1 land 1 index area 51 68 52

sot819

Abstract: 14L15
Contextual Info: Package outline Philips Semiconductors HLLGA28: plastic thermal enhanced low profile land grid array package; 28 lands; body 6 x 6 x 1.4 mm D SOT819-1 A B land 1 index area E e1 v w b e L1 8 M M y1 C C A B C A C y 14 L 15 7 e e2 Eh 21 1 land 1 index area 28