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68491-424HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68491-422HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68491-428HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 28 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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68491-426HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10132449-1421GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing. |
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