| XPN19014MC |  | Toshiba Electronic Devices & Storage Corporation | P-ch MOSFET, -40 V, -20 A, 0.0187 Ω@-10 V, TSON Advance(WF), AEC-Q101 | Datasheet |  | 
| 51939-014LF |  | Amphenol Communications Solutions | PwrBlade®, Power Connectors, 3P 24S 4P Right Angle Header, Solder To Board | PDF |  | 
| 68690-140HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch. | PDF |  | 
| 87901-412HLF |  | Amphenol Communications Solutions | BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail. | PDF |  | 
| 87901-434HLF |  | Amphenol Communications Solutions | BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail. | PDF |  |