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L717HDC62PC309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L717HDC62POL2C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L717HDC62P
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L777HDC62PVF
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
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L777HRC62PVFM
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Amphenol Communications Solutions
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Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell+Grounding Dimplesl, 62 Pin, M3 Fixed Front Screwlock |
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