KG 400 Search Results

SP5769

Abstract: SP5655 SP5659 phase detector 3GHz
Contextual Info: SP5769 3GHz I2C Bus Synthesiser November 2004 Features Ordering Information SP5769A/KG/MP2S 16 Pin SOIC* SP5769A/KG/QP1T 16 Pin QSOP SP5769A/KG/MP1S 16 Pin SOIC SP5769A/KG/MP2T 16 Pin SOIC* SP5769A/KG/QP2T 16 Pin QSOP* SP5769A/KG/QP1S 16 Pin QSOP SP5769A/KG/MP1T 16 Pin SOIC

SP5655

Abstract: SP5659 SP5730 charge pump 50MHz
Contextual Info: SP5730 1.3 GHz Low Phase Noise Frequency Synthesiser Data Sheet November 2004 Features Ordering Information SP5730A/KG/QP1T 16 Pin QSOP SP5730A/KG/QP1S 16 Pin QSOP SP5730A/KG/MP1S 16 Pin SOIC SP5730A/KG/MP2S 16 Pin SOIC* SP5730A/KG/QP2T 16 Pin QSOP* SP5730A/KG/MP1T 16 Pin SOIC

hp 2503

Abstract: KG41 KG252 Pole-120 kg64b KG100C
Contextual Info: KG-Switches Technical Data KG 125 KG 160 KG250 KG315 KG10 KG20 KG32 KG10A KG20A KG32A KG41 KG64 KG80 KG100 KG126 KG161 KG251 KG316 KG10B KG20B KG32B KG41B KG64B KG80C KG100C KG127 KG 162 KG252 KG317 Selection Data V V V V 690 660 300 400 690 660 600 500 690

Contextual Info: SP5730 1.3GHz Low Phase Noise Frequency Synthesiser Datasheet DS4877 Features ISSUE 2.5 November 2001 Ordering Information SP5730A/KG/MP1S Tubes SP5730A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5730A/KG/QP1S (Tubes) SP5730A/KG/QP1T (Tape and Reel)

SP5655

Abstract: SP5659 SP5730
Contextual Info: SP5730 1.3GHz Low Phase Noise Frequency Synthesiser Datasheet DS4877 Features ISSUE 2.5 November 2001 Ordering Information SP5730A/KG/MP1S Tubes SP5730A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5730A/KG/QP1S (Tubes) SP5730A/KG/QP1T (Tape and Reel)

Contextual Info: SP5730 1.3GHz Low Phase Noise Frequency Synthesiser DS4877 Features ISSUE 2.4 November 2001 Ordering Information SP5730A/KG/MP1S Tubes SP5730A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5730A/KG/QP1S (Tubes) SP5730A/KG/QP1T (Tape and Reel) (16 lead QSOP Package)

SP5655

Abstract: SP5659 SP5730
Contextual Info: SP5730 1.3GHz Low Phase Noise Frequency Synthesiser DS4877 Features ISSUE 2.2 July 2001 Ordering Information SP5730A/KG/MP1S Tubes SP5730A/KG/MP1T (Tape and Reel) SP5730A/KG/QP1S (Tubes) SP5730A/KG/QP1T (Tape and Reel) • Complete 1•3 GHz Single Chip System for Digital

DS4878

Contextual Info: SP5769 3GHz I2C Bus Synthesiser DS4878 ISSUE 4.3 Features May 2002 Ordering Information SP5769A/KG/MP1S Tubes SP5769A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5769A/KG/QP1S (Tubes) SP5769A/KG/QP1T (Tape and Reel) (16 lead QSOP Package) • Complete 3•0 GHz Single Chip System

DS4878

Abstract: SP5655 SP5659 SP5769
Contextual Info: SP5769 3GHz I2C Bus Synthesiser DS4878 ISSUE 4.3 Features May 2002 Ordering Information SP5769A/KG/MP1S Tubes SP5769A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5769A/KG/QP1S (Tubes) SP5769A/KG/QP1T (Tape and Reel) (16 lead QSOP Package) • Complete 3•0 GHz Single Chip System

Contextual Info: KG U H F glass mount antenna outside coupler and Complete KG U H F glass mount antenna with coax Complete KG U H F gloss mount antenna with coax whip and connector M ODE! FR EQ U EN C Y W H IP KG 406 O /S 406 420 MHz W KG 406 • M ODE! KG406W FR EQ U EN C Y

Contextual Info: SP5769 3GHz I2C Bus Synthesiser DS4878 ISSUE 4.2 Features November 2001 Ordering Information SP5769A/KG/MP1S Tubes SP5769A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5769A/KG/QP1S (Tubes) SP5769A/KG/QP1T (Tape and Reel) (16 lead QSOP Package) • Complete 3•0 GHz Single Chip System

DS4878

Abstract: SP5659 SP5769 SP5655 6690 AS
Contextual Info: SP5769 3GHz I2C Bus Synthesiser DS4878 ISSUE 4.1 Features July 2001 Ordering Information SP5769A/KG/MP1S Tubes SP5769A/KG/MP1T (Tape and Reel) SP5769A/KG/QP1S (Tubes) SP5769A/KG/QP1T (Tape and Reel) • Complete 3•0 GHz Single Chip System • Optimised for Low Phase Noise, with Comparison

Contextual Info: SP5769 3GHz I2C Bus Synthesiser DS4878 ISSUE 4.2 Features November 2001 Ordering Information SP5769A/KG/MP1S Tubes SP5769A/KG/MP1T (Tape and Reel) (16 lead SOIC Package) SP5769A/KG/QP1S (Tubes) SP5769A/KG/QP1T (Tape and Reel) (16 lead QSOP Package) • Complete 3•0 GHz Single Chip System

Contextual Info: SPECIFICATIONS DVI to RGB Adapter assembly Mechanical Durability Mating : Automatic cycling to 100 cycles, Rate: 100±50 cycles per hour DVI Mating & Un-mating Forces: Un-mating force: 1 kg force minimum/4 kg force maximum. Mating force: 4.5 kg force maximum.

Contextual Info: Rthha 2 natural cooling °C/W Rthha Vair = 4 m/s °C/W w Heatsinks kg 2 x P 11/250 0,195 300 W) 0,05 7,5 P 11 U3 2 x U 3/300 0,145 (400 W) 0,04 14,2 Standard lengths 1) P 11 w kg = 15 l m Features Dimensions in mm U3 w kg = 23,7 l m • Intended for isolated power modules: the SEMIPACK and SEMITRANS ranges, and also for

Contextual Info: Model 1142 Tedea-Huntleigh Single-Point Stainless Steel Load Cell FEATURES • Capacity range: 10–150 kg • Stainless steel construction • Single-point 400 x 400 mm platform • Sealed to IP66 • Compact size: only 40 mm high • OIML approved to C3 20–100 kg and

RS-296-D

Abstract: kb08 BR10 KB06 KBPC10 KBPC15 MB10 RS296D 3AD1 RS-296D
Contextual Info: CHENG- YI ELECTRONIC BULK PACKAGING COMPONENT CASE BOX QUALITY TYPE WEIGHT CARTON SIZE CARTON QUALITY NET WEIGHT GROSS WEIGHT TYPE pc s g cm kpcs KG KG WOB 500 1.35 44X23X32 5 6.75 8 RS2 400 3.06 44X23X32 4 12.24 13.8 RS3 200 2.84 44X23X32 2 5.68 7.2 RS4 300

10 35L

Abstract: C1500 C1000 C800
Contextual Info: Packaging specifications DIMENSIONS in mm. BRIDGE RECTIFIERS BOX PACKAGING BOX PACKAGING BOX SIZE a b c UNITS PER BOX B. C800, C1000, C1500 R, WL.F, WF / “A“ 208 78 108 1000/(3000) 1.30 Kg. (2.86 Lbs.) FBI-M 540 150 45 400 2.25 Kg. (4.95 Lbs.) FBI-S

EF90

Abstract: ef806 NMO150U FB35T NMO27C BSA150C
Contextual Info: Replacement Whips AROOOl . . W KG 3E B25 AR0004 . . W KG 3E 825 B S A 1 1 8 B . . W 640 B BSA 132 B . . . W 540 B B S A 1 5 0 B . . W 490 B

6.5kV IGBT

Abstract: IGBT Power Module siemens ag infineon igbt reliability siemens IGBT 600a eupec igbt 6500v igbt 6.5kv SiC IGBT High Power Modules, PCIM Hongkong Measurement of stray inductance for IGBT IGBT module FZ siemens igbt inverters
Contextual Info: 6.5kV IGBT-Modules Franz Auerbach Infineon Technologies Josef Georg Bauer (Siemens AG) Manfred Glantschnig (Infineon Technologies) Jürgen Göttert (eupec GmbH & Co KG) Martin Hierholzer (eupec GmbH & Co KG) Alfred Porst (Infineon Technologies) Daniel Reznik (Siemens AG)

plc wiring home diagram wago

Abstract: WAGO 281 electronic passive components catalog proxy metal sensor, with coil oil pressure sender IC 555 timer bistable 750-8-12 PT100 temperature sensor class B bacn WAGO 734
Contextual Info: Modular I/O-System ETHERNET TCP/IP 750-342 Manual Technical description, installation and configuration Version 2.1.1 ii • General Copyright 2007 by WAGO Kontakttechnik GmbH & Co. KG All rights reserved. WAGO Kontakttechnik GmbH & Co. KG Hansastraße 27

snmp MIB WAGO

Abstract: codesys 2.3 Manual plc wiring home diagram wago codesys 2.3 Manual dali EN61131T2 750532 750-465 WAGO 281 WAGO-IO-PRO WAGO 733
Contextual Info: Modular I/O-System ETHERNET TCP/IP 750-841 Manual Technical description, installation and configuration Version 1.2.1 ii • General Copyright 2007 by WAGO Kontakttechnik GmbH & Co. KG All rights reserved. WAGO Kontakttechnik GmbH & Co. KG Hansastraße 27

Contextual Info: PACKAGING OF DIODE AND BRIDGE RECTIFIERS BEFORE PACKAGE PACKING CODE MP -B EA PER BOX 50 INNER BOX SIZE mm 203*205*57 CARTON SIZE (mm) 450*220*255 EA PER CARTON GROSS WEIGHT(Kg) 400 7.7 EA PER CARTON GROSS WEIGHT(Kg) AFTER PACKAGE PACKING CODE MP -B EA PER BOX

LOG TX2 1044

Abstract: MABAES0029 SL2150F 55758 TX2 1044 preamplifier 6 Channel
Contextual Info: SL2150F Front end power splitter with AGC Datasheet DS5535 ISSUE 1.6 Features • • RFOUT1B RFOUT1 NC# NC# NC# RFOUT2 RFOUT2B • • Ordering Information SL2150F/KG/LH2S tubes SL2150F/KG/LH2T (tape and reel) Single chip quadruple power splitter (primary